The present invention relates to alternative methods of joining a solid part (1) and a polymer (2). The methods comprise attaching a primer layer (4) with a predetermined surface chemistry, density and thickness covalently to at least a part of a surface (3) of the solid part (1). Some embodiments of the invention further comprise polymerizing second molecules onto the primer layer (4) so that the surface (3) is at least partly covered with surface immobilized polymer brushes (8). The surface (3) of the solid part (1) is brought into contact with the polymer (2) and a predetermined temperature profile is applied resulting in covalent bonds (6) being established between the polymer (2) and the primer (4), and/or polymer brushes (8) melting or softening and entangling with melted or softened polymer (2) so that the solid part (1) and the polymer (2) remain joined after cooling. The obtained strength of the bonding between the solid part (1) and the polymer (2) is significantly higher than if the same materials are joined with conventional methods not comprising the establishment of a primer layer (4).

A polyimide laminated film containing a thermoplastic polyimide layer that includes a block (A) having a storage elastic modulus of 0.15 GPa or more at 380 C. and a block (B) having a storage elastic modulus of 0.10 GPa or less at 380 C. is used as a polyimide laminated film that has high peel strength and can suppress occurrence of a crack in an alkaline environment.

An adhesive (B) of solvent containing adhesive as a suspension of low viscosity is prepared by adding a solvent MIBK to a one-part epoxy adhesive of a dicyandiamide-curable type (A). Metal shaped articles (M1 to M5) as adherends are prepared each of which, through various surface treatment, has specific surface configuration of roughened face and/or ultrafine irregularities and the surface is entirely covered with a thin layer of ceramics such as a metal oxide or metal phosphate. The specified face of each metal shaped article (M1 to M5) is painted with the solvent containing adhesive (B). The faces painted with the adhesive of two metal shaped articles (M1 to M5) are caused to abut each other, the articles are heated to cure the one-epoxy adhesive to accomplish adhesion. With one of the adherends replaced by a CFRP shaped article (P2), a composite of a metal and CFRP can be formed.

An electrochemical cell includes an electrode body which includes a positive electrode and a negative electrode and an outer package which is formed by overlapping a first member and a second member. The outer package includes: a housing portion which houses the electrode body; and a sealing portion which is formed along an outer circumference of the housing portion, by fusing and bending the first member and the second member, at a portion corresponding to the outer circumference of the housing portion.

A method for manufacturing a metal-clad laminate sheet including forming a laminate sheet having the thermoplastic liquid crystal polymer film and the metal foil bonded together; and providing the laminate sheet with a heat treatment which satisfies conditions (1) and (2) below: (1) a heat treatment temperature ranges between 1 C. inclusive and 50 C. exclusive higher than a melting point of the thermoplastic liquid crystal polymer film. (2) a time for the heat treatment ranges from one second to 10 minutes.

An adhesive (B) of solvent containing adhesive as a suspension of low viscosity is prepared by adding a solvent MIBK to a one-part epoxy adhesive of a dicyandiamide-curable type (A). Metal shaped articles (M1 to M5) as adherends are prepared each of which, through various surface treatment, has specific surface configuration of roughened face and/or ultrafine irregularities and the surface is entirely covered with a thin layer of ceramics such as a metal oxide or metal phosphate. The specified face of each metal shaped article (M1 to M5) is painted with the solvent containing adhesive (B). The faces painted with the adhesive of two metal shaped articles (M1 to M5) are caused to abut each other, the articles are heated to cure the one-epoxy adhesive to accomplish adhesion. With one of the adherends replaced by a CFRP shaped article (P2), a composite of a metal and CFRP can be formed.

A bonding structure manufacturing method for manufacturing a bonding structure in which a first member and a second member are bonded is provided with: a step for forming a perforation with an opening in the surface of the first member and forming a protrusion that protrudes into the inner circumferential surface of the perforation; a step for disposing the region of the first member where the perforation is formed adjacent to the second member; and step for filling and curing the second member in the perforation of the first member by irradiating a laser on the region of the first member where the perforation is formed from the second member side.

A method for reinforcing joints between one or more components is presented. Adhesive is applied to joint areas of contact between the components and the components are stitched together at the joint areas to ensure that the joints are mechanically stable enough to withstand stresses such as pressurization and external manipulation.

A method is provided for welding a ball to another component. The method includes: providing a sonotrode which has a trough-shaped recess, in particular a spherical cap-shaped recess; pressing the ball against the other component by the sonotrode, the ball protruding into the trough-shaped recess; and vibrating the ball by the sonotrode such that material of the ball and/or material of the other component melts, and the ball is welded to the other component.

The invention concerns a process for producing a security film, comprising: forming a polymeric film substrate having first and second surfaces and comprising one or more migratory additives; plasma treating at least a part of at least one surface of the polymeric film substrate; and promptly contacting a foil with the at least one part of the plasma treated surface of the polymeric film substrate such that the foil adheres to the polymeric film substrate.