A liquid ejection head includes a liquid channel through which a first liquid and a second liquid flow, a pressure generation element that pressurizes the first liquid and an ejection orifice through which to eject the second liquid in a direction crossing a direction of the flow of the first liquid and the second liquid via the pressurization. A distance in the direction of the flow from a position in the liquid channel at which the first liquid and the second liquid merge to the ejection orifice is greater than an interface stabilization distance in the direction of the flow from a position at which the first liquid and the second liquid contact each other to a position at which a stable interface is obtained between the first liquid and the second liquid.

A fluidic die includes a fluid channel layer including at least one fluid channel defined along a length of the fluid ejection device. The fluidic die also includes an interposer layer coupled to the fluid channel layer. The interposer layer includes a number of inlet ports defined in the interposer layer to fluidically couple the at least one channel layer to a fluid source, and a number of outlet ports defined in the interposer layer to fluidically couple the at least one channel layer to the fluid source.

An integrated circuit to drive a plurality of fluid actuation devices includes a plurality of first data lines, a second data line, a first memory element, and a second memory element. The first memory element is enabled in response to first data on the plurality of first data lines. The second memory element is enabled in response to second data on the second data line.

A method of forming a print head, by forming a heater chip. Via zones having peripheries are defined on a substrate, with heaters formed along the entire peripheries of the via zones. Traces that electrically connect to each of the heaters are formed. In some embodiments, the heater chip is then stored for a period of time. After storing the heater chip, vias are formed in only a selected portion of the via zones, which is a subset of the via zones. A channel layer is formed on the heater chip by forming a first layer on the heater chip. Flow channels are formed in the first layer from the vias to only those heaters on the heater chip that are disposed along the selected portion of the via zones. Bubble chambers are formed in the first layer around only those heaters on the heater chip that are disposed along the selected portion of the via zones. A nozzle plate in formed on the channel layer by forming a second layer on the first layer, and forming nozzles in the second layer above only those heaters on the heater chip that are disposed along the selected portion of the via zones.

At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.

An example device includes a first substrate including a first array of droplet ejectors to eject droplets of a first fluid. The example device further includes a first target medium immovably positioned relative to the first substrate to receive droplets of the first fluid from a first subset of droplet ejectors of the first array of droplet ejectors. A second subset of droplet ejectors of the first array of droplet ejectors is positioned to eject droplets of the first fluid to miss the first target medium.

A liquid ejecting head includes a nozzle configured to eject ink, a filter chamber accommodating a filter, and a nozzle introduction port through which the ink flows out of the filter chamber. The filter chamber includes a first side and a second side that extend toward the nozzle introduction port in plan view in a direction perpendicular to the filter, and the nozzle introduction port is elongated along the first side in plan view in the direction perpendicular to the filter.

An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten μm and two hundred μm, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.

An example device includes a droplet ejector including a nozzle to eject droplets of a fluid and a target medium to receive the droplets of the fluid. The target medium is separated from the droplet ejector by a gap to be traversed by the droplets. The example device further includes a frame affixing the target medium to the droplet ejector. The target medium is immovably held with respect to the droplet ejector.

An example device includes a first substrate including a first array of droplet ejectors to eject droplets of a first fluid. The example device further includes a first target medium immovably positioned relative to the first substrate to receive droplets of the first fluid from a first subset of droplet ejectors of the first array of droplet ejectors. A second subset of droplet ejectors of the first array of droplet ejectors is positioned to eject droplets of the first fluid to miss the first target medium.