A liquid discharge head includes a recording element substrate. The recording element substrate includes a discharge aperture forming member defining a discharge aperture from which a liquid is discharged and a substrate having a pressure generating element that pressurizes the liquid so as to discharge the liquid. The liquid discharge head also includes a cover member that defines an opening through which the discharge aperture is exposed. The cover member is disposed on a side of the recording element substrate on which the discharge aperture is formed. In the liquid discharge head, the recording element substrate further includes an electrode disposed on a side of the substrate on which the discharge aperture forming member is formed and an insulation member that covers the electrode. In addition, the insulation member is covered by the cover member.

A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.

The present invention provides a conversion board for printing circuit board and the packaging structure thereof, which is disposed on a plurality of first joint parts of a board member. A plurality of first package pin members are disposed below a first circuit board. The plurality of first package pin members are connected electrically to the corresponding plurality of first joint parts, respectively. The conversion board is disposed on the first circuit board. The conversion board uses a plurality of second joint parts to connect electrically to the plurality of first package pin members. A plurality of second package pin members are disposed below a second circuit board. The plurality of second package pin members are connected electrically to the corresponding plurality of second joint parts, respectively.

A thermal head of the present disclosure includes a substrate 7, a heat generating unit 9, an electrode, a covering layer 27, and a covering member 29. The heat generating unit 9 is positioned above the substrate 7. The electrode is positioned above the substrate and connected to the heat generating unit 9. The covering layer 27 covers at least a part of the electrode when viewed in plan. The covering member 29 is positioned on the covering layer 27. The covering layer 27 has an upper surface 27a and a lateral surface 27b that is positioned on a side of the heat generating unit 9. An arithmetic-average surface roughness Ra of the lateral surface 27b is higher than an arithmetic-average surface roughness Ra of the upper surface 27a.

The present invention provides a thermal print head capable of better performing printing on a printing medium.

The thermal print head includes: a substrate (1), formed with single crystal semiconductor; a resistor layer (4), including a plurality of heating portions (41) arranged in a main scan direction; and a wiring layer (3), configuring a charging path to the plurality of heating portions. The substrate includes: a main surface (11), being a surface opposite to the resistor layer; and a convex portion (13), disposed as protruding from the main surface and extending in the main scan direction. The convex portion includes: an inclining surface (132), inclining relative to the main surface and extending in a linear manner when viewing from the main scan direction; and a curving surface (131), disposed, in a protruding direction of the convex portion, on a position farther away from the main surface than the inclining surface, and curving in a manner that protrudes toward the protruding direction. Each of the plurality of heating portions includes a heating curving portion (411) formed on a portion corresponding to the curving surface.

The present disclosure provides a thermal print head. The thermal print head includes a substrate having a main surface and a convex portion and including a semiconductor material; a resistor layer including a plurality of heat generating portions located on the convex portion; and a wiring layer conducted to the plurality of heat generating portions and formed to contact the resistor layer. The convex portion has a top surface, a first inclined surface and a second inclined surface. The first inclined surface and the second inclined surface are disposed between the main surface and the top surface, separated from each other in a sub-scanning direction, and tilted with respect to the main surface. A first tilted angle of the first inclined surface with respect to the main surface and a second tilted angle of the second inclined surface with respect to the main surface are greater than 55 degrees.

A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.

A manufacturing method of a thermal head structure capable of improving printing resolution includes the following steps. A heat storing layer, a first electrode pattern, a heat generating resistor layer, a second electrode pattern and an insulating protective layer are formed to be overlapped on a substrate, and the step of forming the heat generating resistor layer is between the step of forming the first electrode pattern and the step of forming the second electrode pattern chronologically.

A liquid ejection head and its manufacturing method are capable of reducing the thickness of a protective layer as compared to the traditional technique so as to efficiently transfer the heat energy generated by a heating resistance element to a droplet of liquid such as ink. To achieve this, power supply wirings are provided in the same layer below the heating resistance element.

A thermal printhead includes a substrate having an obverse surface, a projection formed on the obverse surface and extending in a primary scanning direction, a plurality of heating elements arranged in the primary scanning direction on the top of the projection, a groove dented from the top of the projection and extending in the primary scanning direction, and a heat storage member filling at least an opening of the groove.