In a liquid ejection head, a substrate is provided with a first inflow port located on an upstream side of a pressure chamber with respect to a direction of flow of liquids in a liquid flow passage and configured to allow a first liquid to flow into the liquid flow passage, a second inflow port located on the upstream side of the first inflow port and configured to allow a second liquid to flow into the liquid flow passage, and a lateral wall extending in a direction of extension of the liquid flow passage. At least part of the lateral wall is located above the first inflow port. In the pressure chamber, the first liquid flows in contact with a pressure generating element while the second liquid flows closer to the ejection port than the first liquid does.

In one example, a fluid flow structure includes a micro device embedded in a monolithic molding having a channel therein through which fluid may flow directly to the device.

Systems and methods for optimizing morphology and electrical properties of silver printed on a substrate with a particular implementation in photovoltaic manufacturing techniques. The system comprises a substrate, a printer jet head having a nozzle to dispense a reactive metal ink and a solvent onto the substrate, and wherein the solvent and a temperature of the substrate are controlled during deposition of the reactive metal ink onto the substrate to produce a dense film in the absence of sintering.

A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.

Examples include a fluidic device comprising a fluidic die, a support element, and a conductive member. The support element is coupled to the fluidic die, and the support element has a fluid channel formed therein. The fluid channel exposes at least a portion of aback surface of the fluidic die. The support element further includes a member opening passing therethrough. The conductive member is connected to the fluidic die, and the conductive member is a least partially disposed in the member opening such that a portion of the conductive member is exposed to the fluid channel of the support element.

A method of manufacturing a liquid ejection head including a first step of having a molten resin becoming a first portion flow in between a first position in a first mold and a first position in a second mold and the molten resin becoming a second portion flow in between a second position in the first mold and a second position in the second mold; a second step of relatively moving the first and second molds, after opening the molds; a third step of closing the molds; a fourth step of joining the first and second portions, a fifth step of taking out the first and second portions and the sealing portion from the molds and mounting a recording element substrate; and a step of forming a space portion between a liquid supply path surface and a mounting surface.

An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and separated from the fluidic die. A conductive lead may provide an electrical coupling between a ground of the fluidic die and the conductive element.

An actuator includes a substrate, a diaphragm on the substrate, a lower electrode on the diaphragm, a piezoelectric body on the lower electrode, and an upper electrode on the piezoelectric body. A ratio of lead (Pb) and zirconium (Zr) in atomic percent (atm %) present at a grain boundary in the piezoelectric body satisfies a relation of Pb/Zr>1.7.

A manufacturing method of a liquid ejecting head which has a nozzle and a liquid flow path having a pressure chamber to which a pressure for ejecting droplets from the nozzle is applied, and where a first flow path substrate and a second flow path substrate are bonded to each other, the method including: a direct bonding step of directly bonding the first flow path substrate and the second flow path substrate without using an adhesive; and a thinning step of making the second flow path substrate thinner than the first flow path substrate after the direct bonding step.

In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.