Process for encapsulation of a microelectronic device comprising the following steps in sequence: supply a support substrate comprising a first principal face on which a microelectronic device is placed, a second principal face, and a lateral face, deposit a bonding layer on the first principal face of the substrate, position an encapsulation cover comprising a first principal face, a second principal face, and a lateral face, on the bonding layer, deposit a lateral protection layer on: the lateral face and the periphery of the second principal face of the support substrate, the lateral face and the periphery of the second principal face of the encapsulation cover, the lateral protection layer delimiting a protected zone, thinning of the second principal face of the support substrate and/or the second principal face of the encapsulation cover outside the protected zone.

Novel multilayer laminates and lamination methods useful for the production of safety glass are disclosed in which an interlayer is provided between substrates and a porous sealant material is provided in a strip around the perimeter of the interlayer and at least partially in-between the substrates adjacent the interlayer. The space between the substrates is evacuated or de-aired through the porous sealant. The porous sealant is then made into a non-porous, continuous perimeter seal by pressing at or near room temperature or at a moderately elevated temperature to remove pores or gaps. The laminate is further processed at higher elevated temperatures either at or near atmospheric pressure or at elevated pressure to increase the bonding between the interlayer and the substrates and to eliminate most or all of the initial texture on the surfaces of the interlayer.

A laminated glazing includes two sheets of glass and a polymer interlayer positioned between them. The first sheet of glass is thicker than the second sheet of glass the thickness of which is less than 1.2 mm. The edge of the second sheet of glass is recessed with respect to the edge of the first sheet of glass over all or part of the periphery of the glazing, thereby making it possible to protect the more fragile second sheet of glass from mechanical knocks against the edge face of the glazing.

The invention relates to a glazed module comprising a metal framework and an insulating glazing comprising a water-tight barrier, said insulating glazing being cold-bent, the metal framework and the insulating glazing being rendered integral by a holding means which forces the insulating glazing to retain the bent shape conferred on it by the framework. The invention also relates to a process for the preparation of the glazed module comprising a metal framework and an insulating glazing, the insulating glazing being cold-bent, after it has been assembled with a water-tight barrier, by a force which causes it to take the shape of the metal framework and then held in this bent shape by a holding means.

Certain aspects pertain to methods of fabricating an optical device on a substantially transparent substrate that include a pre-deposition operation that removes a width of lower conductor layer at a distance from the outer edge of the substrate to form a pad at the outer edge. The pad and any deposited layers of the optical device may be removed in a post edge deletion operation.

Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.

A laminated, bent, safety glass panel (30) for architectural or interior uses and a method of manufacturing such panels. The panel comprises a single heat-treated bent glass sheet, fully-tempered or heat-strengthened, forming a substrate (32) encapsulated by at least one thin, chemically-strengthened, glass veneer sheet (38). The veneer sheet (38), an alkali-aluminosilicate or other alkali-containing glass recipe strengthened by ion-exchange treatment, is cold-bent over a polymer interlayer (40) and permanently laminated to form a protective barrier on the heat-treated glass that dampens the explosive release of its internal residual stresses in the event of breakage thereby preventing particles dislodging and subsequent disintegration. The vulnerable perimeter (37) and perforation (45) edges of the veneer sheet (38) are equal in size or inset to the edges of the heat-treated substrate (32) with its deeper robust compressive stresses. Veneers may be laminated to both major substrate surfaces.

Methods of manufacturing electrochromic windows are described. An electrochromic device is fabricated to substantially cover a glass sheet, for example float glass, and a cutting pattern is defined based on one or more low-defectivity areas in the device from which one or more electrochromic panes are cut. Laser scribes and/or bus bars may be added prior to cutting the panes or after. Edge deletion can also be performed prior to or after cutting the electrochromic panes from the glass sheet. Insulated glass units (IGUs) are fabricated from the electrochromic panes and optionally one or more of the panes of the IGU are strengthened.

Certain aspects pertain to methods of fabricating an optical device on a substantially transparent substrate that include a pre-deposition operation that removes a width of lower conductor layer at a distance from the outer edge of the substrate to form a pad at the outer edge. The pad and any deposited layers of the optical device may be removed in a post edge deletion operation.

An apparatus and a method for trimming a module are disclosed. In and embodiment the method includes fixing a rear transverse side of module, guiding the rear cutting head along the rear transverse side thereby cutting off a rear overlapping portion of the overlapping film and releasing the rear transverse. The method further includes moving the module into a region of two longitudinal cutting devices, fixing the module on both longitudinal sides, guiding longitudinal cutting heads along the longitudinal sides thereby cutting off longitudinally overlapping film portions on both longitudinal sides, and releasing the longitudinal sides of the module. The method furthermore includes moving the module into a region of the front cutting device, fixing a front transverse side of the module, guiding a front cutting head along the front transverse side thereby cutting off a front overlapping portion of the overlapping film.