The lid portion has a first body, a first rib protruding from the first surface of the first body and extending along the first surface, and the storage section has a second body, a second rib protruding from the second surface of the second body and extending along the second surface. The first and second ribs have main welded portions welded at intersections crossing each other, and the lid portion and/or the storage portion has main welded portions extending from one of the first and second ribs to the other between the main welded portions adjacent to each other. The lid portion and/or the storage section has an auxiliary rib extending from one of the first and second ribs to the other between the adjacent main welded portions, and the auxiliary rib has a sub-welded portion that is welded to the other at the intersection with the other.

A heat sealing apparatus includes: a first sealing unit and a second sealing unit which are provided to be capable of being opened and closed and perform a heat sealing process of a bag while nipping the bag in a state where the first sealing unit and the second sealing unit are arranged in a closed position with the bag positioned between the first sealing unit and the second sealing unit; and a heat shield member including a heat reflector which is provided to cover at least a part of the first sealing unit and the second sealing unit arranged in the closed position, at a position away from the first sealing unit and the second sealing unit.

A method of bonding a first object to a second object, including the steps of: providing a profile body having a first profile body portion; providing the first object, wherein the first object has thermoplastic material; providing the second object, wherein the profile body is separate from and attachable to the second object or wherein the second object includes the profile body; embedding the profile body in the first object such that the first profile body portion is within the thermoplastic material of the first object. Embedding the profile body in the first object is caused by mechanical energy impinging on the first object and/or on the second object while the first object and the second object are pressed against each other.

A heat sink for use in induction welding includes a number of tiles, where the tiles are electrically non-conductive and thermally conductive, a joint flexibly joining the tiles together, and a fluid path formed through the heat sink for communicating a coolant therethrough.

A system includes a film processing module, a processor, and memory. The processor and memory are in communication with the film processing module. The processor is configured to dynamically coordinate movement of the film processing module relative to a moving web of film and to perform a function on the web of film with the film processing module.

A tube seal apparatus including a sealing iron having a tube sealing end, an insulating shroud having a tube clamping end, wherein the sealing iron is at least partially disposed within the insulating shroud. The apparatus further includes an anvil having a cutting detail and a non-stick membrane disposed between the anvil and the tube clamping end of the insulating shroud. The sealing iron and insulating shroud are configured to advance towards a tube to be sealed positioned between the non-stick membrane and the anvil. The tube clamping end is configured to clamp the tube through the non-stick membrane. The sealing iron is configured to advance towards the tube to melt and seal the tube against the cutting detail through the non-stick membrane.

A bonding method for bonding an adherend with a high-frequency dielectric heating adhesive sheet is provided. The adherend includes a fluorine-containing surface at least containing fluorine on a surface thereof. The high-frequency dielectric heating adhesive sheet includes a high-frequency dielectric adhesive layer including a thermoplastic resin and a dielectric filler. A surface free energy of the high-frequency dielectric adhesive layer is in a range from 15 mJ/m.sup.2 to 30 mJ/m.sup.2. A melting point of the high-frequency dielectric adhesive layer is in a range from 110 degrees C. to 300 degrees C. The bonding method includes bringing the fluorine-containing surface of the adherend into contact with the high-frequency dielectric adhesive layer and applying a high-frequency wave to the high-frequency dielectric adhesive layer to bond the high-frequency dielectric heating adhesive sheet to the fluorine-containing surface.

A control circuitry (11) comprises an adjustable capacitor (C1), and a bias source (111) configured to apply a bias voltage (V2) to said adjustable capacitor (C1) to adjust a capacitance value of the adjustable capacitor (C1). Such a control circuitry may for example be part of a sealing device (1) to seal a medical tubing (2), the sealing device (1) comprising a receptacle (100) to receive said medical tubing (2), the receptacle (100) comprising an electrode arrangement for causing a heat action on the tubing (2).

A vibration measurement device measures vibration of at least one of the first sealing member and the second sealing member. A determination device determines quality of the sealing process according to a measurement result of the vibration measurement device from before the first sealing member and the second sealing member reach the closed position to after the first sealing member and the second sealing member reach the closed position. The sealing drive unit causes relative movement between the first sealing member and the second sealing member from an open position at a moving speed determined according to a type of the bag, to place the first sealing member and the second sealing member in the closed position.

A method is described for opening a heat bonded sterile connection that includes a skin of material blocking flow between the connection site. The method includes applying external pressure to the connection site.