According to one embodiment, a thermal print head includes a heat sink; a head substrate placed on the heat sink and having a plurality of heat generating elements arranged in a primary scanning direction; a circuit board placed on the heat sink so as to be adjacent to the head substrate in an auxiliary scanning direction and provided with a connection circuit; and a control element electrically connected to the heat generating element via a first bonding wire and electrically connected to the connection circuit via a second bonding wire, in which at least one of the first bonding wire and the second bonding wire includes any of a copper wire, a copper alloy wire, and a wire mainly made of copper and coated with a metal different from copper.

A thermal print head includes a head substrate (11) having a main surface (11a) on which a convex part (12) is formed, a resistor layer (21) that is formed on the main surface (11a) and the convex part (12), a wiring layer (22) that covers the resistor layer (21) such that the resistor layer (21) is exposed at a heat generating part (20) formed at a part of the convex part (12), and a protective layer (25) that is formed on the main surface (11a) of the head substrate (11) and covers the resistor layer (21) and the wiring layer (22). The resistor layer (21) has a main resistor layer that contains tantalum, and at least one of a first sub-resistor layer that contains tantalum nitride and is stacked below the tantalum layer and a second sub-resistor layer that contains tantalum nitride and is stacked on the tantalum layer. The nitrogen content of tantalum nitride contained in the first sub-resistor layer and the second sub-resistor layer exceeds a predetermined value such that the tantalum nitride is deposited in a stable structure.

A thermal head of the present disclosure includes a substrate; a heat generating section disposed on the substrate; an electrode which is disposed on the substrate and is connected to the heat generating section; a protective layer covering the heat generating section and the electrode, the protective layer having a surface provided with a depression portion; at least one particle of metal disposed inside the depression portion; and an oxide layer covering the at least one particle, the oxide layer being formed of oxides of the metal. A surface of the oxide layer is exposed to an outside and is located in a deeper position of the depression portion than the surface of the protective layer around the depression portion.

A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

A thermal head of the present disclosure includes a substrate, a heating part, an electrode, a protection layer, and a coating layer made of a resin material. The heating part is placed on or above the substrate. The electrode is placed on or above the substrate and connected to the heating part. The protection layer is placed on or above the heating part and the electrode. The coating layer is placed on or above the electrode and the protection layer. The protection layer includes a recessed part that is opened on an upper surface and that extends along a thickness direction of the protection layer. The recessed part includes an inner wall having a plurality of recesses and projections, and the resin material is disposed inside the recessed part.

A thermal head includes a substrate, a glaze layer, and a reinforced conductor layer. The glaze includes a first glaze and a second glaze. The first glaze extends in a predetermined direction on the surface of the substrate. The second glaze is spaced part from the first glaze to one side in a direction perpendicular to the predetermined direction on the surface of the substrate. The reinforced conductor layer includes a lateral side part. The lateral side part extends on the surface of the substrate from the first glaze side to the second glaze side and is partially located on the second glaze. An edge part on the first glaze side in the second glaze includes a cutout portion cut out toward the one side in the direction perpendicular to the predetermined direction. The lateral side part passes through the cutout portion.

A thermal head of the disclosure includes a substrate; a heat generating section disposed on the substrate; an electrode disposed on the substrate, the electrode having a connecting portion connected to the heat generating section; and a protective layer which covers the heat generating section and the connecting portion of the electrode, a part of the protective layer which is disposed on the connecting portion having a closed first void therein.

A thermal head includes a substrate, an electrode, a bonding material, an electrically conductive member, and a sealing material. The electrode is located on the substrate. The bonding material is located on the substrate or the electrode. The electrically conductive member is located on the bonding material and is electrically connected to the electrode via the bonding material. The sealing material is located on the substrate and covers the bonding material and the electrically conductive member. The bonding material includes a protruding portion located at an outer circumferential edge of the electrically conductive member away from the substrate and the electrically conductive member.

A thermal head of the present disclosure includes a substrate; a heat generating section disposed on the substrate; an electrode which is disposed on the substrate and is connected to the heat generating section; a protective layer covering the heat generating section and the electrode, the protective layer having a surface provided with a depression portion; at least one particle of metal disposed inside the depression portion; and an oxide layer covering the at least one particle, the oxide layer being formed of oxides of the metal. A surface of the oxide layer is exposed to an outside and is located in a deeper position of the depression portion than the surface of the protective layer around the depression portion.

The invention provides an inkjet print apparatus and a recovery method of an inkjet print apparatus, which can suppress deterioration of productivity. For that purpose, timing, at which a recovery operation is practiced in accordance with a facing time period of a print head and a print medium and a not facing time period thereof, is set.