There is provided a head system includes: a main controller; a plurality of head units; and sub-controllers respectively connected to at least one of the plurality of head units. The sub-controllers are each serially connected via a wiring. The wiring includes: a first communication path for transmitting an image signal; and a second communication path that transmits a discharge timepoint signal indicating a discharge timepoint. Each of the sub-controllers is configured to cause liquid corresponding to an image indicated by the image signal that has been received through the first communication path to be discharged from nozzles of one of the head units to which each of the sub-controllers have been connected, at a discharge timepoint indicated by the discharge timepoint signal that has been received through the second communication path.

There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid. Forming the actuator plate includes forming a plurality of grooves on a surface of a piezoelectric substrate having one end and the other end so as to extend from the one end side toward the other end side, forming a conductive film on the surface of the piezoelectric substrate provided with the plurality of grooves, forming a laser processing area in the conductive film between the grooves adjacent to each other by performing laser processing from a start point on the one end side of the piezoelectric substrate to an end point on the other end side, and forming a surface removal area in at least a part including the start point and the end point out of the surface of the piezoelectric substrate by performing surface removal processing in a direction crossing the direction in which the laser processing is performed.

There is provided a liquid discharge apparatus for forming an image on a medium by discharging a liquid, including: a first discharge head that discharges a liquid; and a first temperature indicating section provided in the first surface, in which the first temperature indicating section indicates that a temperature of the first temperature indicating section is lower than a first threshold value in a first state, and indicates that the temperature of the first temperature indicating section is equal to or higher than the first threshold value in a second state, and the first state and the second state change reversibly, and at least a part of the first temperature indicating section overlaps at least a part of the first propagation wiring in a normal direction of the wiring substrate.

A liquid ejecting head including: an individual flow path row in which a plurality of individual flow paths communicating with a nozzle that ejects a liquid in a first axis direction are arranged in parallel along a second axis orthogonal to a first axis, and a first common liquid chamber communicating with the plurality of individual flow paths, in which each of the plurality of individual flow paths has a pressure chamber that stores a liquid.

Isolation between electrodes is ensured to enhance resistance to a liquid. A conductive film is provided to a surface of a piezoelectric substrate, and laser processing is performed in a groove extending direction on the conductive film between a first groove and a second groove provided to the piezoelectric substrate to thereby form a laser processing area where the conductive film is removed to the surface of the piezoelectric substrate between the first groove and the second groove. In forming the laser processing area, an irradiation operation with a laser is performed along a plurality of laser processing lines extending in the groove extending direction. Further, the irradiation operation with the laser is performed a plurality of times for each of the laser processing lines, and the irradiation operations with the laser performed along the same laser processing line of the plurality of laser processing lines are performed at a time interval from when ending a previous irradiation operation with the laser to when starting a subsequent irradiation operation with the laser.

A liquid ejecting head includes: multiple head chips; a first board that is a rigid board coupled to multiple flexible boards mounted on the respective head chips; and a second board that is disposed opposite the head chips with the first board therebetween and that is a rigid board provided with a connector. The first board has a first and second board-to-board connectors; the second board has a third and fourth board-to-board connectors. The first board-to-board connector mates with the third board-to-board connector so that the first board-to-board connector is coupled to the third board-to-board connector. The second board-to-board connector mates with the fourth board-to-board connector so that the second board-to-board connector is coupled to the fourth board-to-board connector. The connector is electrically coupled to both the third and fourth board-to-board connectors.

An electric current based on electric charge produced on the piezoelectric body changes by going through a first path, a second path, a third path, and a fourth path in this order. On the first path, the electric current becomes larger as the voltage becomes higher. On the second path, the electric current becomes smaller as the voltage becomes higher. On the third path, the electric current becomes larger as the voltage becomes higher. On the fourth path, the electric current becomes smaller as the voltage becomes higher.

A liquid ejection head with which print of good print quality can be obtained and a method of manufacturing the liquid ejection head are provided. For that purpose, warped flow path members are joined to each other as flow path members used for a print head to form a flow path member warped in a direction opposite to a direction of warpage due to a temperature rise during printing.

In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.

A liquid discharge head includes a flow channel member, a pressurization part, a plurality of discharge holes, a flexible substrate, a cover member, and a heater. The flow channel member includes a first surface and a second surface that is positioned on an opposite side of the first surface. The pressurization part is positioned on the first surface. The plurality of discharge holes are positioned on the second surface. For the flexible substrate, a one-end part thereof that is positioned on the pressurization part is electrically connected to the pressurization part. The cover member covers the one-end part of the flexible substrate. The heater is positioned on the cover member.