B41J2/1607

Liquid ejecting head chip, liquid ejecting head, liquid ejecting apparatus, and manufacturing method of liquid ejecting head chip

According to an embodiment, an ink jet head (liquid ejecting head) includes an actuator plate and a cover plate (see FIG. 8). As illustrated in FIG. 1, channel grooves for a discharge channel (ejection channel) and a non-discharge channel (non-ejection channel) in a Z-direction are formed on a front surface of the actuator plate, so as to be alternately arranged in an X-direction, by cutting with a dicing blade or the like. The discharge channel and the non-discharge channel are formed to have a groove width W of smaller than 70 m, in order to correspond to high density of nozzles. In the embodiment, the discharge channel and the non-discharge channel are formed to have a groove width of 55 m, 50 m, or 40 m, for example.

Liquid ejecting head, manufacturing method thereof, and liquid ejecting apparatus
10507655 · 2019-12-17 · ·

There are provided a conductive base; a plurality of head main bodies which are held by the base and each have a switching element and a pressure generating element for discharging a liquid in a pressure generating chamber; a plurality of covers which are separated from the base, at least one of the pressure generating element and the switching element being sandwiched between the base and each of the covers; and a plurality of conduction portions which each conduct the base and the cover to each other at a plurality of locations.

LIQUID JET HEAD, LIQUID JET RECORDING DEVICE, AND METHOD OF MANUFACTURING LIQUID JET HEAD
20240100828 · 2024-03-28 ·

An occurrence of leakage is prevented. An inkjet head jets ink. The inkjet head is provided with a head main body, a cooling pipe, a jet-side coupling member, and a cooling-side coupling member, wherein the head main body has a jet flow path through which the ink passes, the cooling pipe has a cooling flow path through which the ink passes as a cooling medium for cooling a drive circuit, the jet-side coupling member is coupled to the head main body, a jet-side branch path branches from an ink flow path into which the ink inflows from an outside of the inkjet head, or from which the ink outflows, the jet-side branch path is communicated with the jet flow path, the jet-side branch path is provided to the jet-side coupling member, and the cooling-side coupling member is coupled to the jet-side coupling member, and is provided with a cooling-side branch path which branches from the ink flow path, and which is communicated with the cooling flow path. The cooling-side coupling member has a coupling surface along one surface of the jet-side coupling member, and along a direction perpendicular to the cooling pipe.

Liquid ejection head and process for producing liquid ejection head

A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.

LIQUID EJECTION HEAD AND PROCESS FOR PRODUCING LIQUID EJECTION HEAD
20240092080 · 2024-03-21 ·

A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.

LIQUID EJECTION HEAD AND PROCESS FOR PRODUCING LIQUID EJECTION HEAD
20240083167 · 2024-03-14 ·

A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.

Method of manufacturing liquid jet head chip, liquid jet head chip, liquid jet head, and liquid jet recording device
11919306 · 2024-03-05 · ·

The trouble of removing a protective film such as a poly-paraxylene film from the part not requiring the protective film is reduced. A method of manufacturing a head chip according to an aspect of the present disclosure includes a substrate preparation step of preparing an actuator plate substrate having a jet channel communicated with a nozzle hole configured to jet ink, and a non-jet channel which does not jet the ink, and a protective film formation step of forming a protective film configured to protect a common electrode formed on an inner surface of the jet channel from the ink in a state in which the jet channel is exposed and the non-jet channel is covered after the substrate preparation step.

LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING THE SAME
20240066870 · 2024-02-29 ·

A liquid ejection head includes a recording element substrate and a supporting member. The recording element substrate includes ejection ports that eject liquid, pressure chambers that communicate with respective ejection ports and are supplied with the liquid, and a liquid supply path that supplies the liquid to the pressure chambers. The supporting member is joined with the recording element substrate via an adhesive. The liquid supply path faces a joining portion of the recording element substrate and the supporting member, and includes at least one recess portion on an inner surface of the liquid supply path.

LIQUID EJECTION UNIT AND MANUFACTURING METHOD OF THE SAME
20240051296 · 2024-02-15 ·

A manufacturing method of a liquid ejection unit includes: arranging an electric wiring board on a print element board such that the electric wiring board abuts the print element board, the print element board including an ejection port configured to eject liquid, an energy generating element configured to generate energy for ejecting the liquid from the ejection port, and an electrode pad electrically connected to the energy generating element, the electric wiring board including a terminal for electrical connection to the electrode pad; connecting the electrode pad and the terminal to each other by using an electric connection member; and covering an electric connection portion with a sealing agent, the electric connection portion including at least the electric connection member, the electrode pad, and the terminal, in which in the connecting, the electric connection member is shaped to include at least one bending point.

Molded die slivers with exposed front and back surfaces

In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.