In one example, a process for making a micro device structure includes molding a micro device in a monolithic body of material and forming a fluid flow passage in the body through which fluid can pass directly to the micro device.

A nozzle plate for a droplet ejection head, the nozzle plate comprising a first row of nozzles arranged to deposit droplets onto a deposition media; wherein the first row of nozzles extends in a row direction and comprises two or more nozzle clusters, each nozzle cluster being arranged along the row direction for a cluster length c, and extending along a cluster depth direction perpendicular to the row direction by a cluster depth d; wherein each nozzle cluster comprises a plurality of nozzles of which one or more nozzles within each nozzle cluster define the cluster length c and two or more nozzles within each nozzle cluster define the cluster depth d; wherein each nozzle cluster is spaced apart from an adjacent nozzle cluster along the row direction by a cluster spacing a such that an air flow path is created for forced air to pass through the row of nozzles in a controlled manner; and wherein, when the first row is projected in a transverse direction onto the row direction, a transition region between adjacent nozzle clusters comprises two or more nozzles from a first cluster and two or more nozzles from a second cluster, the second cluster being adjacent to the first cluster, and the nozzles in the transition region being equidistantly spaced from one another by a projected nozzle spacing.

One or more embodiments are directed to a microfluidic assembly that includes an interconnect substrate coupled to a microfluidic die. In one embodiment, the microfluidic die includes a ledge with a plurality of bond pads. The microfluidic assembly further includes an interconnect substrate having an end resting on the ledge proximate the bond pads. In another embodiment, the interconnect substrate abuts a side surface of the ledge or is located proximate the ledge. Conductive elements couple the microfluidic die to contacts of the interconnect substrate. Encapsulant is located over the conductive elements, the bond pads, the contacts.

A liquid ejecting head unit includes: a plurality of liquid ejecting heads that have a nozzle-formed surface; and a unit base that has a bottom portion having a fixing surface to which the plurality of liquid ejecting heads are fixed, and a wall portion which extends from the bottom portion in a direction perpendicular to the fixing surface and which is continuous in a direction in which the plurality of liquid ejecting heads are aligned.

A liquid discharge head includes a head body, a wiring member, a connector, and a protector. The head body discharges liquid. The wiring member transmits a signal to the head body. The connector is disposed at the wiring member to connect the wiring member to the head body. The protector covers the head body and the connector. The head body includes a fitting portion. The protector includes a fitting portion to fit the fitting portion of the head body in a fitting direction. The connector is disposed more backward than a leading end of the fitting portion of the protector in the fitting direction.

A liquid ejecting head includes: a head main body for ejecting liquid from nozzle openings on a liquid ejecting surface provided with the plurality of nozzle openings; a maintaining member which is adhered to the head main body at a surface side opposite to the liquid ejecting surface side of the head main body in a direction perpendicular to the liquid ejecting surface; and a fixing board which is provided at a side opposite to the maintaining member with respect to the head main body. The fixing board includes a bending portion which is bent to the head main body side. The bending portion is adhered to a side surface of the maintaining member. The head main body is disposed in a space formed by adhering the maintaining member and the fixing board to each other.

A liquid discharge head is provided which has a substrate, a flow channel forming member provided on a substrate surface of the substrate and forming a flow channel of a liquid, and a discharge port forming member provided on the flow channel forming member and having a discharge port through which a liquid is discharged, wherein the discharge port forming member and the flow channel forming member are formed of materials different from each other, a thickness of the flow channel forming member is greater than a thickness of the discharge port forming member in a direction perpendicular to the substrate surface, the discharge port forming member is a cured product of a photosensitive resin composition, and the flow channel forming member contains at least one resin selected from the group consisting of a polyether amide resin, a polyether imide resin and a polyether amide-imide resin.

In one example, a multi-part flow structure with multiple flow passages includes a first part sandwiched between a second part and a third part, the parts joined together with adhesive along bonding surfaces surrounding the flow passages where each of the bonding surfaces on one part is symmetrical to and diverges from a corresponding one of the bonding surfaces on another part.

To apply an anti-wetting coating to a substrate of a semiconductor material, a method includes applying to a support a solution of a hydrocarbon comprising at least one unsaturated bond and, optionally, at least one hetero-atom for obtaining a layer of hydrocarbons. The method also includes treating at least one surface of the substrate of the semiconductor material with an acid. The layer of hydrocarbons is transferred from the support to the surface of the substrate of the semiconductor material. The layer of hydrocarbons is chemically coupled with the surface of the substrate of the semiconductor material.

An inkjet ink includes: (i) a disazo dye of formula (I): ##STR00001##
(ii) a glycol compound selected from the group consisting of: triethylene glycol, tetraethylene glycol and pentaethylene glycol; and (iv) water.