A liquid discharge head according to the present invention includes a flow passage member and a plurality of pressurizing sections. The flow passage member includes a plurality of discharge holes, a plurality of pressurizing chambers respectively connected to the plurality of the discharge holes, a plurality of first flow passages respectively connected to the plurality of the pressurizing chambers to supply liquid to the plurality of the pressurizing chambers, a plurality of second flow passages respectively connected to the plurality of the pressurizing chambers to collect the liquid from the plurality of the pressurizing chambers, and a plurality of third flow passages respectively connected to the pressurizing chambers to supply the liquid to the pressurizing chambers. A plurality of the pressurizing sections respectively pressurizes the plurality of the pressurizing chambers.

Provided is an inkjet print head capable of favorably cleaning an ejection port surface and also of improving landing accuracy of ejected ink onto a print medium. For that purpose, a conductive layer formed of a conductive material is formed on a support substrate, flattening processing is executed, and a liquid ejection substrate is mounted on the support substrate with good positional accuracy without protrusion of a sealant for protecting an electric connection portion of the liquid ejection substrate from the ejection port surface.

In an embodiment, a fluid ejection device includes a thin-film layer formed over a substrate. A primer layer is formed over the thin-film layer, and a chamber layer is formed over the primer layer that defines a fluidic channel leading to a firing chamber. The fluid ejection device includes a slot that extends through the substrate and into the chamber layer through an ink feed hole in the thin-film layer. The fluid ejection device also includes a particle tolerant extension of the primer layer that protrudes into the slot. In some implementations, the particle tolerant primer layer extension extends across a full width of the slot.

A method for processing a silicon substrate includes forming a structure having a bottom surface and a depth of 200 μm or more or 300 μm or more from a first surface of a silicon substrate, forming a protective film on an inner wall of the structure, and performing plasma etching so as to selectively remove the protective film disposed on the bottom surface of the structure with respect to the protective film disposed on the substantially perpendicular side wall of the structure, wherein the plasma etching is performed under the condition in which plasma with a sheath length at least 10 times the depth when the depth is 200 μm or more, or at least 5 time the depth when the depth is 300 μm or more, is generated and a mean free path of ions generated in the plasma is longer than the sheath length.

Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes a first respective fluid feed hole fluidically coupled to each respective ejection chamber, and the array of fluid feed holes includes a second respective fluid feed hole fluidically coupled to each respective ejection chamber.

A liquid ejection head substrate includes a heating resistor array including a plurality of heating resistors and a protective film covering at least one of the heating resistors. The liquid ejection head substrate further includes a supply opening array and an electrode. The supply opening array is disposed on a side of a surface of the liquid ejection head substrate on which the protective film is provided. The supply opening array includes a plurality of supply openings through which a liquid is supplied arranged in a direction along the heating resistor array. The electrode is disposed on the side of the surface in a space between the supply openings adjacent to each other in a direction along the supply opening array. The electrode is configured such that a voltage is applied between the electrode and the protective film.

A liquid discharge head may reduce possibility that pressure from a discharge unit reaches a third channel and a fourth channel. The liquid discharge head includes a plurality of discharge units each including a discharge hole, a pressurization chamber communicating with the discharge hole, a first channel for liquid supply to the pressurization chamber, and a second channel for liquid collection from the pressurization chamber, a pressurizing part configured to pressurize the pressurization chamber, a third channel connected commonly to the first channels of the plurality of discharge units, the third channel for liquid supply to the discharge units, a fourth channel connected commonly to the second channels of the plurality of discharge units, the fourth channel for liquid collection from the discharge units, and a fifth channel connecting the discharge units and having channel resistance larger than channel resistance of the first channel and the second channel.

There is provided a liquid discharge head including: a nozzle member; a first common channel member including first common channels; an actuator member including pressure chambers and driving elements; a driver IC; a second common channel member including a second common channel; and a chiller configured to chill the driver IC.

There is provided a liquid discharge head, including: a first channel member including individual channel rows and first common channels that correspond to the respective individual channel rows; a second channel member including a second common channel provided in common to the first common channels; and a third channel member including at least parts of connection channels connected to the second common channel. One of the connection channels is connected to an end in a longitudinal direction of the second common channel. The liquid discharge head further comprises a communication opening disposed at any other part of the second common channel except the end in the longitudinal direction, the second common channel communicating with the outside through the communication opening.

There is provided a liquid discharge head, including: a nozzle member formed having nozzle rows extending in a first direction, the nozzle rows being arranged in a second direction; driving elements; a first channel member disposed at one side of the nozzle member in a third direction; a second channel member disposed at the one side of the first channel member in the third direction; and a third channel member disposed at the one side of the second channel member in the third direction.