A thermal print head includes: a head substrate on which a plurality of heating resistance units are formed; a heat sink thermally connected to the head substrate, a recess being formed in a back surface of the heat sink which faces a surface to which the head substrate is connected; a metal member arranged in the recess; and an adhesive arranged between a bottom surface of the recess and the metal member. The recess viewed from a direction perpendicular to the back surface includes: an area where the metal member is arranged, and a groove area where the metal member is not arranged. A portion of the adhesive is arranged in the groove area.

A thermal head of the present disclosure includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. A skewness Rsk of the protective layer is larger than 0. Further, A thermal head of the present disclosure includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. A kurtosis Rku of the protective layer is larger than 3.

An electronic device includes a switching element, a first common-electrode wiring, at least a part of the first common-electrode wiring being covered with the switching element, a plurality of second common-electrode wirings branched from the part of the first common-electrode wiring covered with the switching element, a plurality of individual power-output terminals arranged in a row in the switching element, and a plurality of individual-electrode wirings arranged in a row, the plurality of individual-electrode wirings being connected to the plurality of individual power-output terminals, respectively. Each of the plurality of second common-electrode wirings is disposed between the plurality of individual-electrode wirings.

A thermal head includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. Further, a kurtosis Rku of the protective layer is smaller than 3. A thermal head includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. Further, a skewness Rsk of the protective layer is smaller than 0.

A printer printing an image on a print medium based on print data including print dot data for each of print lines. The printer includes a print head including heating elements arranged along a direction of the print lines, and a controller finding the number of print dots on each print line and determining a first or second control mode as a control mode of the heating elements for printing each print line based on the found number of print dots. In the first control mode, the heating elements are divided into first groups including two or more adjacent heating elements and are heated at a different timing. In the second control mode, the heating elements are divided into second groups including two or more heating elements with at least two thereof spaced apart and are heated at a different timing.

The present disclosure includes a method of fabricating a thermal ink jet printhead including depositing a first metal layer having a thickness to form a power bus, deposing a first dielectric layer, forming a via in the first dielectric layer to connect the first metal layer to a second metal layer, depositing the second metal layer, depositing a resistive layer, forming a thermal resistor in the resistive layer, depositing a second dielectric layer, and removing a portion of the second dielectric layer.

A thermal head includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. Further, a kurtosis Rku of the protective layer is smaller than 3. A thermal head includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. Further, a skewness Rsk of the protective layer is smaller than 0.

A thermal head of the present disclosure includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. A skewness Rsk of the protective layer is larger than 0. Further, A thermal head of the present disclosure includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. A kurtosis Rku of the protective layer is larger than 3.

[Object] To provide a thermal head with which a substrate is not likely to become broken.

[Solution] A thermal head X1 includes a substrate 7 having a first main surface 7f and an end surface 7e adjacent to the first main surface 7f; a plurality of heating elements 9 disposed on the first main surface 7f or on the end surface 7e; a plurality of electrodes disposed on the first main surface 7f and electrically connected to the plurality of heating elements 9; a first covering layer 27a disposed on parts of the plurality of electrodes; a connector 31 disposed adjacent to the end surface 7e and including a plurality of connector pins 8 disposed on the plurality of electrodes and a housing 10 containing the plurality of connector pins 8; and a covering member 12 covering the plurality of connector pins 8 on the plurality of electrodes together with the plurality of electrodes. The thermal head further includes a second covering layer 27b extending from the first covering layer 27a onto the end surface 7e. The housing 10 is in contact with the second covering layer 27b. Thus, the probability of breakage of the substrate 7 can be reduced.

[Object] To provide a thermal head that can reduce the probability of breakage of a connector.

[Solution] A thermal head X1 includes a substrate 7; a plurality of heating elements 9 disposed on the substrate 7; a plurality of electrodes disposed on the substrate 7 and electrically connected to the plurality of heating elements 9; a connector 31 disposed adjacent to the substrate 7 and including a plurality of connector pins 8a including connection portions 32, each of which is electrically connected to a corresponding one of the plurality of electrodes, and a housing 10 containing the plurality of connector pins 8a; and a covering member 12 covering the connection portions on the substrate. The housing includes an opening facing away from the substrate. The covering member 12 includes a first portion 12a located on the substrate 7 and a second portion 12b located on the housing 10. The second portion 12b includes a first protrusion 12b1 protruding toward the opening 10i in a plan view. Thus, the probability of breakage of the connector can be reduced.