An apparatus is configured to heat a print medium in which a plurality of color development layers that develop colors in accordance with heating are stacked in correspondence with a plurality of colors so as to form an image on the medium by causing a desired color development layer in the plurality of color development layers to independently develop the color. The apparatus includes a printhead, an input unit configured to receive a print job, a generation unit configured to generate image data and cut information for specifying a cut position, a second generation unit configured to generate first and second pulses for driving the print head, and a drive unit configured to drive the print head to form an image on the medium and apply heat beyond a melting point to melt the medium so as to cut the medium.

The invention provides an inkjet print apparatus and a recovery method of an inkjet print apparatus, which can suppress deterioration of productivity. For that purpose, timing, at which a recovery operation is practiced in accordance with a facing time period of a print head and a print medium and a not facing time period thereof, is set.

A thermal head including: a common electrode that includes a plurality of comb teeth portions extending in a first direction in which a paper is conveyed; a plurality of discrete electrodes, each of which extends in the first direction, and is arranged between the comb teeth portions; and a resistor that is electrically connected to the comb teeth portions and the discrete electrodes, and has such a shape that two connection positions of two discrete electrodes adjacent to each other and the resistor shift from each other in the first direction.

A thermal head according to the disclosure includes: a substrate; a heat generating section disposed on the substrate; an electrode disposed on the substrate so as to be electrically connected to the heat generating section; a protective layer which covers the heat generating section and part of the electrode, the protective layer being formed of an inorganic material; a cover layer disposed on the protective layer, the cover layer being formed of a resin material; and inorganic particles disposed on a surface of the protective layer so as to protrude from the surface. Moreover, the inorganic particles each comprise a first portion located inside the cover layer and a second portion located inside the protective layer.

A thermal head of the disclosure includes a substrate; a heat generating section disposed on the substrate; an electrode disposed on the substrate, the electrode having a connecting portion connected to the heat generating section; and a protective layer which covers the heat generating section and the connecting portion of the electrode, a part of the protective layer which is disposed on the connecting portion having a closed first void therein.

A printer includes a thermal head, an electrical connector capable of being connected to and disconnected from the thermal head, and a head cover of the thermal head. The head cover moves between a first position and a second position different from the first position to connect and a disconnect the thermal head and the electrical connector.

A printer printing an image on a print medium based on print data including print dot data for each of print lines. The printer includes a print head including heating elements arranged along a direction of the print lines, and a controller finding the number of print dots on each print line and determining a first or second control mode as a control mode of the heating elements for printing each print line based on the found number of print dots. In the first control mode, the heating elements are divided into first groups including two or more adjacent heating elements and are heated at a different timing. In the second control mode, the heating elements are divided into second groups including two or more heating elements with at least two thereof spaced apart and are heated at a different timing.

A thermal print head includes a semiconductor substrate, a resistor layer and a wiring layer. The resistor layer is formed on the semiconductor substrate and has a plurality of heat generating portions arranged in the main scanning direction. The wiring layer is formed on the semiconductor substrate to be included in a conduction path for energizing the plurality of heat generating portions. The conduction path includes a path or paths provided by the semiconductor substrate itself.

A thermal head includes a substrate; a plurality of heating elements disposed on the substrate; a plurality of electrodes disposed on the substrate and electrically connected to the plurality of heating elements; a connector disposed adjacent to the substrate and including a plurality of connector pins including connection portions, each of which is electrically connected to a corresponding one of the plurality of electrodes, and a housing containing the plurality of connector pins; and a covering member covering the connection portions on the substrate. The housing includes an opening facing away from the substrate. The covering member includes a first portion located on the substrate and a second portion located on the housing. The second portion includes a first protrusion protruding toward the opening in a plan view.

A thermal head includes a substrate, an electrode, and a gap. The electrode is located on the substrate. The gap is located between the substrate and the electrode. The thermal head contains glass in an inner portion of the gap.