Aspects are directed to techniques for fabricating a microfluidic device on a substrate. In a particular example, a method of manufacturing a microfluidic device includes growing a thermal oxide layer on a substrate and depositing a dielectric layer, including doped a dielectric film, over the thermal oxide layer. Next, an aperture defined by a dielectric wall which forms part of the dielectric layer is formed in the dielectric layer by selectively removing the dielectric film. Finally, the aperture is sealed with a sealing film to prevent the dielectric film from being exposed to a fluid contained in the aperture. The sealing film may be of an electrically insulating material resistive to corrosive attributes of the fluid contained in the aperture.

Provided is a manufacturing method for a film containing a condensate of hydrolyzable silane compounds, the manufacturing method including: forming, on a base material, a layer containing a condensate of a hydrolyzable silane compound having an epoxy group and a hydrolyzable silane compound having a fluorine-containing group, and a solvent; and curing the layer, the solvent containing one of ethanol and methanol serving as a first alcohol component, and at least one kind of alcohol having a boiling point of from 90° C. to 200° C. serving as a second alcohol component, the solvent having a content of the second alcohol component of from 2.00 mass % to 60.00 mass %, the condensate having a degree of condensation of from 20% to 80%.

A manufacturing method of a liquid ejection head, which includes a step of preparing a substrate including a first layer, a step of forming a flow path mold for forming the flow path and a member located outside the mold with a gap between the mold and the member from the first layer, a step of providing a second layer so that the second layer fills the gap and covers the mold and the member located outside the mold with the gap between them, a step of forming an ejection orifice forming member for forming an ejection orifice from the second layer, a step of removing the member located outside the mold with the gap between them, and a step of forming a wall member located outside the ejection orifice forming member with at least a partial gap between the ejection orifice forming member and the wall member.

A liquid discharge head provided with a member having discharge ports formed configured to discharge liquid thereon, wherein a discharge port surface of the member having discharge ports arrayed thereon includes fumed silica.

In one example, a process for making a micro device structure includes molding a micro device in a monolithic body of material and forming a fluid flow passage in the body through which fluid can pass directly to the micro device.

To apply an anti-wetting coating to a substrate of a semiconductor material, a method includes applying to a support a solution of a hydrocarbon comprising at least one unsaturated bond and, optionally, at least one hetero-atom for obtaining a layer of hydrocarbons. The method also includes treating at least one surface of the substrate of the semiconductor material with an acid. The layer of hydrocarbons is transferred from the support to the surface of the substrate of the semiconductor material. The layer of hydrocarbons is chemically coupled with the surface of the substrate of the semiconductor material.

A nozzle plate includes, on a substrate: at least a base layer; an intermediate layer; and a liquid repellent layer. The base layer contains a silane coupling agent A having reactive functional groups at both terminals and including a hydrocarbon chain and a benzene ring at an intermediate part. The intermediate layer contains an inorganic oxide. The liquid repellent layer contains a fluorine (F)-containing coupling agent B.

In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.

A method for processing a silicon substrate includes forming a structure having a bottom surface and a depth of 200 μm or more or 300 μm or more from a first surface of a silicon substrate, forming a protective film on an inner wall of the structure, and performing plasma etching so as to selectively remove the protective film disposed on the bottom surface of the structure with respect to the protective film disposed on the substantially perpendicular side wall of the structure, wherein the plasma etching is performed under the condition in which plasma with a sheath length at least 10 times the depth when the depth is 200 μm or more, or at least 5 time the depth when the depth is 300 μm or more, is generated and a mean free path of ions generated in the plasma is longer than the sheath length.

A liquid ejecting head includes a plurality of actuators, a plurality of pressure chambers that are provided so as to correspond to the actuators, and communicate with a common liquid chamber, a first member that defines the common liquid chamber, and includes a compliance sheet that absorbs vibrations of liquid on an upstream side of the common liquid chamber, and an inlet that is formed so as to penetrate the compliance sheet, a canopy portion that is provided at an open peripheral edge of the inlet of the first member, and has a receiving surface to which the compliance sheet is joined, and a receiving portion that is provided opposite the inlet across the canopy portion, and receives liquid introduced from the inlet.