Examples include a fluid die embedded in a molded panel. The fluid die includes a substrate, and the substrate includes a first surface. The molded panel surrounding sides of the fluid die such that the first surface is disposed below a top surface of the molded panel. A raised contact formation is disposed on the substrate to extend at least up to the top surface of the molded panel.

A liquid ejection apparatus is disclosed. One apparatus includes a piezoelectric element. The piezoelectric element includes an upper electrode and a lower electrode. The lower electrode has a partial overlapping portion and a non-overlapping portion. The partial overlapping portion at least partially overlaps the pressure chamber. The partial overlapping portion of the lower electrode has two ends in the transverse direction. The upper electrode has two ends in the transverse direction. A distance from the center of the pressure chamber in the transverse direction to one of the two ends of the upper electrode in the transverse direction is smaller than a distance from the center of the pressure chamber in the transverse direction to a corresponding one of the two ends of the partial overlapping portion in the transverse direction.

Systems and methods for optimizing morphology and electrical properties of silver printed on a substrate with a particular implementation in photovoltaic manufacturing techniques. The system comprises a substrate, a printer jet head having a nozzle to dispense a reactive metal ink and a solvent onto the substrate, and wherein the solvent and a temperature of the substrate are controlled during deposition of the reactive metal ink onto the substrate to produce a dense film in the absence of sintering.

There are provided a head chip and a method of manufacturing the same, a liquid jet head, and a liquid jet recording device each capable of suppressing a stray capacitance to improve the image quality. The head chip according to an embodiment of the present disclosure is a head chip having an actuator plate adapted to apply pressure to liquid to jet the liquid. The actuator plate includes an obverse surface and a reverse surface, a channel extending in a predetermined direction and having a first opening provided to the obverse surface and a second opening which is provided to the reverse surface and is shorter in length in the predetermined direction than the first opening, and an electrode having an obverse surface side part disposed on a sidewall of the channel on the first opening side, and a reverse surface side part which is disposed on the sidewall closer to the second opening than the obverse surface side part and is one of equal to and larger than the obverse surface side part in size in the predetermined direction.

There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid. Forming the actuator plate includes forming a plurality of grooves on a surface of a piezoelectric substrate having one end and the other end so as to extend from the one end side toward the other end side, forming a conductive film on the surface of the piezoelectric substrate provided with the plurality of grooves, forming a laser processing area in the conductive film between the grooves adjacent to each other by performing laser processing from a start point on the one end side of the piezoelectric substrate to an end point on the other end side, and forming a surface removal area in at least a part including the start point and the end point out of the surface of the piezoelectric substrate by performing surface removal processing in a direction crossing the direction in which the laser processing is performed.

In one example, a fluid flow structure includes a micro device embedded in a printed circuit board (PCB). Fluid may flow to the micro device through a channel in the PCB and a PCB conductor is connected to a conductor on the embedded micro device.

There is provided a liquid jetting apparatus, including: a first pressure chamber and a second pressure chamber arranged in a first direction; a first insulating film covering the first and second pressure chambers; a first piezoelectric element arranged to face the first pressure chamber with the first insulating film being intervened therebetween; a second piezoelectric element arranged to face the second pressure chamber with the first insulating film being intervened therebetween; a trace arranged between the first and the second piezoelectric elements adjacent to each other in the first direction; and a second insulating film covering the trace. An end, in the first direction, of a part of the second insulating film covering the trace between the first piezoelectric element and the second piezoelectric element is positioned inside an end of a partition wall partitioning the first pressure chamber and the second pressure chamber.

A method of making a fluid channel in a printhead structure includes positioning a printhead die on a carrier; compression molding the die into a molded printhead structure; compression molding a first segment of a fluid channel into the molded printhead structure simultaneously with compression molding the die; and materially ablating a second segment of the fluid channel to couple the channel with a fluid feed hole in the die.

An actuator includes a diaphragm, a lower electrode on the diaphragm, an electromechanical transducer film on the lower electrode, and an upper electrode on the electromechanical transducer film. The diaphragm includes a first silicon oxide film having a thickness of 0.5 m or more, a silicon layer on the first silicon oxide film, a thickness of which is 3 m or more, and a second silicon oxide film on the silicon layer, a thickness of which is 0.5 m or more. A volume resistivity of the silicon layer is 10.sup.3 .Math.cm or more and 10.sup.6 .Math.cm or less.

A method for manufacturing an element substrate of a liquid ejection head, the method includes forming a silicon-based film layer including carbon on one surface of a base substrate, laminating a silicon substrate on the film layer formed on the one surface of the base substrate and bonding the silicon substrate to the film layer, processing the silicon substrate bonded to the film layer using the film layer as a stop layer and forming a lower hole portion, processing the base substrate using the film layer as the stop layer and removing the base substrate to expose the film layer, and forming an opening portion communicating with the lower hole portion in the exposed film layer.