A liquid discharge head including: a film member including a discharge hole configured to discharge liquid; and a displacement member configured to displace a position of the film member to discharge the liquid from the discharge hole, wherein an edge of the film member forming the discharge hole has a curve in a cross section of the film member in a thickness direction of the film member, and a surface of the film member includes a passive film.

A method for forming a fluid flow structure may include positioning rows of micro devices in a mold, wherein each of the micro devices comprising a chamber layer in which an ejection chamber is formed and an orifice layer over the chamber layer in which an orifice is formed. The method may further include molding an amorphous body to encapsulate the rows of the micro devices such that the amorphous body forms fluid channels such that each of the rows is fluidically coupled to a different one of the fluid channels.

Methods for manufacturing a microfluidic delivery device comprising a semiconductor structure, such as silicon, are provided. In particular, the structure for delivering fluid may be formed from polycrystalline silicon, also called polysilicon, or epitaxial silicon. The microfluidic delivery device that predominantly uses semiconductor material, such as silicon, to form the structures that are in contact with the dispensed fluid results in a device that is compatible with a wide set of fluids and applications.

Provided is an inkjet head containing a nozzle plate having at least a substrate, wherein the nozzle plate has a liquid-repellent layer on an outermost surface of the substrate on an ink ejection surface side; a liquid-repellent layer base film is provided between the substrate and the liquid-repellent layer; and the liquid-repellent layer base film contains at least silicon (Si) and carbon (C), and having a maximum peak P of a binding energy of a Si2p orbital of a surface portion measured by X-ray photoelectron spectroscopy is in the range represented by the following Formula (1), Formula (1): 99.6 (eV)≤P≤101.9 (eV).

A liquid ejection head includes: a substrate in which a supply path which opens on a first surface and supplies an ejection liquid is formed; an insulating layer provided on the first surface of the substrate; an energy generating element provided on a surface of the insulating layer; an electric wiring layer electrically connected to the energy generating element and electrically insulated from the ejection liquid by the insulating layer; and an ejection orifice member which forms an ejection orifice and forms a flow path of the ejection liquid from an opening of the supply path to a formation position of the energy generating element. In the vicinity of the opening of the supply path, the insulating layer forms a recessed region by being dented closer to the substrate than the surface on which the energy generating element is provided or by being removed.

The present application relates to a method of manufacturing an ink-jet printhead comprising: providing a silicon substrate (10) including active ejecting elements (11); providing a hydraulic structure layer (20) for defining hydraulic circuits configured to enable a guided flow of ink; providing a silicon orifice plate (30) having a plurality of nozzles (31) for ejection of the ink; assembling the silicon substrate (10) with the hydraulic structure layer (20) and the silicon orifice plate (30); wherein providing the silicon orifice plate (30) comprises: providing a silicon wafer (40) having a planar extension delimited by a first surface (41) and a second surface (42) on opposite sides of the silicon wafer (40); performing a thinning step at the second surface (42) so as to remove from the second surface (42) a central portion (43) having a preset height (H), the silicon wafer (40) being formed, following the thinning step, by a base portion (44) having a planar extension and a peripheral portion (45) extending from the base portion (44), transversally with respect to the planar extension of the base portion (44); and forming in the silicon wafer (40) a plurality of through holes, each defining a respective nozzle (31) for ejection of the ink. The method according to the present invention is characterized in that the silicon wafer (40) is a silicon-on-insulator wafer, wherein the silicon-on-insulator wafer comprises a silicon device layer (38) adjacent to the first surface (41), a silicon handle layer (37) adjacent to the second surface (42) and an insulator layer (39) in-between.

A fluid ejection apparatus includes a plurality of fluid ejectors. Each fluid ejector includes a pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber. The fluid ejection apparatus includes a feed channel fluidically connected to each pumping chamber; and at least one compliant structure formed in a surface of the feed channel. The at least one compliant structure has a lower compliance than the surface of the feed channel.

There is provided a liquid discharge head including a substrate having a pressure chamber, an actuator, and a channel member. The actuator has a first film arranged on the substrate and a second film arranged on a surface of the first film. The substrate and the channel member are attached to each other with an adhesive. A first through hole is formed in a part of the first film, and a second through hole is formed in a part of the second film. An edge of the first through hole is positioned further inward of the second through hole than an edge of the second through hole. The adhesive is applied to a part of the surface of the first film overlapping with the second through hole, so as to cover a boundary part between the first and second films.

Provided is a liquid ejection head substrate including: a substrate; a liquid ejection element that generates liquid ejection energy on the substrate; and an electrode pad that is electrically connected to the liquid ejection element, in which the electrode pad includes a barrier metal layer and a bonding layer on the barrier metal layer, and an end side surface of the barrier metal layer is covered with a silicon-based film containing carbon.

A liquid discharge head includes a channel forming member made of silicon, the channel forming member including a plurality of liquid channels, a natural oxide film having a film thickness of 2 nm or more on an outermost surface of the plurality of liquid channels of the channel forming member, and a surface treatment film on the natural oxide film to contact the natural oxide film. Each of a carbon content and a fluorine content in an interface between the natural oxide film and the surface treatment film is 5 atomic % or less.