A thermal print head includes a semiconductor substrate, a resistor layer and a wiring layer. The resistor layer is formed on the semiconductor substrate and has a plurality of heat generating portions arranged in the main scanning direction. The wiring layer is formed on the semiconductor substrate to be included in a conduction path for energizing the plurality of heat generating portions. The conduction path includes a path or paths provided by the semiconductor substrate itself.

A thermal head includes: a substrate; a thermal storage layer disposed on the substrate and having a ridge portion; heat generating portions disposed on the ridge portion; and electrodes which are disposed on the substrate. At least one of the electrodes has a first corner portion at which a side surface and an upper surface intersect, more upstream in the conveyance direction of the recording medium than the top portion of the ridge portion. In a cross section of the thermal head, an inclination angle of an imaginary line which connects an intersection point of an imaginary line which hangs downward from the top portion (13b1) of the ridge portion and the substrate, with the first corner portion, is 75 or less from the substrate. Thus, printing residue is less likely to adhere to the thermal head.

An insulating substrate comprises a ceramic substrate having a major surface, a plurality of first ribs formed on the major surface, and a glaze layer disposed on the major surface so as to cover the plurality of first ribs. The plurality of first ribs in plan view extend in a first direction and are spaced in a second direction orthogonal to the first direction and thus aligned.

Provided is a thermal print head including: a substrate having a convex part thereon; a wiring layer over the convex part; a heat storage layer over the wiring layer; a heating resistive part that is formed over the heat storage layer and is arranged along a main scanning direction; a first electrode in contact with the heating resistive part on one side in a sub-scanning direction; a second electrode in contact with the heating resistive part on another side in the sub-scanning direction; and a connection wiring formed in an opening that passes through the heating resistive part and the heat storage layer and reaches the wiring layer, in which the first electrode is electrically connected to the wiring layer via the connection wiring.

A recording device includes a recording section configured to perform recording on a medium; a control substrate 60 configured to be involved in the operation of the recording section; and a storage section including a metal partition 70 and covering the control substrate 60, wherein the control substrate 60 is in contact with the convex member 72 constitutes at least a part of the partition 70 via the elastic member 80 having heat conductivity.

The thermal print head having COF structure is disclosed. According to the present invention, productivity can be improved with a low step of a protective resin by using a COF method, the height of the thermally compressed COF can be minimized in comparison with the surface of the ceramic substrate by electrically connecting the ceramic substrate and the COF through thermal compression using ACF, and the height of the thermally compressed COF can be minimized in comparison with the surface of the ceramic substrate.

Systems and methods for laser assisted deposition of a material includes a printing unit configured to print individual dot-like portions of a material from a donor substrate onto a receiving substrate, and a vacuum shuttle configured to be positionable in two or three dimensions between the printing unit and the donor substrate and to engage the donor substrate upon application of a vacuum to the vacuum shuttle. The printing unit may include a coating system and a laser. The vacuum shuttle includes a vacuum channel about its periphery and an open window through which the laser irradiates the donor substrate. The vacuum channel is fluidly coupled to a vacuum inlet for receiving a vacuum suction, thereby to engage the donor substrate and hold it taught against the bottom of the vacuum shuttle in operation. The vacuum shuttle may also include one or more distance measuring sensors and fiducial markers.

A thermal head includes a substrate, a bonding material, an electrically conductive member, and an aluminum electrode. The bonding material is positioned on the substrate and contains gold and tin. The electrically conductive member is positioned on the bonding material. The aluminum electrode is positioned on the substrate and electrically connected to the electrically conductive member via the bonding material.

A thermal print head includes: a substrate including a main surface; an insulating film arranged on the main surface; a first wiring layer arranged on the insulating film; a first interlayer insulating film arranged on the first wiring layer; a heat-generating body film; and a second wiring layer arranged on the first interlayer insulating film with the heat-generating body film interposed therebetween, wherein a bump is formed on the main surface, wherein the bump extends along a first direction in a plan view, wherein the second wiring layer extends along a second direction orthogonal to the first direction to intersect the bump in a plan view, and includes first, second, third, and fourth wirings arranged along the first direction, wherein the second wiring is located between the first wiring and the third wiring, and wherein the third wiring is located between the second wiring and the fourth wiring.

A thermal print head includes a substrate and a glaze layer. The substrate has a main surface. The glaze layer is disposed on the main surface. The glaze layer includes a hollow filler.