Patent classifications
B29C66/81455
Co-curing process for the joining of composite structures
A method of fabricating a composite assembly may include providing a first laminate and a second laminate respectively formed of first and second composite plies, and having a respective first and second cured section and a respective first and second uncured section. The method may further include interleaving the first composite plies in the first uncured section with the second composite plies in the second uncured section to form an interfacial region. The method may additionally include curing the interfacial region to join the first laminate to the second laminate and form a unitized composite assembly.
AN ADHESIVE ASSEMBLY METHOD AND AN ADHESIVE ASSEMBLY OBTAINED BY THE METHOD
A method of adhesively bonding a first substrate on a second substrate in an adhesive bonding zone by an adhesive joint integrating a support mesh, wherein surplus adhesive joint is folded over onto one or the other of the first or second substrates so that the support mesh is present over the entire adhesively bonded zone after curing.
Methods of internally insulating a fluted core sandwich structure
A method of partially insulating an interior space of a pre-formed fluted core panel is disclosed herein. The fluted core panel includes a first facesheet, a second facesheet spaced apart from the first facesheet, and webs between the first facesheet and second facesheet. The interior space is defined between the first facesheet, the second facesheet, and adjacent webs. The method includes positioning a spacer in a first portion of the interior space, positioning a membrane between the spacer and a second portion of the interior space, and positioning insulation in the second portion of the interior space. Additionally, the method includes pressing the membrane against the spacer, curing the membrane, and removing the spacer from the first portion of the interior space.
COMPOSITE STRUCTURE AND METHOD FOR MOLDING COMPOSITE STRUCTURE
This structure is provided with a first composite material 11, a second composite material 12 joined to the first composite material 11 by a film adhesive 21 provided between the first composite material 11 and the second composite material 12, and a corner fillet part 13 provided on a corner part 15 formed by the first composite material 11 and the second composite material 12. The shape of the corner fillet part 13 is a design shape P designed in advance, and the corner fillet part 13 is formed by curing the film adhesive 21 after arranging the film adhesive 21 on the corner part 15 so as to fit into the design shape P.
Tool and associated method for manufacturing the same
A method for manufacturing a tool including assembling a stack-up that includes a plurality of precured composite laminates, the stack-up having an engagement surface, wherein each precured composite laminate of the plurality of precured composite laminates is flexible, and wherein an adhesive is positioned between adjacent precured composite laminates of the plurality of precured composite laminates, and placing the engagement surface of the stack-up onto a target surface of a substrate.
Bonding device and method of bonding display device using the same
A bonding device includes an upper chamber a pad with which a display substrate is pressable to a substrate; a stage between a lower chamber and the pad and including an opening through which air is introduced; a molding member between an upper chamber and the pad and surrounding the pad and the opening; and a support member connected to the stage The display substrate disposed on the molding member disposes first and second portions of the display substrate overlapping the planar and bending portions of the substrate, respectively, the molding member presses the first portion to the planar portion, and air introduced through the opening, expands the molding member to press the second portion to the bending portion.
SUPPORT, BONDING DEVICE INCLUDING SUPPORT, AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME
A bonding device includes a first panel support, a second panel support disposed below the first panel support, a diaphragm disposed on and extending along the first panel support, the diaphragm being disposed between the first panel support and the second panel support, and a window fixing chuck disposed on the diaphragm, the window fixing chuck including a groove facing the diaphragm. A through-hole extends from the second panel support to the first panel support, and the diaphragm is disposed on the through-hole.
TRANSMISSION WELDING METHOD, TRANSMISSION WELDING DEVICE AND TRANSMISSION WELDING ARRANGEMENT
To achieve universal welding of thermoplastic workpiece parts with simple equipment, an infrared light transmission welding method is disclosed in which simple polychromatic, incoherent infrared light is generated by a simple infrared light source and is directed through a first workpiece part to a weld point for the purposes of connection to a second workpiece part. In particular, the infrared light is directed through a transparent bracing element.
Systems And Methods For Adhesive-Injected Patch Repair
In an example, a method is described. The method comprises placing a repair patch over a repair area of a structure, the repair patch comprising a repair-patch hole. The method also comprises sealing the repair patch and repair area with a vacuum bag having a seal ring around a periphery of the vacuum bag. The method also comprises evacuating, via an adhesive injection apparatus attached to the repair-patch hole and the seal ring of the vacuum bag, the repair area and an injection channel of the adhesive injection apparatus. The method also comprises forcing adhesive through the evacuated injection channel and into the evacuated repair area.
Systems and Methods for Joining a First Structure and a Second Structure with a Choreographed Adhesive De-Aeration Process
An example method of joining a first structure and a second structure is described that includes placing an adhesive within a bond cavity for bonding a first structure to a second structure, securing a vacuum bag to the first structure and the second structure so as to surround a portion of the first structure and the second structure, evacuating the bond cavity via a vacuum port to deaerate the adhesive within the bond cavity, after deaerating the adhesive, moving the first structure and the second structure relative to one another such that deaerated adhesive is disposed between the first structure and the second structure, and curing, via one or more heaters, the deaerated adhesive disposed between the first structure and the second structure to bond the first structure to the second structure.