Disclosed is a piezoelectric transducer which is mounted to a target in use, comprising: a piezoelectric element having a front face which faces the target, and an opposing rear face which faces away from the target, wherein the piezoelectric element has a first acoustic impedance; an compression element located on the rear surface side of the piezoelectric element, the compression element having a second acoustic impedance which is less than the first acoustic impedance; and, a compression mechanism which urges the compression element towards the piezoelectric element such that the compression element is compressed between the compression mechanism and piezoelectric element.

A system and downhole tool comprising an ultrasonic transducer with a piezoelectric material embedded in a backing and a method of determining a parameter using the ultrasonic transducer. A self-noise of the transducer can be reduced by the piezoelectric material being at least partially embedded in the backing. The ultrasonic transducer can include an encapsulating material that encapsulates the backing.

An ultrasonic sensor having a case including a bottom section and a peripheral wall section; a piezoelectric device on the bottom section inside the case; and a resin foam filler filling at least part of the case and covering the piezoelectric device. An inner surface of the case includes a first region and a second region, a surface roughness of the first region is higher than a surface roughness of the second region, the first region includes at least part of the bottom section and/or a portion of the peripheral wall section facing the piezoelectric device, the second region is on the peripheral wall section and is farther from the piezoelectric device than the first region, and the resin foam filler contacts each of the first region and the second region.

An ultrasonic transducer includes a delay line substrate, a piezoelectric element, a metal conductive layer between the delay line substrate and the piezoelectric element, and a backing layer applied to the piezoelectric element. The delay line substrate and the piezoelectric element are acoustically joined, configured to couple ultrasonic waves from the piezoelectric element into the delay line substrate or from the delay line substrate into the piezoelectric element. The backing layer includes a metal film, the metal film has a thickness and an acoustic impedance, and the thickness and the acoustic impedance each have value sufficient to provide acoustic damping. The backing layer has a substantially columnar cross-sectional morphology with a substantially granular surface morphology.

A backing panel for a transducer of an ultrasound scanner probe, comprising a core layer sandwiched by a first skin layer and a second skin layer. The transducer may comprise a front portion and a rear portion, where the front portion points to a direction of a target for the ultrasound scanner probe, and the first skin layer is adjacent to the rear portion of the transducer.

Systems are provided for the arrangement of decoupled electric and acoustic modules for a transducer array of an ultrasound probe. In one embodiment, the decoupled modules are independently coupled to a flex interconnect, apart from one another, allowing for electric communication between all modules through the flex interconnect. As one example, an ultrasound transducer array for an ultrasound probe comprises an acoustic backing, a flex interconnect coupled to the backing at a first surface of the flex interconnect, a matrix acoustic array coupled to a second surface of the flex interconnect, the second surface opposite the first surface, and an electric module coupled to the second surface of the flex interconnect at a location spaced away from where the matrix acoustic array is coupled to the flex interconnect.

A well tool can be used in a wellbore that can measure characteristics of an object in the wellbore. The well tool includes an ultrasonic transducer for generating an ultrasonic wave in a medium of the wellbore. The ultrasonic transducer includes a front layer, a rear layer, backing material coupled to the rear layer, and piezoelectric material coupled to the front layer and to the backing material. The rear layer can improve signal-to-noise ratio of the transducer in applications such as imaging and caliper applications.

A backing member includes a resin layer having a first surface, and a second surface opposite to the first surface, and a plurality of linear conductors, embedded in the resin layer, and penetrating the resin layer from the first surface to the second surface. Each of the plurality of linear conductors includes a metal material having an ultrasonic wave insulating property, and includes at least one bent portion or curved portion.

An ultrasound transducer array architecture and manufacturing method is provided. The method includes providing an ultrasonic transducer including a plurality of modules, each module including an ultrasonic transducer array and an application specific integrated circuit (ASIC), the ultrasonic transducer array and the ASIC electrically coupled to a flexible interconnect, the flexible interconnect coupled to a connector. The ASIC and flexible interconnect may be arranged such that each ultrasonic transducer array is directly adjacent to another ultrasonic transducer array. The ASIC may be electrically coupled to the flexible interconnect and the ASIC to the transducer array via a redistribution layer. Each of the plurality of modules may be a stack with the ultrasonic transducer array on the RDL and RDL on the ASIC, wherein the flexible interconnect extends laterally from a top surface of the ASIC and curves down to a bottom surface of the ASIC.

Systems are provided for the arrangement of decoupled electric and acoustic modules for a transducer array of an ultrasound probe. In one embodiment, the decoupled modules are independently coupled to a flex interconnect, apart from one another, allowing for electric communication between all modules through the flex interconnect. As one example, an ultrasound transducer array for an ultrasound probe comprises an acoustic backing, a flex interconnect coupled to the backing at a first surface of the flex interconnect, a matrix acoustic array coupled to a second surface of the flex interconnect, the second surface opposite the first surface, and an electric module coupled to the second surface of the flex interconnect at a location spaced away from where the matrix acoustic array is coupled to the flex interconnect.