A thermal head includes a substrate, a heat-generating portion disposed on the substrate, electrodes disposed on the substrate and electrically connected to the heat-generating portion, a driver IC disposed on the substrate and electrically connected to the electrodes, and a covering member covering the driver IC. In plan view, a center line of the driver IC extending in a main scanning direction and a highest position of the covering member are located farther form the heat-generating portion than a center line of the covering member extending in the main scanning direction.

According to one or more embodiments, a motor driving device includes a first substrate, a motor drive circuit, a first temperature sensor, a second temperature sensor, and a controller. The first substrate is connected to a motor via a first wiring. The motor drive circuit is provided on the first substrate. The first temperature sensor is provided on the first substrate and detects a first temperature of the motor drive circuit. The second temperature sensor detects a second temperature of an ambient environment where the motor is being used. The controller controls the motor drive circuit based on the first temperature from the first temperature sensor and the second temperature from the second temperature sensor.

A thermal head includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. Further, a kurtosis Rku of the protective layer is smaller than 3. A thermal head includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. Further, a skewness Rsk of the protective layer is smaller than 0.

A thermal head includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. Further, a kurtosis Rku of the protective layer is smaller than 3. A thermal head includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. Further, a skewness Rsk of the protective layer is smaller than 0.

[Object] To provide a thermal head that can reduce the probability of breakage of a connector.

[Solution] A thermal head X1 includes a substrate 7; a plurality of heating elements 9 disposed on the substrate 7; a plurality of electrodes disposed on the substrate 7 and electrically connected to the plurality of heating elements 9; a connector 31 disposed adjacent to the substrate 7 and including a plurality of connector pins 8a including connection portions 32, each of which is electrically connected to a corresponding one of the plurality of electrodes, and a housing 10 containing the plurality of connector pins 8a; and a covering member 12 covering the connection portions on the substrate. The housing includes an opening facing away from the substrate. The covering member 12 includes a first portion 12a located on the substrate 7 and a second portion 12b located on the housing 10. The second portion 12b includes a first protrusion 12b1 protruding toward the opening 10i in a plan view. Thus, the probability of breakage of the connector can be reduced.

A thermal head includes a substrate; a plurality of heat generating portions; a common electrode disposed on the substrate and electrically connected to the plurality of heat generating portions; a plurality of individual electrodes disposed on the substrate and each electrically connected to a corresponding one of the plurality of heat generating portions; a first insulation layer disposed on the heat generating portions, a part of the common electrode, and a part of the individual electrodes; a second insulation layer located adjacent to the first insulation layer and disposed on a part of the individual electrodes; and a static removing layer disposed on the first insulation layer and grounded. The static removing layer includes a first portion disposed on an upper surface of the first insulation layer and a second portion electrically connected to the first portion and disposed on an upper surface of the second insulation layer.

A liquid ejecting apparatus includes an ejecting unit that includes a piezoelectric element and ejects liquid by driving the piezoelectric element; a first drive circuit that generates a drive signal; and a circuit substrate in which the first drive circuit is disposed. The first drive circuit includes a first integrated circuit having a shape which includes a first side and a second side. The first integrated circuit includes, a first power supply terminal; a second power supply terminal; a first output terminal; and a second output terminal. The first power supply terminal and the second power supply terminal are disposed along the first side. The first output terminal and the second output terminal are disposed along the second side.

The present invention provides a thermal print head capable of better performing printing on a printing medium; the thermal print head including: a substrate (1), formed with single crystal semiconductor; a resistor layer (4), including a plurality of heating portions (41) arranged in a main scan direction; and a wiring layer (3), configuring a charging path to the plurality of heating portions. The substrate includes: a main surface (11), being a surface opposite to the resistor layer; and a convex portion (13), disposed as protruding from the main surface and extending in the main scan direction. The convex portion includes: an inclining surface (132), inclining relative to the main surface and extending in a linear manner when viewing from the main scan direction; and a curving surface (131), disposed, in a protruding direction of the convex portion, on a position farther away from the main surface than the inclining surface, and curving in a manner that protrudes toward the protruding direction. Each of the plurality of heating portions includes a heating curving portion (411) formed on a portion corresponding to the curving surface.

According to one embodiment, a printer includes an input interface and a processor. The input interface inputs a distance signal output from a distance sensor opposite to a rotating surface of a roll around which a sheet material is wound in a roll shape. The processor detects an amount of change in a distance from the distance sensor to the rotating surface of the roll based on a plurality of distance signals input at different timings, detects a vibration convergence state of the roll from the amount of change in the distance, and detects a diameter of the roll based on the distance signal input in the vibration convergence state.

A thermal contact device may include a thermal contact die embedded in a moldable material. The thermal contact die may include a number of resistors integrated into the thermal contact die, and a number of heater drivers integrated into the thermal contact die and electronically coupled to the resistors. The moldable material is coplanar with a thermal contact side of the thermal contact device. Further, the moldable material includes at least one gradient edge along a medium feed path.