A thermal print head includes a substrate, a resistor layer and a wiring layer. The substrate is made of a single crystal semiconductor and includes an obverse surface facing in one sense of a thickness direction. The resistive layer is supported by the substrate and includes a plurality of heat generating parts arranged side by side in a main scanning direction. The wiring layer is supported by the substrate and forms a conductive path to the plurality of heat generating parts. The wiring layer includes a conductive part and a heat generating sub-part for each of the plurality of heat generating parts, where the conductive part has a lower resistance value per unit length in a sub-scanning direction than the heat generating part, and where the heat generating sub-part has a resistance value per unit length in the sub-scanning direction that falls between the respective resistance values of the heat generating part and the conductive part. The substrate includes a ridge raised from the obverse surface and extending in the main scanning direction. The heat generating part, the heat generating sub-part and the conductive part are disposed on the ridge. The heat generating sub-part is located between the heat generating part and the conductive part in the sub-scanning direction.

The disclosure discloses a printer including a memory storing computer-executable instructions. When the instruction is executed by a processor, a printer perform a read process and a printed matter production process. In the read process, process setting information stored in a cartridge memory of a cartridge of the specific type is read, triggered by attachment of the cartridge of the specific type to a cartridge holder. In the printed matter production process, at least a feeder and a printing head is controlled on the basis of a setting state included in the process setting information read in the read process.

A thermal head includes a substrate, a bonding material, an electrically conductive member, and a gold electrode. The bonding material is located on the substrate and contains gold and tin. The electrically conductive member is located on the bonding material. The gold electrode is located on the substrate and electrically connected to the bonding material.

A thermal head of the disclosure includes a substrate; a heat generating section disposed on the substrate; an electrode disposed on the substrate, the electrode having a connecting portion connected to the heat generating section; and a protective layer which covers the heat generating section and the connecting portion of the electrode, a part of the protective layer which is disposed on the connecting portion having a closed first void therein.

A printer includes a thermal head, an electrical connector capable of being connected to and disconnected from the thermal head, and a head cover of the thermal head. The head cover moves between a first position and a second position different from the first position to connect and a disconnect the thermal head and the electrical connector.

A liquid ejecting apparatus includes an ejecting unit that includes a piezoelectric element and ejects liquid by driving the piezoelectric element; a first drive circuit that generates a drive signal; and a circuit substrate in which the first drive circuit is disposed. The first drive circuit includes a first integrated circuit having a shape which includes a first side and a second side. The first integrated circuit includes, a first power supply terminal; a second power supply terminal; a first output terminal; and a second output terminal. The first power supply terminal and the second power supply terminal are disposed along the first side. The first output terminal and the second output terminal are disposed along the second side.

A thermal head includes a substrate; a plurality of heating elements disposed on the substrate; a plurality of electrodes disposed on the substrate and electrically connected to the plurality of heating elements; a connector disposed adjacent to the substrate and including a plurality of connector pins including connection portions, each of which is electrically connected to a corresponding one of the plurality of electrodes, and a housing containing the plurality of connector pins; and a covering member covering the connection portions on the substrate. The housing includes an opening facing away from the substrate. The covering member includes a first portion located on the substrate and a second portion located on the housing. The second portion includes a first protrusion protruding toward the opening in a plan view.

A thermal head includes a substrate, an electrode, and a gap. The electrode is located on the substrate. The gap is located between the substrate and the electrode. The thermal head contains glass in an inner portion of the gap.

The present disclosure provides a substrate for a thermal print head. The substrate for the thermal print head includes: a main surface on which a ridge portion is formed; a base material; and a glaze layer. The ridge portion extends along a first direction in a plan view and is formed of a pedestal portion which is a part of the base material and the glaze layer disposed on a top surface of the pedestal portion. A hollow portion is disposed inside the glaze layer.

A thermal head includes a substrate; a heat generating section disposed on the substrate; an electrode electrically connected to the heat generating section; a cover layer which covers part of the electrode; a pad electrically connected to the electrode; and a joining member electrically connected to the pad. The cover layer includes a first portion and a second portion which is smaller in thickness than the first portion. The second portion is placed on the pad. The pad has a convexity which exposes from the second portion. The joining member is connected to the convexity.