In one example in accordance with the present disclosure, a fluid ejection device is described. The fluid ejection device includes a substrate and a number of nozzles formed within the substrate to eject fluid. A number of bond pads are disposed on the substrate and are electrically coupled to the number of rows of nozzles. A termination ring is disposed on the substrate and surrounds the rows of nozzles. The termination ring includes a first metallic layer that is an enclosed shape and a second metallic layer that is disposed on top of the first metallic layer. The second metallic layer includes a gap positioned adjacent the number of bond pads.

An ink jet head includes a head substrate, a printed board, and a plurality of flexible substrates connected in parallel to each other between the head substrate and the printed board. The head substrate includes a plurality of ink jet elements, and a common wire extending from an edge of the head substrate and electrically connected to the ink jet elements in common. The printed board includes a reference potential wire through which a reference potential is set to the ink jet head. A first one of the flexible substrates at a first end of an arrangement of the flexible substrates and a second one of the flexible substrates at a second end of the arrangement of the flexible substrates opposite to the first end each has a common connection wire electrically connected between the common wire and the reference potential wire.

A method for forming a fluid flow structure may include positioning rows of micro devices in a mold, wherein each of the micro devices comprising a chamber layer in which an ejection chamber is formed and an orifice layer over the chamber layer in which an orifice is formed. The method may further include molding an amorphous body to encapsulate the rows of the micro devices such that the amorphous body forms fluid channels such that each of the rows is fluidically coupled to a different one of the fluid channels.

An element substrate is bonded to a support substrate with high positional accuracy. A manufacturing method of the liquid ejecting head includes curing a first adhesive, which is in contact with an element substrate and a support substrate, at a first temperature to perform first temporary fixing, heating a second adhesive, which is in contact with the element substrate and the support substrate, to a second temperature higher than the first temperature so as to cure the second adhesive and perform second temporary fixing and heating a third adhesive, which is in contact with the element substrate and the support substrate, to a third temperature higher than the second temperature so as to cure the third adhesive and bond the element substrate to the support substrate. An elastic modulus of the second adhesive is larger than an elastic modulus of the first adhesive at the second temperature.

A flow path forming substrate on which a nozzle plate including a plurality of nozzles is mounted forms a supply flow path from a shared supply path shared for liquid supply to the plurality of nozzles, and an individual supply path branching from the shared supply path and leading to a pressure chamber for each of the nozzles, and forms a collecting flow path from an individual collecting path for each of the nozzles communicated with the communication flow path for each of the nozzles communicating with the nozzles and pressure chambers, and a shared collecting path shared for liquid collection from the plurality of nozzles by joining to the individual collecting path. The shared supply path is liquid-tightly closed by a supply-side flexible plate having flexibility, and the collecting flow path is liquid-tightly closed by a collecting-side flexible plate having flexibility over a flow path area.

A liquid ejecting head includes a nozzle plate, a multilayer substrate, and a pressure chamber substrate. The multilayer substrate includes a communication flow path penetrating a first flow path arrangement layer, a insulating layer, and a second flow path arrangement layer. When a direction from the pressure chamber substrate toward the nozzle plate is defined as a first direction, and a direction intersecting the first direction is defined as a second direction, the communication flow path includes a first portion having a first width and a second portion having a second width in a first cross section along the first direction and the second direction, the first width is narrower than the second width, the first portion includes the insulating layer, and the communication flow path includes a first inclined portion having a wall surface inclined to the first direction between the first portion and the second portion.

An electronic device includes a first member configured by single crystal silicon, in which the first member includes a first surface configured by a {110} plane in the single crystal silicon, a second surface of an opposite side from the first surface, a through-hole which spans from the first surface to the second surface, a first recessed portion which is opened in the first surface and includes a wall surface configured by a {111} plane, the wall surface being inclined by an angle greater than 0 and less than 90 with respect to the first surface in the single crystal silicon, and a second recessed portion opened in the second surface, and a level difference surface having a different inclination to that of the {111} plane is provided in the middle of the wall surface of the first recessed portion in a depth direction.

The disclosure concerns an applicator (e.g. printhead) for applying a coating agent (e.g. paint) to a component (e.g. motor vehicle body component), having at least one nozzle row with a plurality of nozzles for dispensing the coating agent in the form of a jet in each case, the nozzles being arranged along the nozzle row and in a common nozzle plane, and having a plurality of actuators for controlled release or closure of the nozzles. The disclosure provides that the individual actuators each have an outer dimension along the nozzle row which is greater than the nozzle distance along the nozzle row.

A piezoelectric device and method of manufacturing the same and an inkjet head are described. In one embodiment, the inkjet print head comprises a plurality of jets, wherein each of the plurality of jets comprises a nozzle, a pressure chamber connected with the nozzle, a piezoelectric body coupled to the pressure chamber, and an electrode coupled to the piezoelectric body to cause displacement of the piezoelectric body to apply pressure to the pressure chamber in response to a voltage applied to the electrode; and wherein electrodes of two or more of the plurality of jets have different sizes to cause their associated piezoelectric bodies to have a uniform displacement amount when the voltage is applied to the electrodes.

In one example in accordance with the present disclosure, a fluid ejection device is described. The fluid ejection device includes a substrate and a number of nozzles formed within the substrate to eject fluid. A number of bond pads are disposed on the substrate and are electrically coupled to the number of rows of nozzles. A termination ring is disposed on the substrate and surrounds the rows of nozzles. The termination ring includes a first metallic layer that is an enclosed shape and a second metallic layer that is disposed on top of the first metallic layer. The second metallic layer includes a gap positioned adjacent the number of bond pads.