A piezoelectric element includes a first electrode disposed at a base body, a second electrode, and a piezoelectric layer disposed between the first electrode and the second electrode. The piezoelectric layer includes a first piezoelectric layer containing a complex oxide having a perovskite structure that contains lead, zirconium, and titanium and a second piezoelectric layer containing a complex oxide having a perovskite structure that is denoted by formula (1) below. The first piezoelectric layer is disposed between the first electrode and the second piezoelectric layer and is preferentially oriented to (100) when the crystal structure of the first piezoelectric layer is assumed to be pseudo-cubic,

xPb(Mg,Nb)O.sub.3-yPbZrO.sub.3-zPbTiO.sub.3(1)

where in formula (1), 0<x,y,z<1 and x+y+z=1.

In a liquid ejection head, a substrate is provided with a first inflow port located on an upstream side of a pressure chamber in a direction of flow of liquids in a liquid flow passage and configured to allow a first liquid to flow into the liquid flow passage, a second inflow port located on the upstream side of the first inflow port and configured to allow a second liquid to flow into the liquid flow passage, and a lateral wall extending in a direction of extension of the liquid flow passage. At least part of the lateral wall is located above the first inflow port. In the pressure chamber, the first liquid flows in contact with a pressure generating element while the second liquid flows closer to the ejection port than the first liquid does.

There is provided a method for manufacturing a liquid discharge head including a liquid discharge head substrate and a flow path forming member, the liquid discharge head substrate having a base, a pressure generation portion provided at a front surface of the base to generate pressure for discharging a liquid, and a supply port for supplying the liquid to the pressure generation portion, and the flow path forming member forming a flow path for feeding the liquid supplied from the supply port to the pressure generation portion. The method includes removing a sacrificial layer by etching the base from a back surface of the base, in a state in which an end covering portion of a cover layer for covering the sacrificial layer is covered with the resin layer. The method suppresses formation of a crack in the end covering portion that covers the end portion of the sacrificial layer.

A fluid ejection device includes a fluid slot, a first fluid ejection chamber communicated with the fluid slot and including a first drop ejecting element, a second fluid ejection chamber including a second drop ejecting element, and a fluid circulation path including a first portion communicated with the fluid slot and the second fluid ejection chamber, and a second portion communicated with the first fluid ejection chamber and the second fluid ejection chamber, with the fluid circulation path including a fluid circulating element within the first portion.

A method of manufacturing an inkjet head substrate is provided. The inkjet head substrate includes an ink supply port having a through portion and a non-through portion, and the non-through portion is disposed at a position closer than the through portion to the energy generating element. The method includes disposing a mask having an opening that has a relatively large opening-width portion and a relatively small opening-width portion. The method also includes forming the through portion in the substrate at a position corresponding to the relatively large opening-width portion and the non-through portion in the substrate at a position corresponding to the relatively small opening-width portion by performing reactive ion etching on the substrate through the opening of the mask in one operation.

There is provided a liquid jetting apparatus, including: a first pressure chamber and a second pressure chamber arranged in a first direction; a first insulating film covering the first and second pressure chambers; a first piezoelectric element arranged to face the first pressure chamber with the first insulating film being intervened therebetween; a second piezoelectric element arranged to face the second pressure chamber with the first insulating film being intervened therebetween; a trace arranged between the first and the second piezoelectric elements adjacent to each other in the first direction; and a second insulating film covering the trace. An end, in the first direction, of a part of the second insulating film covering the trace between the first piezoelectric element and the second piezoelectric element is positioned inside an end of a partition wall partitioning the first pressure chamber and the second pressure chamber.

In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.

A liquid ejection apparatus is disclosed. One apparatus includes a piezoelectric element. The piezoelectric element includes an upper electrode and a lower electrode. The lower electrode has a partial overlapping portion and a non-overlapping portion. The partial overlapping portion at least partially overlaps the pressure chamber. The partial overlapping portion of the lower electrode has two ends in the transverse direction. The upper electrode has two ends in the transverse direction. A distance from the center of the pressure chamber in the transverse direction to one of the two ends of the upper electrode in the transverse direction is smaller than a distance from the center of the pressure chamber in the transverse direction to a corresponding one of the two ends of the partial overlapping portion in the transverse direction.

A bonding structure includes a first part including a first bonding surface and a second part including a second bonding surface to be bonded to the first bonding surface of the first part with a first adhesive and a second adhesive different from the first adhesive. At least one of the first bonding surface and the second bonding surface includes a first region on which the first adhesive is applied, a second region on which the second adhesive is applied, and a third region disposed between the first region and the second region, the third region having a water repellency higher than a water repellency of each of the first region and the second region.

In one example in accordance with the present disclosure, a fluidic ejection device is described. The device includes a fluidic ejection die embedded in a moldable material. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages. The device also includes the moldable material which includes supply slots to deliver fluid to and from the fluidic ejection die. A carrier substrate of the device supports the fluidic ejection die and moldable material.