Patent classifications
B41J2/3357
THERMAL PRINTHEAD AND METHOD OF MANUFACTURING THE SAME
A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.
THERMAL HEAD STRUCTURE CAPABLE OF IMPROVING PRINTING RESOLUTION AND MANUFACTURING METHOD THEREOF
A manufacturing method of a thermal head structure capable of improving printing resolution includes the following steps. A heat storing layer, a first electrode pattern, a heat generating resistor layer, a second electrode pattern and an insulating protective layer are formed to be overlapped on a substrate, and the step of forming the heat generating resistor layer is between the step of forming the first electrode pattern and the step of forming the second electrode pattern chronologically.
HEATER
A heater includes: a substrate including a first surface and a second surface located opposite to the first surface relative to the substrate; a first heating pattern disposed on a first-surface side of the substrate; a second heating pattern disposed on the first-surface side of the substrate and located at a position different from a position of the first heating pattern; a first terminal to which electricity is to be supplied; a first power-supply pattern electrically connecting the first terminal and the first heating pattern to each other and disposed on a second-surface side of the substrate; and a first electrically-continuous portion extending through the substrate and electrically connecting the first power-supply pattern and the first heating pattern to each other.
Thermal head and thermal printer
A thermal head X1 according to the present disclosure includes a substrate, a heat generator, an electrode, and a protective layer. The heat generator is positioned on the substrate. The electrode is positioned on the substrate and connected to the heat generator. The protective layer covers the heat generator and part of the electrode. The protective layer contains titanium and nitrogen. The protective layer satisfies P2>P1 where P1 is the peak intensity of X-ray diffraction of the (111) plane, and P2 is the peak intensity of X-ray diffraction of the (200) plane.
THERMAL PRINT HEAD AND METHOD OF MANUFACTURING THERMAL PRINT HEAD
A thermal print head includes: a substrate; a resistor layer supported by the substrate and including a plurality of heat generating portions arranged in a main scanning direction; a wiring layer supported by the substrate and forming an energizing path to the plurality of heat generating portions; and an insulating layer interposed between the substrate and the resistor layer, wherein the substrate has a cavity portion overlapping the plurality of heat generating portions when viewed in a thickness direction of the substrate.
THERMAL PRINTHEAD
A thermal printhead includes a substrate having an obverse surface, a projection formed on the obverse surface and extending in a primary scanning direction, a plurality of heating elements arranged in the primary scanning direction on the top of the projection, a groove dented from the top of the projection and extending in the primary scanning direction, and a heat storage member filling at least an opening of the groove.
Thermal print head and thermal printer
According to one embodiment, a thermal print head includes a heat sink; a head substrate placed on the heat sink and having a plurality of heat generating elements arranged in a primary scanning direction; a circuit board placed on the heat sink so as to be adjacent to the head substrate in an auxiliary scanning direction and provided with a connection circuit; and a control element electrically connected to the heat generating element via a first bonding wire and electrically connected to the connection circuit via a second bonding wire, in which at least one of the first bonding wire and the second bonding wire includes any of a copper wire, a copper alloy wire, and a wire mainly made of copper and coated with a metal different from copper.
Thermal printhead having asymmetric recording elements
An asymmetric thermal print head includes a print head body and a plurality of print elements supported on the print head body. The print elements are aligned along a first axis. Each print element includes a heater portion having a burn width measured along the first axis corresponding to a first print resolution, and a burn length measured along a second axis, which is perpendicular to the first axis, corresponding to a second print resolution. The second print resolution is higher than the first print resolution. One or more control circuits are configured to individually activate the print elements.
THERMAL PRINT HEAD AND THERMAL PRINTER
Certain embodiments provide a thermal print head including: a first heat storage layer formed on a substrate; a heat generator formed on the first heat storage layer; an electrode formed from the first heat storage layer to the substrate and electrically connected to the heat generator; and a barrier layer that covers the electrode and is formed by a CVD method.
Printing device, thermal print head structure and method for manufacturing the thermal print head structure
A thermal print head structure includes a fixed electrode layer, a movable electrode layer opposite to the fixed electrode layer, a protection layer group covering the fixed electrode layer and the movable electrode layer, a heat source used to heat the fixed electrode layer, and a number of spacers. The fixed electrode layer includes a fixed electrode line. The movable electrode layer includes a flexible electrode line which is intersected with the fixed electrode line. These spacers are located between the fixed electrode layer and the protection layer group such that gaps are defined between the fixed electrode layer and the protection layer group. When a potential difference is generated between the fixed electrode line and the flexible electrode line, the movable electrode layer contacts the fixed electrode layer through the gap.