A liquid ejecting head includes: a sealing substrate provided in such a way as to cover the first piezoelectric element and the second piezoelectric element; a wiring board configured to apply a voltage to a common electrode, a first individual electrode, and a second individual electrode; a first wiring portion provided above the pressure chamber substrate and configured to electrically couple the common electrode to the wiring board; a second wiring portion provided at a lower surface of the sealing substrate and configured to electrically couple the common electrode to the wiring board; and a third wiring portion provided between the first piezoelectric element and the second piezoelectric element and configured to electrically couple the first wiring portion to the second wiring portion.

A liquid discharge head includes a pressure chamber substrate that is provided with a plurality of pressure chambers, a piezoelectric body that is driven to apply pressure to liquid in the pressure chambers, an upper electrode that is provided above the piezoelectric body for applying a voltage to the piezoelectric body, a lower electrode that is provided below the piezoelectric body for applying a voltage to the piezoelectric body, a detection resistor that is provided below the piezoelectric body for detecting temperature of the liquid in the pressure chambers, and a first wiring portion that is electrically coupled to the detection resistor. The first wiring portion includes a first part that is extended above the piezoelectric body, and a second part that is provided in at least a part of a through hole penetrating the piezoelectric body and electrically coupled to the detection resistor.

A liquid discharge head includes an individual electrode that is individually provided for the plurality of pressure chambers, a common electrode that is commonly provided for the plurality of pressure chambers, a piezoelectric body that is provided between the individual electrode and the common electrode for applying pressure to liquid in the pressure chambers, a drive wiring that is electrically coupled to the individual electrode and the common electrode, and applies a voltage for driving the piezoelectric body, a detection resistor that is formed of the same material as any of the individual electrode, the common electrode, and the drive wiring for detecting temperature of the liquid in the pressure chambers, and a first layer that is provided on a surface opposite to a surface facing the pressure chamber substrate in the detection resistor, and has a lower thermal conductivity than the detection resistor.

A liquid discharge head includes an individual electrode, a common electrode, a piezoelectric body that is provided between the individual electrode and the common electrode for applying pressure to liquid in the pressure chambers, a drive wiring that applies a voltage so as to drive the piezoelectric body, a detection resistor that is formed of the same material as any of the individual electrode, the common electrode, and the drive wiring for detecting temperature of the liquid in the pressure chambers, and a sealing substrate that has a wall portion and a ceiling portion, and protects the piezoelectric body by the wall portion and the ceiling portion. The detection resistor is provided to have a part overlapping the wall portion which is shorter than a part not overlapping the wall portion when viewed along a lamination direction of the piezoelectric body, the individual electrode, and the common electrode.

A head includes the passageway member which is configured by a plurality of plates stacked through the adhesive and in which the ink passageways are configured by communication of the through holes individually formed in the plurality of plates to each other. The plurality of plates includes the resin plate and a plurality of metal plates. The resin plate does not have a relief groove for the adhesive. The plurality of metal plates include the eighth metal plate and/or ninth metal plate which is adhered to the resin plate and includes the relief groove for the adhesive on the resin plate side.

An inkjet printhead including: an elongate fluid manifold having a base comprising a plurality of fluid delivery compartments, each compartment having a fluid outlet and a bubble-venting cavity; and one or more printhead chips attached to the base, each printhead chip receiving printing fluid from one or more fluid outlets. Each fluid outlet is aligned with a respective printhead chip and each bubble-venting cavity is offset from the respective printhead chip.

A method of manufacturing an ink jet print head capable of bonding the printing element substrate to the support surface with high precision in a reduced period of time is provided. For this purpose, raised flat portions are formed in the support surface of the supporting member to provide in an adhesive layer between the printing element substrate and the supporting member a portion of the thermosetting adhesive that is thinner than others. After the relative positions of the printing element substrate and the supporting member are adjusted, the thin portions of the adhesive layer are hardened. This enables the printing element substrate to be bonded to the supporting member in a relatively short period of time. As a result, if there are undulations on the support surface, the printing element substrate can be bonded to the supporting member with high precision, improving the mass productivity of the print head.

A print head assembly comprises a print head unit, a cooling duct, and a blower arranged to pass a gaseous cooling medium through the cooling duct.

The cooling duct has an elongated closed hollow cross-section bounded on at least one side by a flat wall. The print head unit is attached to the flat wall outside of the cooling duct such that the print head unit is cooled by the gaseous medium passing through the cooling duct via thermal contact through the flat wall of the cooling duct.

Provided is a liquid ejecting head which includes a head main body which has liquid ejection surface through which liquid is ejected, a flexible wiring substrate which is connected to the head main body, and a flow-path member having flow path through which liquid is supplied to the head main body. The flow-path member has an opening portion through which the substrate is inserted. The substrate extends to the flow-path member, with respect to the head main body. The substrate is inclined in a direction directed toward a first surface side of both surfaces of the substrate. In an area on a second surface side of both surfaces of the substrate, the flow path has a portion extending along the head main body.

There is provided a head chip and so on capable of achieving the reduction in power consumption and the improvement in print image quality while suppressing the manufacturing cost of the head chip. The head chip according to an embodiment of the present disclosure includes an actuator plate having a plurality of ejection grooves and a plurality of electrodes, a nozzle plate having a plurality of nozzle holes, and a cover plate having a wall part, a first through hole, and a second through hole. The plurality of nozzle holes includes a plurality of first nozzle holes arranged so as to be shifted toward the first through hole, and a plurality of second nozzle holes arranged so as to be shifted toward the second through hole. In a first ejection groove communicated with the first nozzle hole, a first cross-sectional area of a part communicated with the first through hole is smaller than a second cross-sectional area of a part communicated with the second through hole. Positions of both ends of the electrode along the extending direction of the ejection grooves are each aligned in the plurality of electrodes along a predetermined direction.