A thermal head includes: a substrate; a heat generating portion disposed on the substrate; a first electrode electrically connected to the heat generating portion; a driving IC which controls actuation of the heat generating portion; a first cover member which covers the driving IC; a connection member which is disposed on the substrate and has a connecting section electrically connected to a second electrode; and a second cover member which covers the connecting section and extends toward the first cover member. The second cover member includes a first portion and a second portion which is thinner than the first portion. The first portion is disposed next to the connection member. The second portion lies farther away from the connection member than the first portion, and includes an overlying part which overlies the first cover member.

Provided is a thermal print head including: a substrate having a convex part thereon; a wiring layer over the convex part; a heat storage layer over the wiring layer; a heating resistive part that is formed over the heat storage layer and is arranged along a main scanning direction; a first electrode in contact with the heating resistive part on one side in a sub-scanning direction; a second electrode in contact with the heating resistive part on another side in the sub-scanning direction; and a connection wiring formed in an opening that passes through the heating resistive part and the heat storage layer and reaches the wiring layer, in which the first electrode is electrically connected to the wiring layer via the connection wiring.

A thermal head includes a substrate, a bonding material, an electrically conductive member, and an aluminum electrode. The bonding material is positioned on the substrate and contains gold and tin. The electrically conductive member is positioned on the bonding material. The aluminum electrode is positioned on the substrate and electrically connected to the electrically conductive member via the bonding material.

A thermal print head includes: a substrate including a main surface; an insulating film arranged on the main surface; a first wiring layer arranged on the insulating film; a first interlayer insulating film arranged on the first wiring layer; a heat-generating body film; and a second wiring layer arranged on the first interlayer insulating film with the heat-generating body film interposed therebetween, wherein a bump is formed on the main surface, wherein the bump extends along a first direction in a plan view, wherein the second wiring layer extends along a second direction orthogonal to the first direction to intersect the bump in a plan view, and includes first, second, third, and fourth wirings arranged along the first direction, wherein the second wiring is located between the first wiring and the third wiring, and wherein the third wiring is located between the second wiring and the fourth wiring.

The present disclosure provides a thermal print head. The thermal print head includes: a substrate; a glaze layer, disposed on the substrate; and a wiring layer, disposed on the glaze layer. The wiring layer includes a plurality of bonding pads. The plurality of bonding pads are divided into a plurality of groups. Each of the plurality of groups includes a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad. A first group of the plurality of groups is adjacent to a second group of the plurality of groups along a first direction. The second bonding pad of the first group is located between a center of the first bonding pad of the first group and a center of the third bonding pad of the first group along the first direction.