Patent classifications
B41J2/33515
Thermal printhead and method of manufacturing the same
A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.
THERMAL HEAD FOR PRINTER
A printer includes a thermal head, an electrical connector capable of being connected to and disconnected from the thermal head, and a head cover of the thermal head. The head cover moves between a first position and a second position different from the first position to connect and disconnect the thermal head and the electrical connector.
Thermal head
A thermal head includes: an underglaze layer provided on an insulating substrate; an electrode provided on the underglaze layer; a heat generator provided on the electrode; a first protective layer containing a glass material and covering at least the heat generator; and a second protective layer provided on the first protective layer, having a melting point higher than that of the first protective layer, and made of a material whose thermal expansion coefficient at a temperature of 1000 C. or lower is substantially constant.
THERMAL PRINT HEAD ELEMENT, THERMAL PRINT HEAD MODULE AND MANUFACTURING METHOD OF THE THERMAL PRINT HEAD MODULE
A thermal print head element includes a substrate, a glaze layer, a heat accumulating layer, a heat generating resistor layer, an electrode layer and an insulating protective layer. The glaze layer is disposed on the substrate to form a ridge portion that linearly extends. The heat accumulating layer covers the ridge portion and the substrate, and is formed with an opening portion that exposes a part of the substrate. The heat generating resistor layer covers the heat accumulating layer. The electrode layer covers the heat generating resistor layer to directly contact with the part of the substrate through the opening portion. The insulating protective layer covers the electrode layer and the heat generating resistor layer, and formed with a through hole so that a soldering region of the electrode layer is exposed outwards from the insulating protective layer through the through hole.
THERMAL PRINT HEAD
The present invention provides a thermal print head capable of better performing printing on a printing medium.
The thermal print head includes: a substrate (1), formed with single crystal semiconductor; a resistor layer (4), including a plurality of heating portions (41) arranged in a main scan direction; and a wiring layer (3), configuring a charging path to the plurality of heating portions. The substrate includes: a main surface (11), being a surface opposite to the resistor layer; and a convex portion (13), disposed as protruding from the main surface and extending in the main scan direction. The convex portion includes: an inclining surface (132), inclining relative to the main surface and extending in a linear manner when viewing from the main scan direction; and a curving surface (131), disposed, in a protruding direction of the convex portion, on a position farther away from the main surface than the inclining surface, and curving in a manner that protrudes toward the protruding direction. Each of the plurality of heating portions includes a heating curving portion (411) formed on a portion corresponding to the curving surface.
THERMAL PRINTHEAD AND METHOD OF MANUFACTURING THE SAME
A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.
THERMAL HEAD STRUCTURE CAPABLE OF IMPROVING PRINTING RESOLUTION AND MANUFACTURING METHOD THEREOF
A manufacturing method of a thermal head structure capable of improving printing resolution includes the following steps. A heat storing layer, a first electrode pattern, a heat generating resistor layer, a second electrode pattern and an insulating protective layer are formed to be overlapped on a substrate, and the step of forming the heat generating resistor layer is between the step of forming the first electrode pattern and the step of forming the second electrode pattern chronologically.
HEATER
A heater includes: a substrate including a first surface and a second surface located opposite to the first surface relative to the substrate; a first heating pattern disposed on a first-surface side of the substrate; a second heating pattern disposed on the first-surface side of the substrate and located at a position different from a position of the first heating pattern; a first terminal to which electricity is to be supplied; a first power-supply pattern electrically connecting the first terminal and the first heating pattern to each other and disposed on a second-surface side of the substrate; and a first electrically-continuous portion extending through the substrate and electrically connecting the first power-supply pattern and the first heating pattern to each other.
Thermal head for printer
A printer includes a thermal head, an electrical connector capable of being connected to and disconnected from the thermal head, and a head cover of the thermal head. The head cover moves between a first position and a second position different from the first position to connect and a disconnect the thermal head and the electrical connector.
THERMAL PRINT HEAD AND METHOD OF MANUFACTURING THERMAL PRINT HEAD
A thermal print head includes: a substrate; a resistor layer supported by the substrate and including a plurality of heat generating portions arranged in a main scanning direction; a wiring layer supported by the substrate and forming an energizing path to the plurality of heat generating portions; and an insulating layer interposed between the substrate and the resistor layer, wherein the substrate has a cavity portion overlapping the plurality of heat generating portions when viewed in a thickness direction of the substrate.