B41J2/155

Method of capping printheads arranged along curved media path
11559991 · 2023-01-24 · ·

A method of capping printheads positioned along a curved media path having an apex. The method includes the steps of: providing a first printhead upstream of the apex and a corresponding first capper downstream of the first printhead; providing a second printhead downstream of the apex and a corresponding second capper upstream of the second printhead; moving the first capper towards the first printhead and capping the first printhead; and moving the second capper towards the second printhead and capping the second printhead. The first and second cappers are moved in opposite directions away from the apex for capping the first and second printheads.

Method of capping printheads arranged along curved media path
11559991 · 2023-01-24 · ·

A method of capping printheads positioned along a curved media path having an apex. The method includes the steps of: providing a first printhead upstream of the apex and a corresponding first capper downstream of the first printhead; providing a second printhead downstream of the apex and a corresponding second capper upstream of the second printhead; moving the first capper towards the first printhead and capping the first printhead; and moving the second capper towards the second printhead and capping the second printhead. The first and second cappers are moved in opposite directions away from the apex for capping the first and second printheads.

Wafer structure

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing.

Liquid discharge apparatus

The width by which the first, second heads overlap each other cross-sectionally along the first direction is greater than the width by which the fifth, sixth heads overlap each other cross-sectionally along the first direction.

Digital printing system with flexible intermediate transfer member
11548275 · 2023-01-10 · ·

Methods for printing using printing systems comprising a flexible intermediate transfer member (ITM) disposed around a plurality of guide rollers at which encoders are installed, and an image-forming station at which ink images are formed by droplet deposition by print bars onto the ITM, can include measuring a local velocity of the ITM under one of the print bars, determining a stretch factor for a portion of the ITM based on a relationship between an estimated stretched length fixed physical distance between print bars, controlling an ink deposition parameter according to the stretch factor so as to compensate for stretching of the reference portion of the ITM.

Digital printing system with flexible intermediate transfer member
11548275 · 2023-01-10 · ·

Methods for printing using printing systems comprising a flexible intermediate transfer member (ITM) disposed around a plurality of guide rollers at which encoders are installed, and an image-forming station at which ink images are formed by droplet deposition by print bars onto the ITM, can include measuring a local velocity of the ITM under one of the print bars, determining a stretch factor for a portion of the ITM based on a relationship between an estimated stretched length fixed physical distance between print bars, controlling an ink deposition parameter according to the stretch factor so as to compensate for stretching of the reference portion of the ITM.

RECORDING APPARATUS
20230211611 · 2023-07-06 ·

A maintenance section configured to perform maintenance on a recording section includes a first guided section, which is guided by the guide unit, and a second guided section, which is positioned in a first movement direction, is a direction from the retreat position toward the maintenance position with respect to the first guided section, and is guided by the guide unit, when the maintenance section moves from the maintenance position in the first movement direction, the guide unit is configured to allow pivot accompanied by separation of the second guided section from the guide unit, which is pivot of the maintenance section with the first guided section as a pivot axis, and the first guided section is configured to separate from the guide unit, by moving in the first movement direction after the pivot of the maintenance section is allowed.

Selective assignment of print data to calibration tables in accordance with substrate advancement skew

Print data is organized over rows and columns. The columns of each row are selectively assigned to calibration tables respectively corresponding to printheads of a pagewide array in accordance with a substrate advancement skew relative to the pagewide array. The calibration tables are applied to the columns of each row respectively assigned to the calibration tables. The columns of each row to which the calibration tables have been applied are printed using the printheads respectively corresponding to the calibration tables.

Selective assignment of print data to calibration tables in accordance with substrate advancement skew

Print data is organized over rows and columns. The columns of each row are selectively assigned to calibration tables respectively corresponding to printheads of a pagewide array in accordance with a substrate advancement skew relative to the pagewide array. The calibration tables are applied to the columns of each row respectively assigned to the calibration tables. The columns of each row to which the calibration tables have been applied are printed using the printheads respectively corresponding to the calibration tables.

Molded printhead

In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.