In an example, a method for making a fluid ejection apparatus may include forming a molding material over a fluid passage on a back surface of printhead die, embedding the printhead die in an encapsulant in a cavity in a printed circuit board such that at least one drop ejector of the printhead die is exposed at a front side of the printed circuit board, removing the encapsulant at a back side of the printed circuit board to expose the molding material, and removing the molding material to form a fluid feed slot through which fluid may flow to the fluid passage opening in the printhead die.

The method of manufacturing a liquid ejection head according to the invention includes a bonding step, that is, a step of placing a plurality of element substrates on an adhesive layer formed on a bonding surface and heating the adhesive layer to bond the element substrates to a base material. The bonding step is started from one or two of a plurality of bonding regions located at the center portion of the base material in an arrangement direction of the element substrates and then performed toward the bonding regions located at both end portions of the base material.

A printhead includes one or multiple printhead dies and an overmolded panel around the printhead dies. The printhead dies are each to eject a corresponding type of fluid. The overmolded panel has one or multiple wide slots respectively corresponding to the printhead dies. Each wide slot is to supply fluid of the corresponding type to the printhead die to which the wide slot corresponds.

A method for manufacturing liquid ejection heads includes the steps of forming ejection port members on a substrate, the ejection port members each having a liquid channel and an ejection port for ejecting liquid through the channel, the liquid channel communicating with the substrate; forming supply ports passing through the substrate to supply liquid to the channels; and forming a separation groove in the substrate to separate the substrate for each liquid ejection head. The step of forming the ejection port members includes the step of hardening a material constituting the ejection port member by heat treatment. The step of forming the separation groove is performed before the step of hardening.

In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.

In order that the interior of a cap member, in a case where the cap member abuts to a cover member, is allowed to have improved airtightness so that the cap member can sufficiently function, a sealing member is used to seal between the cover member and first and second flow path members for retaining the cover member.

Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.

A first channel member of a liquid ejection head includes a plurality of plates stacked through an adhesive. A first plate includes a second groove configuring the second common channel, and a plurality of first grooves which are communicated with the second groove from a wall surface of the second groove and individually configure a plurality of third individual channels. A second plate is bonded to a top surface of the first plate and configures an upper surface of the second common channel. The first plate includes an extension part which extends outward from the wall surface of the second groove between an end part position of one end of the second groove and a connection position closest to the end part position among connection positions of the plurality of first grooves with respect to the wall surface of the second groove.

A nozzle head includes a plate portion arranged in a plate shape, a droplet discharging nozzle portion located in the plate portion, the droplet discharging nozzle portion including a plurality of droplet discharging nozzles ejecting droplets by an electrostatic discharging method, and a pseudo-nozzle portion located around the droplet discharging nozzle portion in the plate portion and including a plurality of pseudo-nozzles. In the nozzle head described above, the plurality of droplet discharging nozzles may be arranged in line in a first direction, and the pseudo-nozzle portion may be arranged on both sides of the droplet discharging nozzle portion.

The present disclosure provides an inkjet head capable of continuously ejecting droplets at a high frequency even when an ink having high viscosity is used. The present is directed to an inkjet head characterized in that the inkjet head comprises a nozzle plate portion on which a nozzle for ejecting droplets is formed, a vibration plate disposed opposite to an inlet of the nozzle, a weight disposed in contact with the vibration plate, and an actuator in contact with the weight, wherein the actuator is driven by a drive signal to fly the weight to eject ink in the ink chamber formed between the nozzle plate portion and the vibration plate from the nozzle, and wherein a storage space in which the actuator is disposed is configured to be separated from the ink chamber by the vibration plate.