MEMS devices and methods of fabrication thereof are described. In one embodiment, the MEMS device includes a bottom alloy layer disposed over a substrate. An inner material layer is disposed on the bottom alloy layer, and a top alloy layer is disposed on the inner material layer, the top and bottom alloy layers including an alloy of at least two metals, wherein the inner material layer includes the alloy and nitrogen. The top alloy layer, the inner material layer, and the bottom alloy layer form a MEMS feature.

A printing method includes selecting a dye sublimation ink, having: a disperse dye colorant dispersion; a primary solvent selected from the group consisting of glycerol, ethoxylated glycerol, 2-methyl-1,3-propanediol, dipropylene glycol, and combinations thereof; a surfactant selected from the group consisting of nonionic surfactants, anionic surfactants, and combinations thereof; an additive selected from the group consisting of a buffer, a biocide, a chelating agent, and combinations thereof; and a balance of water. An operating energy that includes a margin over a turn-on energy (TOE) for a thermal inkjet printhead is applied to a heating resistor of the printhead, wherein the margin ranges from about 10% to about 25% over the TOE. The dye sublimation ink is printed from the thermal inkjet printhead i) directly onto a textile substrate, or ii) onto a transfer medium to form an image thereon; and the image is transferred onto the textile substrate.

A liquid ejection head includes an ejection orifice for ejecting a liquid; a flow path in which an energy generating element is disposed, generates an energy to be used for ejecting the liquid; a liquid inside the flow path; an ejection orifice part that allows the ejection orifice and the flow path to communicate with each other; a supply flow path for supplying the liquid from the outside; and a recovery flow path for recovering the liquid to the outside. The moisture content of the liquid is 65 wt % or less. The liquid inside the flow path is circulated between the inside and the outside of the flow path.

There is provided a head unit including: head modules; a plurality of first tubes; and a plurality of second tubes. Each of the head modules includes: energy-applying mechanisms; supply buffer chambers; and return buffer chambers. The supply buffer chambers of the plurality of head module are connected in series via the plurality of first tubes. The return buffer chambers of the plurality of head modules are connected in series via the plurality of second tubes.

In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.

An integrated circuit to drive a plurality of fluid actuation devices includes a plurality of first data lines, a second data line, a first memory element, and a second memory element. The first memory element is enabled in response to first data on the plurality of first data lines. The second memory element is enabled in response to second data on the second data line.

A liquid ejecting head including: a first liquid ejecting portion including a first liquid storage chamber storing a liquid and a first nozzle; a second liquid ejecting portion including a second liquid storage chamber storing the liquid and a second nozzle; and a flow path structure being formed by stacking substrates and including a distribution flow path that supplies the liquid to the first liquid storage chamber and the second liquid storage chamber. The distribution flow path includes a common flow path through which the liquid flows, a supply flow path that supplies the liquid to the common flow path, a collection flow path that collects the liquid from the common flow path, a first communication flow path communicating the common flow path with the first liquid storage chamber, and a second communication flow path communicating the common flow path with the second liquid storage chamber.

A method for forming a fluid flow structure may include positioning rows of micro devices in a mold, wherein each of the micro devices comprising a chamber layer in which an ejection chamber is formed and an orifice layer over the chamber layer in which an orifice is formed. The method may further include molding an amorphous body to encapsulate the rows of the micro devices such that the amorphous body forms fluid channels such that each of the rows is fluidically coupled to a different one of the fluid channels.

A micro-structure transfer system may include a printhead and a pressure control device to control a pressure of fluid coupled with the printhead. The pressure control device forms a meniscus of fluid at a number of nozzles defined within the printhead to pick up a number of micro-structures. A printhead for transferring micro-structures includes a number of fluid chambers, a number of nozzles defined in an orifice plate through which fluid may exit the chambers, and a pressure control device to control a pressure of fluid within each of the chambers. The pressure control device forms a meniscus of the fluid at a number of nozzles defined within the printhead to pick up a number of micro-structures.

An inkjet printing apparatus includes a discharge head including orifices that discharge ink, a channel communicating with the orifices, a heating element that generates thermal energy for discharging the ink in the channel, a protection layer having a surface exposed to the channel and covering the heating element, and an electrode having a surface exposed to the channel; a tank that stores the ink to be supplied to the discharge head; an ink circulation unit that performs a circulation operation of circulating the ink between the discharge head and the tank; and a kogation removal unit that performs a removal operation of removing kogation generated around the heating element by applying a voltage between the protection layer and the electrode. The kogation removal unit performs the removal operation after the circulation operation is stopped.