A liquid ejecting head includes a first drive circuit including a switching element that selects, from a plurality of drive elements, a drive element to which a drive signal for ejection of liquid through a nozzle is sent, a case defining a first accommodating portion that is a space accommodating the first drive circuit, and a first gas supply passage that is in communication with the first accommodating portion and through which gas is supplied to the first accommodating portion.

A liquid discharge head is provided in which heat of a heat sink is less apt to transfer to a head body. The liquid discharge head includes a head body 2a having a discharge hole for discharging a liquid therethrough, a driver IC 93 configured to control driving of the head body 2a, a casing 91 which is disposed on the head body 2a and has openings 91a and 91b on a side surface of the casing, and a heat sink 90 which is disposed on the openings 91a and 91b of the casing 91 and configured to dissipate heat generated in the driver IC 93, and a thermal insulation part 91e disposed between the heat sink 90 and the head body 2a. This makes it possible to reduce the likelihood that the heat of the heat sink 91e transfers to the head body 2a.

The electrohydrodynamic print head comprises a plurality of nozzles. Each nozzle has a central nozzle duct laterally surrounded by a nozzle wall. The top end of the nozzle duct communicates with an ink feed duct. An annular trench laterally surrounds the nozzle. An extraction electrode is located around the axis of the nozzle at a level below it, and a shaping electrode located laterally outside the nozzle duct. The shaping electrode is arranged within a ring having a horizontal width of less than the vertical distance between said shaping electrode and the extraction electrode or it is located above the trench. Both these measures allow to operate the device with high voltages with reduced risk of electrical breakdown.

A liquid discharge device including a discharge head, a head drive circuit that outputs a first drive signal, and a second drive signal, and a coupling member includes a first wiring that propagates the first drive signal, a second wiring that propagates the second drive signal, a third wiring that propagates a reference voltage signal, and a base material provided with the first wiring, the second wiring, and the third wiring, in which the first wiring and the second wiring are provided on a first surface of the base material, the third wiring is provided on a second surface different from the first surface of the base material, and at least one of the first wiring and the second wiring is located so as to overlap with at least a part of the third wiring in a first direction along a direction from the first surface to the second surface.

A multi-chip module (MCM) assembly comprising: a graphite substrate having a front surface and a back surface and comprising a plurality of silicon chips mounted on the front surface, a Printed Wiring Board (PWB) attached to the graphite substrate and provided with openings surrounding outer profiles of the silicon chips, the graphite substrate comprises one or more ink channels on the back surface and one or more ink feeding slots passing through the graphite substrate and being in fluidic communication with the respective one or more ink channels, so that each of the silicon chips can be fed with one or more different types of inks, the MCM assembly further comprises a graphite cover plate configured to cover the one or more ink channels of the graphite substrate.

A piezoelectric device includes a substrate, a diaphragm; and a piezoelectric actuator, in which the substrate, the diaphragm, and the piezoelectric actuator are laminated in this order in a first direction, the diaphragm includes a first layer containing silicon as a constituent element, a third layer disposed between the first layer and the piezoelectric actuator and containing zirconium as a constituent element, and a second layer disposed between the first layer and the third layer and containing at least one impurity element selected from the group consisting of a metal, a metalloid, and a semiconductor other than silicon and zirconium, as a constituent element, and the impurity element diffuses into the third layer.

The diaphragm includes a first layer containing silicon as a constituent element, a third layer disposed between the first layer and the piezoelectric actuator and containing zirconium as a constituent element, and a second layer disposed between the first layer and the third layer and containing at least one selected from the group consisting of a metal other than iron, silicon, and zirconium, a metalloid, and a semiconductor, as a constituent element, in the second layer and the third layer, a position with a highest concentration of impurities other than the constituent elements of the second layer and the third layer is in the second layer, a position with a highest concentration of zirconium is in the third layer, and a position with a highest concentration of silicon is in the first layer.

A control board connectable to a liquid ejection head includes a power supply circuit outputting a first voltage, a connector connectable to a cable through which the first voltage is input and a second voltage is output, and a processor detecting a connection error of the cable using a difference between the first and second voltages, and control the circuit to turn off upon detection of the error. The connector includes first, second, and third terminals adjacent to each other and arranged along a direction in this order and fourth, fifth, and sixth terminals adjacent to each other and arranged along the first direction in this order. The first voltage is input to the second terminal, the second voltage is output from the fifth terminal, and the first, third, fourth, and sixth terminals are ground terminals. The second and fifth terminals are short-circuited in the liquid ejection head.

A method for depositing droplets onto a medium, utilising a droplet deposition head is provided. The head used in the method includes: an array of fluid chambers separated by interspersed walls, each fluid chamber communicating with an aperture for the release of fluid droplets and each wall separating two neighbouring chambers. Each wall is actuable such that in response to a first voltage, it will deform so as to decrease the volume of one chamber and increase the volume of the other chamber, and, in response to a second voltage, it will deform so as to cause the opposite effect on the volumes of its neighbouring chambers. The method includes the steps of: receiving input data: assigning, based on such input data, all the chambers within the array as either filing chambers or non-firing chambers, so as to produce bands of one or more contiguous filing chambers separated by bands of one or more contiguous non-firing chambers; actuating the walls of certain of the chambers such that: for each non-firing chamber, either one wall is stationary while the other is moved, or the walls move with the same sense, or they remain stationary: and, for each firing chamber the walls move with opposing senses; such actuations result in each firing chamber releasing at least one droplet, the resulting droplets forming bodies of fluid disposed on a line on the medium, such bodies of fluid being separated on the line by respective gaps for each of the bands of non-firing chambers, the size of each such gap generally corresponding in size to the respective band of non-firing chambers. The actuations of the walls of said firing chambers in the actuating step are such that, if only one of the two walls of each firing chamber were actuated in such manner, no droplets would be ejected from that firing chamber. A droplet deposition apparatus, a droplet deposition head and a computer program product are also provided.

A method for manufacturing a device for ejecting a fluid, including the steps of: forming, in a first semiconductor wafer that houses a nozzle of the ejection device, a first structural layer; removing selective portions of the first structural layer to form a first portion of a chamber for containing the fluid; removing, in a second semiconductor wafer that houses an actuator of the ejection device, selective portions of a second structural layer to form a second portion of the chamber; and coupling together the first and second semiconductor wafers so that the first portion directly faces the second portion, thus forming the chamber. The first portion defines a part of volume of the chamber that is larger than a respective part of volume of the chamber defined by the second portion.