In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.

A fluid ejection assembly may include a fluid ejection die comprising a back face and a front face through which fluid is ejected. The fluid ejection die may further include a fan-out fluid passages converging towards the back face of the fluid ejection die, the fan-out fluid passages comprising a first fan-out fluid passage and a second fan-out fluid passage and a recirculation channel extending within a polymeric material from the first fan-out fluid passage to the second fan-out fluid passage adjacent the back face of the fluid ejection die.

At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.

Examples include a fluidic device comprising a fluidic die, a support element, and a conductive member. The support element is coupled to the fluidic die, and the support element has a fluid channel formed therein. The fluid channel exposes at least a portion of a back surface of the fluidic die. The support element further includes a member opening passing therethrough. The conductive member is connected to the fluidic die, and the conductive member is a least partially disposed in the member opening such that a portion of the conductive member is exposed to the fluid channel of the support element.

An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten μm and two hundred μm, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.

In one example in accordance with the present disclosure, a fluidic ejection device is described. The device includes a fluidic ejection die embedded in a moldable material. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages. The device also includes the moldable material which includes supply slots to deliver fluid to and from the fluidic ejection die. A carrier substrate of the device supports the fluidic ejection die and moldable material.

An element substrate is bonded to a support substrate with high positional accuracy. A manufacturing method of the liquid ejecting head includes curing a first adhesive, which is in contact with an element substrate and a support substrate, at a first temperature to perform first temporary fixing, heating a second adhesive, which is in contact with the element substrate and the support substrate, to a second temperature higher than the first temperature so as to cure the second adhesive and perform second temporary fixing and heating a third adhesive, which is in contact with the element substrate and the support substrate, to a third temperature higher than the second temperature so as to cure the third adhesive and bond the element substrate to the support substrate. An elastic modulus of the second adhesive is larger than an elastic modulus of the first adhesive at the second temperature.

In one example in accordance with the present disclosure, a fluidic die assembly is described. The fluidic die assembly includes a rigid substrate having a bend therein. A fluidic die is disposed on the rigid substrate. The fluidic die is to eject fluid from a reservoir fluidly coupled to the fluidic die. The fluidic die includes an array of ejection subassemblies. Each ejection subassembly includes an ejection chamber to hold a volume of fluid, an opening, and a fluid actuator to eject a portion of the volume of fluid through the opening. The fluidic die assembly also includes an electrical interface disposed on the rigid substrate to establish an electrical connection between the fluidic die and a controller. The fluidic die and the electrical interface are disposed on a same surface on opposite sides of the bend.

Examples include a fluid die embedded in a molded panel. The fluid die includes a substrate, and the substrate includes a first surface. The molded panel surrounding sides of the fluid die such that the first surface is disposed below a top surface of the molded panel. A raised contact formation is disposed on the substrate to extend at least up to the top surface of the molded panel.

A piezoelectric element includes a first electrode disposed at a base body, a second electrode, and a piezoelectric layer disposed between the first electrode and the second electrode. The piezoelectric layer includes a first piezoelectric layer containing a complex oxide having a perovskite structure that contains lead, zirconium, and titanium and a second piezoelectric layer containing a complex oxide having a perovskite structure that is denoted by formula (1) below. The first piezoelectric layer is disposed between the first electrode and the second piezoelectric layer and is preferentially oriented to (100) when the crystal structure of the first piezoelectric layer is assumed to be pseudo-cubic,
xPb(Mg,Nb)O.sub.3-yPbZrO.sub.3-zPbTiO.sub.3  (1)
where in formula (1), 0<x,y,z<1 and x+y+z=1.