An ultrasound transducer used in an ultrasound system and a manufacturing method thereof includes: a backing block; a piezoelectric layer placed on the backing block; a matching layer placed on the piezoelectric layer; and a ground layer placed between the piezoelectric layer and the matching layer. The backing layer includes a connector that connects a transmitting unit and a receiving unit of an ultrasound system, and a wiring area that connects the piezoelectric layer and the connector. The wiring area is formed by etching and filling with metal material.

A sonic device in an embodiment includes a sonic transducer unit and a sonic propagation unit. The sonic transducer unit performs at least one of transmitting and receiving a sonic wave, and has a sonic function surface to configure at least one of a wave transmitting surface and a wave receiving surface. The sonic propagation unit includes: a substrate having a pair of electrodes; an electroadhesive element expressing body including a resin crosslinked body arranged on the substrate, and particles dispersed in the resin crosslinked body; and a power supply to apply voltage to the pair of electrodes. The sonic propagation unit is provided on the sonic function surface of the sonic transducer unit, and the electroadhesive element expressing body in the sonic propagation unit comes into contact with a test object.

An electronic device includes a substrate layer having a front surface and a back surface opposite the front surface, a plurality of ultrasonic transducers formed on the front surface of the substrate layer, wherein the plurality of ultrasonic transducers generate backward waves during operation, the backward waves propagating through the substrate layer, and a plurality of substrate structures formed within the back surface of the substrate layer, the plurality of substrate structures configured to modify the backward waves during the operation.

A modular array includes modular array includes one or more array modules. Each array module includes one or more transducer arrays, where each of the one or more transducer arrays includes a plurality of piezoelectric elements; a conducting interposer arranged and configured to provide acoustic absorbing backing for the one or more transducer arrays; and one or more Application Specific Integrated Circuits (ASICs). The conducting interposer and the one or more ASICs are in electrical contact with each other at a first direct electrical interface. Additionally, the conducting interposer and the one or more transducer arrays are in electrical contact with each other at a second direct electrical interface.

An ultrasonic transducer for a measuring instrument includes a housing container with a support plate and a piezoelectric element that is supported by the support plate and has a substantially circular shape. The piezoelectric element includes multiple substantially sector-shaped oscillation parts that are divided by multiple grooves that communicate with each other at the central part and extend radially. The piezoelectric element oscillates in the thickness direction A3 in the first frequency band and in the radial direction A4 in the second frequency band, which is lower than the first frequency band. The ultrasonic transducer is capable of expanding the frequency band suitable for transmitting and receiving ultrasound.

The teachings of the present disclosure enable the manufacture of one or more piezoelectric micromachined ultrasonic transducers (PMUTs) having a resonant frequency of a specific target value and/or substantially matched resonant frequencies. In accordance with the present disclosure, a flexible membrane of a PMUT is modified to impart a desired parameter profile for stiffness and/or mass to tune its resonant frequency to a target value. The desired parameter profile is achieved by locally removing or adding material to regions of one or more layers of the flexible membrane to alter its geometric dimensions and/or density. In some embodiments, material is added or removed non-uniformly across the structural layer to realize a material distribution that more strongly affects membrane stiffness than mass. In some embodiments, material having a specific residual stress is added to, and/or removed from, the membrane to define a desired modal stiffness for the membrane.

Systems, methods, and apparatuses for conducting heat from an ultrasound transducer and reducing drop impact forces are disclosed. A thermal management system including a thermally conductive compliant component in an ultrasound probe is disclosed. The thermal management system may include thermally conductive compliant component coupled to a transducer assembly. A printed circuit assembly (PCA) may be coupled to the compliant component. The thermally compliant component may conduct heat from the transducer assembly to the PCA. The PCA may be further coupled to a cable that may conduct heat from the PCA and away from the ultrasound probe.

A fluid impermeable transducer includes an assembly of a transducer head and a casing, and an actuator disposed in the casing rearward of the back of the transducer head and operable to transmit acoustic energy through the transducer head. The transducer head and casing define a working portion of the transducer that is fluid impermeable.

A backing material for an ultrasonic probe according to the present invention comprises a carbonaceous matrix that has communicating holes distributed in the matrix, and a resin with which the communicating holes are filled.

A PMUT ultrasound transducer includes a number of PMUT transmitting elements in a membrane layer. Behind each PMUT transmitting element is a cavity in the membrane layer. The cavities are partially or completely filled with a damping material to reduce ringing of the PMUT transmitting elements. Suitable damping materials include polymers, e.g., soft epoxies, benzocyclobutene or polyimide that are dispersed into the cavities or a phase changing material such as Parylene that precipitates out of a gas phase as a polymer when cured.