B41J2/14427

TEMPERATURE-BASED ACTUATOR EVALUATION

In one example in accordance with the present disclosure, a fluidic system is described. The fluidic system includes a fluidic die. The fluidic die includes a substrate in which a number of fluid chambers are formed. Each fluid chamber includes a fluid actuator disposed within the fluid chamber. A number of actuator sensors are disposed on the substrate to output at least one value indicative of a sensed characteristic of fluid actuators. A number of substrate temperature sensors are also disposed on the substrate to sense a temperature for the substrate. An actuator evaluation device of the fluidic system determines a state of the fluid actuator based at least in part on the at least one value and at least one correction value associated with the temperature sensed by the number of substrate temperature sensors.

Inkjet printhead with grout retaining features

An inkjet printhead includes: an elongate support having a printhead mounting surface; a plurality of butting printhead chips mounted on the printhead mounting surface, each printhead chip having an ink ejection surface including one or more nozzle rows; and a grout material disposed between butting edges of each butting pair of printhead chips. Each printhead chip has a grouting trench defined in the ink ejection surface, the grouting trench extending alongside at least one butting edge and the grouting trench being disposed between an endmost nozzle of each nozzle row and the butting edge.

LIQUID EJECTING UNIT AND LIQUID EJECTING APPARATUS
20200276817 · 2020-09-03 ·

A liquid ejecting unit including a flow path structure into which a liquid flow from a liquid reservoir that temporarily stores the liquid, a liquid ejecting head coupled to the flow path structure and including a nozzle for ejecting the liquid supplied from the flow path structure, and a heating portion heating the liquid inside the flow path structure.

LIQUID DISCHARGE HEAD, LIQUID DISCHARGE DEVICE, DISPENSING DEVICE, AND LIQUID DISCHARGE METHOD

Liquid discharge head comprising: liquid discharge unit, which includes discharge port, liquid retaining section configured to retain liquid to be discharged from the discharge port, and displacement section configured to discharge the liquid retained within the liquid retaining section from the discharge port; a pair of liquid storage sections, which are configured to store the liquid and are each connected to the liquid retaining section in the liquid discharge unit so that the liquid can flow; a pair of liquid feeding sections that are connected to the pair of liquid storage sections and are configured to feed the liquid between the liquid storage section and the liquid retaining section; and a pair of open and close sections that are each disposed at flow path between the liquid feeding section and the liquid storage section and are configured to open and close the flow path.

METHOD OF INKJET PRINTING WITH AIR-DAMPENING OF INK PRESSURE FLUCTUATIONS

A method of inkjet printing includes the steps of: (i) delivering ink to a printhead manifold having a longitudinal ink channel, one or printhead chips mounted to a floor of the printhead manifold and in fluid communication with the longitudinal ink channel, and a plurality of sealed air cavities positioned over the longitudinal ink channel for dampening pressure fluctuations in the ink; (ii) printing from the printhead chips; and (iii) replenishing the air cavities with air.

Inkjet printhead having flared outlets

An inkjet printhead including: an elongate fluid manifold having a base defining a plurality of fluid outlets; and printhead chips attached to the base, each printhead chip receiving printing fluid from a plurality of the fluid outlets. All fluid outlets are laterally flared towards a side of a respective printhead chip.

PRINTHEAD ASSEMBLY
20240059062 · 2024-02-22 ·

The present disclosure provides a printhead assembly comprising: a plurality of printhead modules (100a), including a first printhead module, a second printhead module and a third printhead module. Each of the plurality of printhead modules (100a) comprises: a plurality of printhead nozzles (126) each provided with an actuator (118) for selectively ejecting print agent therefrom; at least one print agent manifold (122, 124) providing a fluid communication pathway between at least one print agent inlet and the plurality of printhead nozzles (126); and control circuitry (104) to control the actuators (118) of the printhead module (100a) to eject print agent from the printhead nozzles (126). The first printhead module is mounted to the third printhead module via the second printhead module.

FLUID DISPENSING DEVICES

In some examples, a fluid dispensing device includes a fluid chamber, a heating element adjacent the fluid chamber, and an orifice adjacent the fluid chamber. A ratio of an area of a surface of the heating element to an orifice area of the orifice is greater than or equal to 3, where the surface of the heating element faces the fluid chamber.

Ink jet printhead

Printheads and methods for forming printheads are described herein. In one example, a printhead includes a number of drop generators, wherein a pitch between each adjacent drop generator is substantially the same, and the drop generators alternate between a high drop weight (HDW) drop generator and a low drop weight (LDW) drop generator. The printhead also includes a flow channel from an ink source leading into an ejection chamber associated with each drop generator, wherein the flow channel comprises an inflow region proximate to the ink source, wherein an area of the inflow region is adjusted to control the flux of ink into the ejection chamber.

INKJET PRINTHEAD WITH ENCAPSULANT-RETAINING FEATURES

A MEMS chip assembly including: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, each MEMS chip having an active surface including one or more MEMS devices and a plurality of bond pads disposed alongside a connection edge of the MEMS chip; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has encapsulant-retaining trenches defined in the active surface extending alongside the connection edge, each encapsulant-retaining trench being disposed between the bond pads and the MEMS devices.