A method for manufacturing a flexible metal-clad laminated plate includes the steps of: (a) obtaining a laminated body by laminating a polyimide resin film including a non-thermoplastic polyimide layer and an adhesive layer containing thermoplastic polyimide, the adhesive layer being provided on at least one side of the non-thermoplastic polyimide layer, and a metal foil; and (b) subjecting the laminated body obtained in the step (a) to heat treatment under an inert gas atmosphere and a pressure of 0.20 to 0.98 MPa at a temperature of a glass transition temperature Tg of the thermoplastic polyimide20 C. to the glass transition temperature Tg+50 C.

Various embodiments relate to plastic-metal junctions and methods of making the same via laser-assisted joining. The present invention provides a method of forming a junction between a metal form and a solid plastic. The method can include laser treating a surface of a metal form to generate a feature (e.g., a plurality of at least one of pores and grooves) in the surface of the metal, wherein the laser has an angle of incidence with the surface of the metal of other than 0 degrees. The method can include contacting the metal surface including the feature with a flowable resin composition. The method can include curing the flowable resin composition to form the solid plastic, to provide the junction between the metal form and the solid plastic.

A method for curing an adhesive composition includes: arranging an adhesive composition that transmits laser light of a first wavelength in contact with a surface of a first adherend that contains, at least at its surface, a first light-to-heat conversion material that generates heat by absorbing laser light of the first wavelength; and curing the adhesive composition by irradiating the adhesive composition and the first adherend with laser light of the first wavelength. In a method for manufacturing a bonded structure, a first bonded structure is manufactured by bonding the adhesive composition to the first adherend by using the method for curing an adhesive composition.

An electrochemical cell includes an electrode body which includes a positive electrode and a negative electrode and an outer package which is formed by overlapping a first member and a second member. The outer package includes: a housing portion which houses the electrode body; and a sealing portion which is formed along an outer circumference of the housing portion, by fusing and bending the first member and the second member, at a portion corresponding to the outer circumference of the housing portion.

A joining apparatus is an apparatus for performing joining of a joining target object including multiple members stacked on each other and a thermosetting adhesive arranged on joining target portions of the multiple members. The joining apparatus includes a first electrode; a second electrode; a pressurization mechanism configured to cause the first and second electrodes to pressure-contact the surface of the joining target object in the vicinity of the joining target portions; a power source configured to distribute power to between the first electrode and the second electrode; and a control unit configured to distribute the power to between both electrodes by the power source in a state in which the first electrode and the second electrode pressure-contact the surface by the pressurization mechanism, thereby performing joining of the joining target object by curing of the thermosetting adhesive by resistance heating generated at the joining target object.

A method for manufacturing a metal-clad laminate sheet containing (i) a thermoplastic liquid crystal polymer film comprising a thermoplastic polymer, and (ii) a metal foil bonded to at least one surface of the thermoplastic liquid crystal polymer film, the thermoplastic polymer being capable of forming an optically anisotropic molten phase, and the method containing: forming a laminate sheet having the thermoplastic liquid crystal polymer film and the metal foil bonded together; and heat treating the laminate sheet, wherein the heat treatment satisfies conditions (1) and (2): (1) wheat treatment temperature ranges between 1 C. inclusive and 50 C. exclusive higher than a melting point of the thermoplastic liquid crystal polymer film, and (2) a time for the heat treatment ranges from one second to 10 minutes.

A method for manufacturing a multilayer circuit board containing a single-sided metal-clad laminate sheet and a substrate laminated together, the single-sided metal-clad laminate sheet containing a thermoplastic liquid crystal polymer film and a metal foil bonded to a surface of the thermoplastic liquid crystal polymer film, and the method containing: forming a laminate sheet having the thermoplastic liquid crystal polymer film and the metal foil bonded together; and heat treating the laminate sheet, wherein the heat treatment satisfies conditions (1) and (2) to manufacture the single-sided metal-clad laminate sheet: (1) a heat treatment temperature ranges between 1 C. inclusive and 50 C. exclusive higher than a melting point of the thermoplastic liquid crystal polymer film, and (2) a time for the heat treatment ranges from one second to 10 minutes.

Provided are a metal clad laminate and a method for producing the same. The metal clad laminate at least includes a thermoplastic liquid crystal polymer film and a metal sheet bonded to each other, wherein the thermoplastic liquid crystal polymer film has a surface with a glossiness (20) of 55 or higher in accordance with JIS Z 8741 on the opposite side of the bonding surface to the metal sheet. The method for producing a metal clad laminate at least includes: providing a thermoplastic liquid crystal polymer film 2 and a metal sheet 6; and introducing the thermoplastic liquid crystal polymer film 2 and the metal sheet 6 between a pair of heating rolls so as to laminate them.

A bonding structure manufacturing method for manufacturing a bonding structure in which a first member and a second member are bonded is provided with: a step for forming a perforation with an opening in the surface of the first member and forming a protrusion that protrudes into the inner circumferential surface of the perforation; a step for disposing the region of the first member where the perforation is formed adjacent to the second member; and step for filling and curing the second member in the perforation of the first member by irradiating a laser on the region of the first member where the perforation is formed from the second member side.

A bonded structure is made of a first member and a second member which are bonded to each other. At least one bore having an opening is formed in a surface of the first member, and the second member is filled in the bore of the first member. The bore is defined by a diameter-increasing portion whose opening size increases in a depth direction from a surface side toward a bottom of the first member, and a first diameter-decreasing portion whose opening size decreases in the depth direction from the surface side toward the bottom. The diameter-increasing portion is formed on the surface side, and the first diameter-decreasing portion is formed on a bottom side.