[Object] To provide a tube joining device in which the degree of freedom of device design is improved.

[Solving Means] A tube joining device 1 includes a delivery mechanism 500. The delivery mechanism includes a first pusher member 542 that is provided to perform forward movement and backward movement along a delivery direction and delivers a wafer WF to a first position PS2 that is set between a take-out position PS1 at which the wafer WF is taken out from a cassette WC and a stand-by position PS3, and a second pusher member 543 that is provided to perform forward movement and backward movement along the delivery direction in combination with the first pusher member, and delivers the wafer from the first position to the stand-by position. An operation of delivering the wafer by the first pusher member is capable of being switched to an operation of delivering the wafer by the second pusher member in synchronization with forward movement and backward movement of the first pusher member and the second pusher member.

[Object] Provided is a tube joining device which is capable of preventing occurrence of a joining failure caused by a setting error of tubes in advance, and in which tube holding and release of the holding are realized by a simple device configuration.

[Solving Means] A tube joining device 1 includes: a first tube holding portion 160 that is capable of holding a first tube T1; a second tube holding portion 230 that is capable of holding a second tube T2; a tube superimposing portion 30 that disposes the first tube and the second tube in a superimposed manner; and a switching mechanism 240 that is capable of switching holding of the second tube by the second tube holding portion and release of the holding. The switching mechanism applies a biasing force for maintaining a state in which the second tube is held to the second tube holding portion, and applies a biasing force for maintaining a state in which the holding of the second tube is released to the second tube holding portion in accordance with relative approaching of the tube holding portions.

A method for bonding composite substrates includes coupling a first co-cure prepreg layer having a first off-set amine to epoxide molar ratio onto a surface of a first composite substrate and coupling a second co-cure prepreg layer having a second off-set amine to epoxide molar ratio onto a surface of a second composite substrate. The first and second composite substrates are cured to the first and second co-cure prepreg layers, respectively, using a first cure cycle (including B-stage and cure temperatures) to form a first and a second co-cure prepreg layer portion. The method further includes coupling the first co-cure prepreg layer portion to the second co-cure prepreg layer portion and applying a second cure cycle to cure the first co-cure prepreg layer portion of the first composite substrate to the second co-cure prepreg layer portion of the second composite substrate to form a monolithic covalently bonded composite structure.

The invention provides improvements to electrofusion fitting methods that allow for continuity and repeatability of welds between an electrofusion fitting and a pipe lining (or stand-alone pipe). An electrofusion fitting for joining sections of lined pipe has heating elements configured to create at least one weld between the electrofusion fitting and a pipe lining. However, prior to the weld step taking place the electrofusion fitting is heated and expands accordingly to ensure contact with the pipe lining. Preheating the electrofusion fitting also provides a predetermined starting temperature for the fitting and the lining which results in improved fusion cycle reliability. Furthermore, the need for clamps or support frames to support the electrofusion fitting in situ is removed, with corresponding reductions in cycle times, complexity, and hence cost.

Thermally laminated foam boards, methods for making thermally laminated foam boards, apparatus for making thermally laminated foam boards, smaller foam pieces made from thermally laminated foam boards, methods for making smaller foam pieces from thermally laminated foam boards, parts made from thermally laminated foam boards, methods for making parts from thermally laminated foam boards, and tools for making parts from thermally laminated foam boards are disclosed. The thermally laminated foam boards are made by thermally bonding at least two polystyrene boards together.

There are provided a metal-resin joint having high bonding strength and a manufacturing method thereof. A metal-resin joint 10 of the present disclosure includes an anchor portion 34 provided on a metal bonding surface 32 of a metal member 30. The anchor portion 34 has a pair of protrusion strips 35 and 35 protruding from the metal bonding surface 32 with a gap, a recessed groove 36 provided between the pair of protrusion strips 35 and 35, and a plurality of partitions 37 protruding from a groove bottom of the recessed groove 36. The plurality of partitions 37 are provided to be inclined toward one side Y1 in a direction in which the pair of protrusion strips 35 and 35 extend as going toward a distal end side, and to be side by side in a direction Y in which the pair of protrusion strips 35 and 35 extend.

Devices and methods for producing sandwich composite materials having at least one layer of plastic disposed between at least two outer metallic covering layers may comprise providing at least two semifinished products coated with plastic on one side, activating at least one of the plastic-coated sides of the metallic covering layers directly from the side of the covering layer having the plastic-coating, and connecting the plastic-coated sides of the metallic covering layers to form the sandwich composite material. The activation of the plastic may be performed by way of a heat source that utilizes an activation medium, radiation, or plasma, for example.

A resin film laminated on a support film is attached to the surface of a substrate having a pattern of unevenness. Firstly, the substrate is placed on a stage with the surface side up. Secondly, the resin film is placed so as to face the surface of the substrate and the surface is scanned with a roller while the resin film is pressed against the surface from the side of the support film to bring them into contact with each other. Surface temperatures of the stage and the roller are set to form a temperature gradient such that the temperature of the surface of the resin film to be attached to the surface of the substrate becomes not lower than the softening temperature of the resin film and the temperature of the surface of the support film side becomes lower than the softening temperature of the resin film.

A method for bonding composite structures which includes providing a first and second composite substrate and coupling a co-cure prepreg tape having chemically protected polymerizable functional groups onto a surface of both the first and second composite substrates. The first and second composite substrates are then cured to the co-cure prepreg tape at a first temperature to form a co-cure prepreg tape portion where the first and second composite substrates are fully cured and the co-cure prepreg tape is partially cured. The co-cure prepreg tape portion of the first composite substrate is then coupled to the co-cure prepreg tape portion of the second composite substrate and a deprotection initiator is applied to facilitate deprotection of the chemically protected polymerizable functional groups and cure the co-cure prepreg tape portion of the first and second composite substrates to form a single covalently bonded composite structure.

One example method for producing a component from organic sheets may comprise placing a first organic sheet and a second organic sheet next to one another to form a component preform, forming at least one overlapping joining zone by tacking the first and second organic sheets together with a connecting part in the form of a third organic sheet, transferring the component preform to a joining tool, using the joining tool to form a joined component by connecting the organic sheets through melting and compression in the overlapping joining zone, and consolidating the joined component at least in the zone of the overlapping joining zone.