A method for operating a printer can include draining a print material from a printer, placing a sacrificial metal into the printer, ejecting the sacrificial metal from a nozzle of the printer, and cooling to printer to a temperature that is below a melting point of the print material and the sacrificial metal. The print material can be or include aluminum and the sacrificial metal can be or include tin. The print material can be drained from the printer when the print material is in molten form, for example, from about 600° C. to about 2000° C. The sacrificial metal can be ejected from the nozzle at a temperature above the melting point of the sacrificial metal but below the melting point of the print material, for example, below about 300° C. The method can reduce or eliminate cracking of various printer structures such as the nozzle during a shutdown or cooling of the printer.

A fluid ejection head may include an integrated chamber-orifice layer forming an ejection chamber and an ejection orifice, a fluid actuator to eject fluid within the chamber through the ejection orifice, an orifice shield and an adhesive layer bonding the orifice shield to the integrated chamber-orifice layer.

A fluid ejection head may include a fluid ejection face through which fluid ejection orifices extend. A coating is selectively coated over first portions of the fluid ejection face. Second portions of the fluid ejection face omit the coating.

The trouble of removing a protective film such as a poly-paraxylene film from the part not requiring the protective film is reduced. A method of manufacturing a head chip according to an aspect of the present disclosure includes a substrate preparation step of preparing an actuator plate substrate having a jet channel communicated with a nozzle hole configured to jet ink, and a non-jet channel which does not jet the ink, and a protective film formation step of forming a protective film configured to protect a common electrode formed on an inner surface of the jet channel from the ink in a state in which the jet channel is exposed and the non-jet channel is covered after the substrate preparation step.

There are provided a head chip, a liquid jet head, a liquid jet recording device, and a method of manufacturing the head chip each capable of preventing the short circuit of electrodes by ink to maintain an excellent ejection performance over a long period of time. The head chip according to an aspect of the present disclosure includes an actuator plate, a cover plate, and an intermediate plate. In the actuator plate, open apertures which communicate an inside and an outside of a non-ejection channel with each other are formed in both end portions of the non-ejection channel in a Y direction. In the actuator plate, open apertures which communicate an inside and an outside of a non-ejection channel with each other are formed in both end portions of the non-ejection channel in the Y direction.

A wafer structure is disclosed and includes a chip substrate and plural inkjet chips having plural ink-drip generators. Each ink-drop generator includes a thermal-barrier layer, a resistance heating layer and a protective layer. The thermal-barrier layer is formed on the chip substrate, the resistance heating layer is formed on the thermal-barrier layer, a part of the protective layer is formed on the resistance heating layer, and the barrier layer is formed on the protective layer. The ink-supply chamber has a bottom in communication with the protective layer, and a top in communication with the nozzle. The thermal-barrier layer has a thickness of 500˜5000 angstroms, the protective layer has a thickness of 150˜3500 angstroms, the resistance heating layer has a thickness of 100˜500 angstroms, the resistance heating layer has a length of 5˜30 microns, and the resistance heating layer has a width of 5˜10 microns.

A liquid ejection head includes a liquid ejection head substrate having ejection elements that generate liquid ejecting energy, an ejection port formation member having ejection ports, and liquid chambers between the liquid ejection head substrate and the ejection port formation member to house liquid to be ejected through the ejection ports. The liquid ejection head substrate includes a substrate, an insulating film stacked on the substrate to insulate the ejection elements, communication ports in the substrate and the insulating film to communicate with the liquid chambers, and a liquid-resistant insulating film adherent to the ejection port formation member. The liquid-resistant insulating film covers the insulating film at its ejection port formation member side and includes a first portion partially contacting the ejection port formation member and a second portion covering the inner surfaces of the communication ports in the insulating film, the first and second portions being continuous.

A wafer structure is disclosed and includes a chip substrate and plural inkjet chips having plural ink-drip generators. Each ink-drop generator includes a thermal-barrier layer, a resistance heating layer and a protective layer. The thermal-barrier layer is formed on the chip substrate, the resistance heating layer is formed on the thermal-barrier layer, a part of the protective layer is formed on the resistance heating layer, and the barrier layer is formed on the protective layer. The ink-supply chamber has a bottom in communication with the protective layer, and a top in communication with the nozzle. The thermal-barrier layer has a thickness of 500˜5000 angstroms, the protective layer has a thickness of 150˜3500 angstroms, the resistance heating layer has a thickness of 100˜500 angstroms, the resistance heating layer has a length of 5˜30 microns, and the resistance heating layer has a width of 5˜10 microns.

Aspects of the present disclosure are directed to forming a layer of material on a print head. As may be implemented in a manner consistent with examples herein, a layer of material from a transfer film is pressed against a surface of a print head, in which the surface defines fluid nozzle openings that extend from the surface into the print head. Portions of the material pressed onto the surface are therein adhered to the surface and caused to wrap over edges of the surface extending around the openings The transfer film is removed along with a thickness of the material pressed into contact with the surface that remains adhered to the transfer film, as well as some or all of other regions of the material over the openings The remaining layer of the material on the surface is thus formed with a uniform thickness.

A recording method includes a supply step of supplying an ink composition from an ink chamber to an ink jet head and an adhesion step of discharging the ink composition from the ink jet head and allowing the composition to adhere to a recording medium. The ink chamber receives supply of the ink composition from the ink container and has a capacity of 40 mL or more. The ink composition is an aqueous ink composition containing a pigment and an inorganic oxide particle having a specific gravity equal to or higher than that of the pigment.