The invention provides improvements to electrofusion fitting methods that allow for continuity and repeatability of welds between an electrofusion fitting and a pipe lining (or stand-alone pipe). An electrofusion fitting for joining sections of lined pipe has heating elements configured to create at least one weld between the electrofusion fitting and a pipe lining. However, prior to the weld step taking place the electrofusion fitting is heated and expands accordingly to ensure contact with the pipe lining. Preheating the electrofusion fitting also provides a predetermined starting temperature for the fitting and the lining which results in improved fusion cycle reliability. Furthermore, the need for clamps or support frames to support the electrofusion fitting in situ is removed, with corresponding reductions in cycle times, complexity, and hence cost.

A joint between an insulative sidewall of a medical electrical lead subassembly and an underlying fluoropolymer layer includes an interfacial layer. A first section of the interfacial layer is bonded to the fluoropolymer layer and is formed by a thermoplastic fluoropolymer; a second section of the interfacial layer extends adjacent the first section and is bonded to the insulative sidewall. The insulative sidewall, of the subassembly, and the second section, of the interfacial layer, are each formed from a material that is not a fluoropolymer. A recess is formed in the first section of the interfacial layer and the second section of the interfacial layer extends within the recess.

A metal-resin joining device joins a thermoplastic resin plate (12) to a metal plate (13) by melting the resin plate (12) in contact with the metal plate (13) through heating an exposed face of the metal plate (13) by one-sided resistive heating. The metal-resin joining device has a center electrode (24a) that is brought in contact with the metal plate (13) and a peripheral electrode (24b) that is brought in contact with the metal plate (13) to annularly surround the center electrode (24a) and to which a current flows from the center electrode (24a) via the metal plate (13), wherein the peripheral electrode (24b) is made of a metal material having a higher electrical resistance than the center electrode (24a).

A yarn or thread may include a plurality of substantially aligned filaments, with at least ninety-five percent of a material of the filaments being a thermoplastic polymer material. Various woven textiles and knitted textiles may be formed from the yarn or thread. The woven textiles or knitted textiles may be thermal bonded to other elements to form seams. A strand that is at least partially formed from a thermoplastic polymer material may extend through the seam, and the strand may be thermal bonded at the seam. The woven textiles or knitted textiles may be shaped or molded, incorporated into products, and recycled to form other products.

Methods of producing polymer-metal hybrid components that are bonded by CO-M bonds at the interface using at least one of the hot pressing, rolling, and injection molding methods to create chemical bond formation conditions at the polymer and metal interface. When the thermal cycle and compressive pressure specified herein is combinationally created at the polymer and metal interfaced, strong CO-M bonds forms at the interface and strongly bonds the metal and polymer together through the reaction carbonyl groups (CO) in polymer and the metal surface. For polymers lacking enough carbonyl groups, new functional groups can be in-situ generation through introducing distributed air pockets at the polymer-metal interface for forming 3-dimensional distributed CO-M bonds at the interface.

Thermally laminated foam boards, methods for making thermally laminated foam boards, apparatus for making thermally laminated foam boards, smaller foam pieces made from thermally laminated foam boards, methods for making smaller foam pieces from thermally laminated foam boards, parts made from thermally laminated foam boards, methods for making parts from thermally laminated foam boards, and tools for making parts from thermally laminated foam boards are disclosed. The thermally laminated foam boards are made by thermally bonding at least two polystyrene boards together.

A metal-resin joining device joins a thermoplastic resin plate (12) to a metal plate (13) by melting the resin plate (12) in contact with the metal plate (13) through heating an exposed face of the metal plate (13) by one-sided resistive heating. The metal-resin joining device has a center electrode (24a) that is brought in contact with the metal plate (13) and a peripheral electrode (24b) that is brought in contact with the metal plate (13) to annularly surround the center electrode (24a) and to which a current flows from the center electrode (24a) via the metal plate (13), wherein the peripheral electrode (24b) is made of a metal material having a higher electrical resistance than the center electrode (24a).

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip. In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

Provided are circuit board excellent in interlayer adhesion and solder heat resistance, and production method thereof. The circuit board is produced by a method including: preparing a plurality of at least one kind of thermoplastic liquid crystal polymer (TLCP) films, forming a conductor layer on one side or both sides of a film in at least one of the films to obtain a unit circuit board, laminating the films containing the unit circuit board to obtain a stacked material, conducting thermo-compression-bonding of the stacked material under pressurization to a first temperature giving an interlayer adhesion to integrate the stacked material, carrying out structure-controlling thermal treatment by heating the integrated stacked material at a second temperature which is lower than the first temperature and is lower than a melting point of a TLCP having a lowest melting point out of the plurality of TLCP films.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.

In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.