In a substrate of a liquid ejection head, there are formed a first through hole which constitutes a liquid supply path, and a second through hole in which a through-hole electrode electrically connected to a wiring layer is formed on the inner surface. The first through hole has a first hole having a first opening and a second hole having a second opening, and the second through hole has a third hole having a third opening and a fourth hole having a fourth opening. When the minimum width of the first opening is represented by D1, the minimum width of the second opening is represented by D2, the minimum width of the third opening is represented by D3, and the minimum width of the fourth opening is represented by D4, the first to fourth openings satisfy a relation of

D1>D3>D4>D2.

A piezoelectric device includes a pressure chamber forming substrate in which a pressure chamber empty portion is formed, a vibrating plate that is formed on the pressure chamber forming substrate, corresponding to the pressure chamber empty portion, and a piezoelectric element that is formed on the vibrating plate, corresponding to the pressure chamber empty portion, in which the vibrating plate is provided with a concave portion having a bottom portion which is overlapped with the pressure chamber empty portion, and is larger than the pressure chamber empty portion in a planar view, and a wall portion which surrounds the bottom portion, on the pressure chamber empty portion side, the wall portion has a curved surface that is inclined to widen in a direction toward the pressure chamber empty portion from the bottom portion, and a curvature radius of the curved surface is 60 nm to 1000 nm.

A fluid ejection apparatus includes a fluid ejector comprising a pumping chamber, an ejection nozzle coupled to the pumping chamber, and an actuator configured to cause fluid to be ejected from the pumping chamber through the ejection nozzle. The fluid ejection apparatus includes a first compliant assembly formed in a surface of an inlet feed channel, the inlet feed channel fluidically connected to a fluid inlet of the pumping chamber; and a second compliant assembly formed in a surface of an outlet feed channel, the outlet feed channel fluidically connected to a fluid outlet of the pumping chamber. A compliance of the first compliant assembly is different from a compliance of the second compliant assembly.

A method of making a fluid channel in a printhead structure includes positioning a printhead die on a carrier; compression molding the die into a molded printhead structure; compression molding a first segment of a fluid channel into the molded printhead structure simultaneously with compression molding the die; and materially ablating a second segment of the fluid channel to couple the channel with a fluid feed hole in the die.

A method for forming a pattern in which a plating layer is selectively formed on a base material using a resin layer as a mask, includes resin layer-forming in which the resin layer is formed on the base material; and patterning in which the resin layer is selectively removed, in which in the patterning, a part of the resin layer is sublimed by heating to be removed.

In a method of manufacturing a liquid ejection head including transferring a dry film for forming a partial structure of a liquid ejection head from a support to a substrate, the dry film with the support is bonded on a processing surface of the substrate with forming a projection part in which peripheral edges of the dry film and the support protrude further outside than a peripheral edge of the processing surface; the projection part is cut at a cutting position between an outer edge of the projection part and the peripheral edge of the processing surface to form a remaining projection part, and the support is peeled from the substrate with the remaining projection part as a start position to leave the dry film on the processing surface which forms the partial structure of the liquid ejection head.

Examples include a process comprising forming a molded panel that includes a fluid ejection die molded in the molded panel. The molded panel is formed with a mold chase and a release liner. The mold chase has a fluid slot feature that aligns with fluid feed holes of the fluid ejection die. The mold chase and release liner is released from the molded panel such that the molded panel has a fluid slot formed therethrough corresponding to the fluid slot feature of the mold chase, and the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die.

Example implementations relate to liquid adsorption. In an example, a liquid adsorption system includes a vapor barrier container having a sealable internal volume, a liquid dispensing device in the internal volume, where the liquid dispensing device includes liquid in a liquid flow path extending through at least a portion of the liquid dispensing device to an opening in communication with the internal volume, and a liquid adsorbing material in the internal volume.

Provided are a lower price liquid ejection head and a method of manufacturing the liquid ejection head. To this end, an ejection port board is provided with an expanded portion that communicates with a supply port and has a larger open end than an opening of the supply port.

A liquid discharge head includes a substrate that is provided with a supply passage having an opening; an energy generating element that is disposed on a surface of the substrate; an electric wiring layer; an insulation layer; and a discharge port member that forms a discharge port. The insulation layer has an end portion adjacent to the opening of the supply passage and set back from an edge of the opening of the supply passage toward a side where the energy generating element is disposed. The electric wiring layer includes a plurality of electric wiring layers layered on each other.