Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.

An inkjet nozzle device includes a main chamber having a floor, a roof and a perimeter wall extending between the floor and the roof The main chamber includes: a firing chamber having a nozzle aperture defined in the roof and an actuator for ejection of ink through the nozzle aperture; an antechamber for supplying ink to the firing chamber, the antechamber having a main chamber inlet defined in the floor; and a baffle structure partitioning the main chamber to define the firing chamber and the antechamber, the baffle structure extending between the floor and the roof. The firing chamber and the antechamber have a common plane of symmetry.

A flow path formation substrate to which a nozzle plate is mounted includes a pressure chamber per nozzle, an individual supply path leading to the pressure chamber, an individual recovery path communicating with a flow channel near the nozzle. A conduction unit electrically coupled through a lead electrode to a pressure generator causing a pressure of the pressure chamber to vary is located at a position where the conduction unit overlaps with a flow path area of at least one individual flow path of the individual supply path or the individual recovery path in a plan view from a lamination direction in which the nozzle plate and the flow path formation substrate are laminated.

A liquid ejection head including: a substrate; an energy generating element, which is provided on the substrate and is utilized to eject liquid; a first film provided on the energy generating element; a flow path forming member, which has an ejection orifice from which the liquid is ejected and forms a flow path of the liquid between the substrate and the flow path forming member; and an electrode, which generates a flow of the liquid, wherein the electrode includes the first film.

A method of manufacturing a semiconductor substrate includes: forming a barrier metal layer on a semiconductor substrate; forming a resist mask on the barrier metal layer; performing dry etching on a portion of the barrier metal layer, which is exposed from an opening portion of the resist mask, so that the dry etching is prevented from reaching a top surface of a layer immediately under the barrier metal layer; performing wet etching on a portion of the barrier metal layer exposed by the dry etching so that the wet etching reaches the top surface of the layer immediately under the barrier metal layer and a portion of the barrier metal layer remains; and stripping the resist mask.

A hydrophilic coating material including an alginic acid compound and a resin, in which the alginic acid compound is granulated and dispersed in the resin. In a coating film using the material, it is preferred that the granulated alginic acid compound is exposed on the surface. Such a hydrophilic coating film is suitable as a hydrophilization treatment film of a nozzle face surface of an inkjet recording head.

A liquid ejecting head including a nozzle configured to eject a liquid, a liquid flow path communicating with the nozzle, a communication chamber including a communication port configured to communicate with atmospheric air, a partitioning wall portion provided between the liquid flow path and the communication chamber, the partitioning wall portion including an opening portion that communicates the liquid flow path and the communication chamber to each other, and an elastic member closing the opening portion.

There is provided a liquid discharge head including a substrate having a pressure chamber, an actuator, and a channel member. The actuator has a first film arranged on the substrate and a second film arranged on a surface of the first film. The substrate and the channel member are attached to each other with an adhesive. A first through hole is formed in a part of the first film, and a second through hole is formed in a part of the second film. An edge of the first through hole is positioned further inward of the second through hole than an edge of the second through hole. The adhesive is applied to a part of the surface of the first film overlapping with the second through hole, so as to cover a boundary part between the first and second films.

Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.

A liquid ejection head is manufactured by forming on a substrate an energy generating element for ejecting a liquid, an integrated circuit for driving the energy generating element, a supply port for the liquid so as to penetrate through the substrate, an electrode for generating a liquid flow, and a flow path forming member having an ejection orifice for ejecting the liquid such that a flow path for the liquid is formed between the substrate and the flow path forming member. The electrode is formed over high and low of a stepped shape formed on the substrate in at least one step selected from the steps of forming the energy generating element, forming the integrated circuit and forming the supply port.