A printer printing an image on a print medium based on print data including print dot data for each of print lines. The printer includes a print head including heating elements arranged along a direction of the print lines, and a controller finding the number of print dots on each print line and determining a first or second control mode as a control mode of the heating elements for printing each print line based on the found number of print dots. In the first control mode, the heating elements are divided into first groups including two or more adjacent heating elements and are heated at a different timing. In the second control mode, the heating elements are divided into second groups including two or more heating elements with at least two thereof spaced apart and are heated at a different timing.

A thermal print head includes a semiconductor substrate, a resistor layer and a wiring layer. The resistor layer is formed on the semiconductor substrate and has a plurality of heat generating portions arranged in the main scanning direction. The wiring layer is formed on the semiconductor substrate to be included in a conduction path for energizing the plurality of heat generating portions. The conduction path includes a path or paths provided by the semiconductor substrate itself.

A thermal head includes a substrate; a plurality of heating elements disposed on the substrate; a plurality of electrodes disposed on the substrate and electrically connected to the plurality of heating elements; a connector disposed adjacent to the substrate and including a plurality of connector pins including connection portions, each of which is electrically connected to a corresponding one of the plurality of electrodes, and a housing containing the plurality of connector pins; and a covering member covering the connection portions on the substrate. The housing includes an opening facing away from the substrate. The covering member includes a first portion located on the substrate and a second portion located on the housing. The second portion includes a first protrusion protruding toward the opening in a plan view.

A thermal head includes a substrate, an electrode, and a gap. The electrode is located on the substrate. The gap is located between the substrate and the electrode. The thermal head contains glass in an inner portion of the gap.

Disclosed is an assembly line for processing products. The line includes, on one hand, a plurality of consecutive stations for processing the products and, on the other hand, a moving unit for moving the products between the stations within the line, in particular from an upstream station in which the products have just been processed, to a downstream station in which the products must later be processed. The moving unit essentially includes at least one self-contained, self-supported, movable carriage moving on the ground and having the products resting thereon during the movement thereof within the line. Also disclosed is a corresponding implementation method and to a corresponding use of the carriages.

A thermal head includes a substrate; a heat generating section disposed on the substrate; an electrode electrically connected to the heat generating section; a cover layer which covers part of the electrode; a pad electrically connected to the electrode; and a joining member electrically connected to the pad. The cover layer includes a first portion and a second portion which is smaller in thickness than the first portion. The second portion is placed on the pad. The pad has a convexity which exposes from the second portion. The joining member is connected to the convexity.

[Object] To provide a thermal head having improved sealability.

[Solution] A thermal head X1 includes a substrate 7, a heat storage layer 13 disposed on the substrate 7 and including a bulging portion 13a, heating elements 9 disposed on the bulging portion 13a, a protective layer 25 disposed on the heating elements 9, and a covering layer 27 disposed on the protective layer 25. The covering layer 27 includes a first portion 27a disposed apart from the bulging portion 13a, and a second portion 27b disposed between the bulging portion 13a and the first portion 27a. The height of the second portion 27b from the substrate 7 is smaller than the height of the first portion 27a from the substrate 7. Thus, the sealability of the thermal head X1 can be improved.

A thermal print head includes a base member, an electrode layer formed on the base member, and a resistor layer formed on the base member. The electrode layer includes a common electrode and individual electrodes. The resistor layer includes heating units aligned in a main scanning direction. The heating units each include a first heating element and a second heating element spaced apart from each other. The first heating element and the second heating element are electrically connected to the common electrode and one of the individual electrodes to which the first heating element is electrically connected.

A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

A thermal head includes a substrate; a plurality of heating elements; a plurality of electrodes; a first covering layer; and a covering member. The thermal head further includes a second covering layer extending from the first covering layer onto the end surface. The housing is in contact with the second covering layer.