A glue filling method for a multilayer thin film sensor structure is disclosed herein. Two outer layers of a composite heat-resistant membrane are carved to have desired patterned holes; an inner layer is interposed between two outer layers to form a layered structure. The composite heat-resistant membrane is stuck onto the multilayer thin film sensor structure with the patterned holes aligned to an electric-conduction through-hole of the multilayer thin film sensor structure to form a filling region. A conductive glue is filled into the filling region. Sustained by the inner-layer heat-resistant membrane, the conductive glue protrudes from the patterned hole to cover a portion of the conductive metals on the surface of the multilayer thin film sensor structure. Thereby are simultaneously achieved a water-proof effect, an airtight effect and a fine interface compatibility.

An electrode with varying impedances includes a plurality of layers that are compressed together with varying compressions forces. A first compression force is used at the perimeter of the electrode and a second compression force is used towards the center of the electrode. The first compression force at the perimeter is lesser than the second compression force towards the center and creates a greater measured impedance at the perimeter of the electrode than at the center of the electrode.

A glue filling method for a multilayer thin film sensor structure is disclosed herein. Two outer layers of a composite heat-resistant membrane are carved to have desired patterned holes; an inner layer is interposed between two outer layers to form a layered structure. The composite heat-resistant membrane is stuck onto the multilayer thin film sensor structure with the patterned holes aligned to an electric-conduction through-hole of the multilayer thin film sensor structure to form a filling region. A conductive glue is filled into the filling region. Sustained by the inner-layer heat-resistant membrane, the conductive glue protrudes from the patterned hole to cover a portion of the conductive metals on the surface of the multilayer thin film sensor structure. Thereby are simultaneously achieved a water-proof effect, an airtight effect and a fine interface compatibility.

A wire embedding system and methods are presented. A wire is embedded in a substrate at predetermined locations in a series of sequential embedding instances using heat and pressure. The heat and pressure are removed from the wire in between the series of sequential embedding instances.

Electrofusion tape and method for the production thereof for welding together with plastics pipes in particular for use in a fixed-point fastening, consisting of a jacket element preferably of an electrically insulating plastics material, at least one heating element of electrically conductive plastics material and at least two contact elements for supplying electricity to the heating element, wherein the jacket element and the heating element take the form of tapes, wherein the jacket element surrounds the heating element at least in part, wherein the contact elements are arranged in the mutually opposing marginal regions of the heating element and extend parallel to one another along the heating element.

A method for forming a geomembrane liner testable for leaks by securing adjacent panels together with the conductivity of the lower surface of an overlying panel broken along a line adjacent the panel overlapping edge, and the overlapping edges sealed along the line. A heat welder has slots for the overlapping panel edges, with a heated wedge between the slots and having a projection to break the conductivity of the overlying panel bottom surface as it passes the wedge. The slots merge to press the liner edges together to heat weld them along the line of broken conductivity as the welder is moved along the panel edges.

The application relates to a plastic moulding for a moulding arrangement including a housing for another plastic moulding of the moulding arrangement, wherein the housing is formed within a moulding body of the plastic moulding including a weldable material in at least some areas. It is contemplated therein that a contact element is arranged on the moulding body, the contact element at least partly including an electrically conductive material and limiting a recess of the moulding body adjoining the housing in at least some areas. The application further relates to a moulding arrangement and a method for producing a moulding arrangement.

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.