A liquid discharge head includes a nozzle plate, an individual liquid chamber, and an actuator. The nozzle plate has a nozzle on a liquid discharge face and a through hole communicating with the nozzle and penetrating the nozzle plate. The nozzle plate includes a substrate including a first silicon layer on a side of the liquid discharge face, a second silicon layer, a first silicon oxide film layer, and a second silicon oxide layer on a surface of the second silicon layer different from a surface of the second silicon layer in contact with the first silicon oxide film layer. A thickness of the first silicon layer is smaller than a thickness of the second silicon layer. A portion of the through hole penetrating the first silicon layer has a smaller diameter than a portion of the through hole penetrating the second silicon layer.

A liquid ejecting head including a nozzle configured to eject a liquid, a liquid flow path communicating with the nozzle, a communication chamber including a communication port configured to communicate with atmospheric air, a partitioning wall portion provided between the liquid flow path and the communication chamber, the partitioning wall portion including an opening portion that communicates the liquid flow path and the communication chamber to each other, and an elastic member closing the opening portion.

In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.

A liquid ejecting head includes a driving substrate including a driving element configured to, in response to a signal from an external controller, expand or contract so that a liquid is discharged from a pressure chamber through a nozzle, and a connection portion connecting the driving element to a wiring substrate connectable to the external controller; a sealing member that covers the connection portion and a part of the wiring substrate; and a mask plate partially covering a part of the driving substrate including the connection portion and contacting the sealing member.

A fluid ejection device includes a fluid ejection die including a first end portion positioned adjacent a first end of the fluid ejection die, and a fluid ejection portion positioned adjacent the first end portion. The fluid ejection die includes a contact pad positioned in the first end portion, and a fluid actuation device positioned in the fluid ejection portion. A carrier is attached to the fluid ejection die. The carrier includes a slot to provide fluid to the fluid actuation device. The slot extends longitudinally along the fluid ejection portion to a first slot end. A length from the first slot end to the first end of the fluid ejection die is less than 1.5 mm.

Disclosed is a method of manufacturing, a metal nozzle plate, in which is formed a nozzle for discharging a liquid and that is to be bonded with adhesive to a head chip provided with an actuator for discharging the liquid, the method including: forming the nozzle in a metal plate-like member; forming a groove in the metal plate-like member; and performing exterior processing with respect to the nozzle plate.

Provided is an inkjet head containing: a substrate having a nozzle hole, and a nozzle plate having a liquid repellent layer on an outermost surface of the substrate on an ink discharge surface side, wherein the nozzle plate has a conductive layer between the substrate and the liquid repellent layer.

Systems and methods are provided for cover plates for printheads. One embodiment is an apparatus that includes a cover plate for a printhead. The cover plate includes multiple layers of electrically conductive material, a layer of nonconductive ferrite that is sandwiched between the multiple layers, and at least one connector that penetrates through the multiple layers and the layer of nonconductive ferrite to form a conductive pathway for electric current between the multiple layers through the layer of nonconductive ferrite. The cover plate also includes at least one opening that penetrates through the multiple layers and the layer of nonconductive ferrite, and that is configured to align with nozzles of the printhead.

An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and be coupled to a ground of the fluidic die. A material and size of the conductive element may be selected to engender galvanic effect at an approximately zero potential.

A liquid injection head improving electric reliability includes: a substrate including: energy generating elements configured to apply energy for ejection to a liquid, and a substrate upper surface on which terminals respectively connected to electric wirings are provided, an ejection port forming member having: an ejection port forming surface in which the ejection ports for ejecting a liquid are formed, and a back surface on a side opposite to the ejection port forming surface, which is arranged so as to opposite to the substrate upper surface, and a sealant configured to cover connecting portions between the electric wirings and the terminals.