An apparatus and method for joining pipes includes a plate for melting mating surfaces of the pipes to be joined. Additionally, the apparatus utilizes a vacuum in order to push the first and second pipes together in lieu of hand or mechanical pressure which may be inconsistent. Additionally, the vacuum allows the pipes to be joined to settle on each other in order to create a pressure about a periphery of the end of the pipe being joined to the other pipe. The consistent pressure creates a very strong joint between the first and second pipes.

A connection element includes a composite component with a cured epoxy resin, a first layer including a first thermoplastic polymer and an intermediate layer arranged between the composite component and the first layer, the first layer containing both the cured epoxy resin of the composite component and the first thermoplastic polymer of the first layer. The first thermoplastic polymer has a melting point above a curing temperature of the epoxy resin and is soluble at a temperature of at least 150 C. in the epoxy resin used for producing the composite component.

The present disclosure provides a process. In an embodiment, the process includes (A) providing a fitment with a base having a wall thickness (T.sub.w). The base comprises an ethylene/a olefin multi-block copolymer. The process includes (B) placing the base between two opposing multilayer films. Each multilayer film has a respective seal layer comprising an olefin-based polymer. The process includes (C) positioning the base and opposing multilayer films between opposing seal bars. Each seal bar comprises (i) a front surface, (ii) a recessed surface a distance (x) behind the front surface, the recessed surface having a first end and an opposing second end. Each seal bar comprises (iii) a curved surface at each opposing end. The curved surface extends between the front surface and the recessed surface. Each curved surface has a radius of curvature (Rc) greater than or equal to distance (x). The process includes (D) heat sealing the base to each multilayer film.

A microchannel heat exchanger (800) is manufactured by bonding a first sheet (802a) of material and a second sheet (802b) of material in a first connection pattern for integral formation of a core portion (801) and a manifold portion (808) for the first and second sheets (802a, 802b) of material. A third sheet (802c) of material is then superposed on to the second sheet (802b) of material and bonded in a second connection pattern to the second sheet of material for integral formation of the core portion (801) and the manifold portion (808) for the second and third sheets (802b, 802c) of material. The second and third sheets (802b, 802c) of material are bonded without bonding the second sheet (802b) of the material to the first sheet (802a) of material. The core portion (801) and the manifold portion (808) of the heat exchanger (800) are thus integrally created. The interstices between the first, second, and third sheets (802a, 802b, 802c) of material are then expanded to create fluid flow channels (806). This method can also be used to create a heat sink. The bonding method may be a form of laser welding where an opaque sheet absorbs the laser energy and the heat conducts through the top sheet to the sheet immediately below, but does not cause bonding with subsequent sheets below.

A pipe fusion data management system, including: a data receiving interface for receiving data directly or indirectly from at least one remote source, the data including at least one data field representing at least one of the following: fusion data, pipe data, parameter data, operation data, configuration data, condition data, measurement data, entity data, user data, or any combination thereof; an input for facilitating user input; a storage device for storing received and/or input data; and a processor for generating a visual user interface to display received, input, stored, and/or processed data relating to the fusion, joining and/or installation process.

A method for bonding composite structures which includes providing a first and second composite substrate and coupling a co-cure prepreg tape having chemically protected polymerizable functional groups onto a surface of both the first and second composite substrates. The first and second composite substrates are then cured to the co-cure prepreg tape at a first temperature to form a co-cure prepreg tape portion where the first and second composite substrates are fully cured and the co-cure prepreg tape is partially cured. The co-cure prepreg tape portion of the first composite substrate is then coupled to the co-cure prepreg tape portion of the second composite substrate and a deprotection initiator is applied to facilitate deprotection of the chemically protected polymerizable functional groups and cure the co-cure prepreg tape portion of the first and second composite substrates to form a single covalently bonded composite structure.

An array of resilient floor tiles is assembled into a continuous sheet after being laid down. An array of included, sacrificial resistive wires is buried along the edges of the tiles and is controllably heated in order to cause welding of the edges of tiles across the paths of the wires to neighboring tiles. Subsequently the wires may be used to give the array integral tensile strength. The welded array is provided with greater strength for resisting use, expansive and contractile forces caused by environmental heat and cold and also long-term tile contraction owing to loss of plasticizer as may be seen with PVC-based tiles.

An induction heating tool that holds voltage or current supplied to the induction tank circuit constant and tracks changes in the other of voltage or current during each induction heating cycle. The disclosed induction heating tool exploits the fact that the resistance an attachment plate increases along with the temperature of the attachment plate. During an induction heating cycle, the attachment plate is magnetically coupled to a work coil and the resistance of the attachment plate is reflected to the circuit. Changes in the resistance of the attachment plate alter the pattern of energy delivery from the work coil to the attachment plate in a predictable way. Calculations accurately predict the temperature of the attachment plate over a wide variety of ambient conditions, including the presence of moisture at the membrane/attachment plate interface. The disclosed induction heating tool produces consistent results without calibration for ambient conditions.

An apparatus and method for joining pipes includes a plate for melting mating surfaces of the pipes to be joined. Additionally, the apparatus utilizes a vacuum in order to push the first and second pipes together in lieu of hand or mechanical pressure which may be inconsistent. Additionally, the vacuum allows the pipes to be joined to settle on each other in order to create a pressure about a periphery of the end of the pipe being joined to the other pipe. The consistent pressure creates a very strong joint between the first and second pipes.

An apparatus and method for joining pipes includes a plate for melting mating surfaces of the pipes to be joined. Additionally, the apparatus utilizes a vacuum in order to push the first and second pipes together in lieu of hand or mechanical pressure which may be inconsistent. Additionally, the vacuum allows the pipes to be joined to settle on each other in order to create a pressure about a periphery of the end of the pipe being joined to the other pipe. The consistent pressure creates a very strong joint between the first and second pipes.