A piezoelectric device includes a substrate on which a plurality of recesses are arranged in a first direction, a vibration plate, and a piezoelectric actuator having a first electrode, a second electrode and a third electrode, a fourth electrode, and a piezoelectric layer, in which a plurality of active portions are provided, the second electrode and the third electrode are provided from an edge of a region facing a recess to an outside of the recess, the first electrode is formed between the second electrode and the third electrode, the second electrode, the third electrode, and the fourth electrode configure common electrodes for the plurality of active portions, and the first electrode configures an individual electrode provided independently for each of the active portions.

A liquid discharge head is configured to discharge a liquid, and the liquid discharge head includes an actuator substrate and a holding substrate bonded to the actuator substrate. The actuator substrate includes a pressure generator, and a wiring electrode configured to electrically connect the pressure generator and an exterior of the liquid discharge head. The holding substrate includes an opening configured to expose the wiring electrode to the exterior of the liquid discharge head, and a detection surface adjacent to the opening, the detection surface having a higher reflectance than a surface of the wiring electrode of the actuator substrate.

An electronic assembly includes a substrate having a die and PCB mounted thereon. Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions. A dam encapsulant encapsulates each of the first and second end portions, a first fill encapsulant contacts the substrate and the dam encapsulant; and a second fill encapsulant overlies the first fill encapsulant. The first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.

The head chip includes an actuator plate having ejection channels and non-ejection channels extending in a Y direction and arranged alternately in an X direction, an intermediate plate overlapped with the actuator plate in a Z direction, and provided with communication holes communicated with the ejection channels and through holes communicated with the non-ejection channels, and a nozzle plate overlapped with the intermediate plate in the Z direction in a state of closing the through holes, and provided with nozzle holes which are communicated with the communication holes, jet liquid contained in the ejection channels, and are formed at positions corresponding to the ejection channels. The non-ejection channels are communicated with an outside of the head chip. The through holes are each disposed at an inner side in the X direction of the inner surfaces extending in the Y direction of the non-ejection channel viewed from the Z direction.

There is provided a head module in which a first direction is a main scanning direction, including: a first nozzle row including a first nozzle; a second nozzle row including a second nozzle; and a third nozzle row including a third nozzle, in which a distance P1 between the first nozzle row and the second nozzle row in the first direction and a distance P2 between the first nozzle row and the third nozzle row in the first direction are expressed as P1:P2=E1:O1 where a value E1 is a positive even number and a value O1 is a positive odd number satisfying O1>E1.

Isolation between electrodes is ensured to enhance resistance to a liquid. A conductive film is provided to a surface of a piezoelectric substrate, and laser processing is performed in a groove extending direction on the conductive film between a first groove and a second groove provided to the piezoelectric substrate to thereby form a laser processing area where the conductive film is removed to the surface of the piezoelectric substrate between the first groove and the second groove. In forming the laser processing area, an irradiation operation with a laser is performed along a plurality of laser processing lines extending in the groove extending direction. Further, the irradiation operation with the laser is performed a plurality of times for each of the laser processing lines, and the irradiation operations with the laser performed along the same laser processing line of the plurality of laser processing lines are performed at a time interval from when ending a previous irradiation operation with the laser to when starting a subsequent irradiation operation with the laser.

A liquid ejecting apparatus includes a head unit having heads that configure to eject a liquid in a first-direction, and in which a second-direction orthogonal to the first-direction is a short direction and a third-direction orthogonal to the first and second-directions is a longitudinal direction, and a holding member. The head unit has a first-head, a second-head adjacent to the first-head, and disposed in the second-direction, and a third head adjacent to the second-head, and disposed in the second-direction. The first head has a first-gripping portion provided on an upper surface. The second-head has a second-gripping portion provided on the upper surface. The third-head has a third-gripping portion provided on the upper surface. A position of the second-gripping portion with respect to the third-direction is different from positions of the first-gripping portion and the third-gripping portion with respect to the third-direction.

An electric current based on electric charge produced on the piezoelectric body changes by going through a first path, a second path, a third path, and a fourth path in this order. On the first path, the electric current becomes larger as the voltage becomes higher. On the second path, the electric current becomes smaller as the voltage becomes higher. On the third path, the electric current becomes larger as the voltage becomes higher. On the fourth path, the electric current becomes smaller as the voltage becomes higher.

In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.

A liquid discharge head includes a flow channel member, a pressurization part, a plurality of discharge holes, a flexible substrate, a cover member, and a heater. The flow channel member includes a first surface and a second surface that is positioned on an opposite side of the first surface. The pressurization part is positioned on the first surface. The plurality of discharge holes are positioned on the second surface. For the flexible substrate, a one-end part thereof that is positioned on the pressurization part is electrically connected to the pressurization part. The cover member covers the one-end part of the flexible substrate. The heater is positioned on the cover member.