The present disclosure provides a substrate structure for a micro electro mechanical system (MEMS) device. The substrate structure includes a cap and a micro electro mechanical system (MEMS) substrate. The cap has a cavity, and the MEMS substrate is disposed on the cap. The MEMS substrate has a plurality of through holes exposing the cavity, and an aspect ratio of the through hole is greater than 30.

A removable material is deposited or otherwise applied to a flat substrate surface in a pattern corresponding to desired corrugations in a membrane, e.g., a deflection diaphragm. The applied material serves as a scaffold for a polymeric material, which is applied thereover, and following cure or hardening, the polymeric material is removed to form a finished corrugated membrane.

A semiconductor package that contains an application-specific integrated circuit (ASIC) die and a micro-electromechanical system (MEMS) die. The MEMS die and the ASIC die are coupled to a substrate that includes an opening that extends through the substrate and is in fluid communication with an air cavity positioned between and separating the MEMS die from the substrate. The opening exposes the air cavity to an external environment and, following this, the air cavity exposes a MEMS element of the MEMS die to the external environment. The air cavity separating the MEMS die from the substrate is formed with a method of manufacturing that utilizes a thermally decomposable die attach material.

A micro electro mechanical system (MEMS) device and a method for manufacturing the same are provided. The MEMS device includes a substrate, a polymer film on the substrate and having a lower surface facing toward the substrate, a cavity passing through the substrate, and coil structures on the substrate and in the polymer film. The polymer film includes a corrugation pattern on the lower surface of the polymer film. A portion of the polymer film is exposed in the cavity.

A method for manufacturing a micro electro mechanical system (MEMS) device is provided. The method includes: providing a substrate; forming coil structures on the substrate; forming a dielectric layer on the substrate and the coil structures; removing a first portion of the dielectric layer to form a sacrificing corrugation pattern adjacent to the coil structures; forming a polymer film on the dielectric layer, wherein the polymer film covers the sacrificing corrugation pattern of the dielectric layer.

Provided is a pressure sensor. The pressure sensor has a sensing region and a non-sensing region, and includes: a first flexible film layer, wherein a first groove is disposed in a first surface of the first flexible film layer, and the first groove is within the sensing region; a first electrode layer; a first insulative layer, disposed on a side, distal from the first flexible film layer, of the first electrode layer; a second electrode layer, wherein the second electrode layer is disposed on a side, distal from the first flexible film layer, of the first insulative layer; and a second flexible film layer, wherein the second flexible film layer is disposed on a side, distal from the first flexible film layer, of the second electrode layer.