The invention relates to a method for laser welding two plastic components A, B brought into contact at least in the joining area, wherein component B facing away from the laser radiation consists of a plastic matrix with a white pigmentation of 1.5 5-20 wt.-%, and component A facing the laser radiation, through which the laser beam passes in the welding process, exhibits a plastic matrix. For a given laser wavelength the travel distance of the laser beam through the component A measures at most 10 mm, and given a white pigmentation of the component A in wt.-%, the product of the travel distance of the laser 10 beam through the component A in mm and white pigmentation in wt.-% is less than 1.25, and the travel distance of the laser beam through the component A measures at most 1 mm.

Provided is a laser welding structure which may couple parts to each other by using a laser welding, and more particularly, a laser welding structure enabling laser welding of thermosetting resin including a glass fiber, the laser welding structure for the thermosetting resin including the glass fiber according to the present disclosure, and the method using the same, configured as described above, may provide the improved welding structure by coupling the parts made of the glass fiber-reinforced PPS material to each other by the laser welding.

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.

Transparent glass-to-glass hermetic seals are formed by providing a low melting temperature sealing glass along a sealing interface between two glass substrates and irradiating the interface with laser radiation. Absorption by the sealing glass and induced transient absorption by the glass substrates along the sealing interface causes localized heating and melting of both the sealing glass layer and the substrate materials, which results in the formation of a glass-to-glass weld. Due to the transient absorption by the substrate material, the sealed region is transparent upon cooling.

A formed article obtained by performing laser welding on a transmitting resin member and an absorbing resin member, includes: a bonded part where the transmitting resin member and the absorbing resin member are bonded to each other by the laser welding, in which a molten pool is observed at the bonded part in a cross section that includes a normal to the transmitting resin member or the absorbing resin member and is orthogonal to a scanning direction of a laser beam, an area of the molten pool is 0.210 mm.sup.2 or more and 1.00 mm.sup.2 or less, the transmitting resin member and the absorbing resin member are each molded from a resin composition, the resin composition contains a thermoplastic resin, the thermoplastic resin contains at least a polyamide-based resin (A1), and a glass transition point temperature of the resin composition is 85 C. or higher.

A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques.

A projector includes a light source portion; and an optical scanning portion that scans light from the light source portion, wherein the light source portion comprises a first holder that holds a light source, and a second holder that holds an optical portion through which light from the light source is emitted, and the first holder and the second holder are arranged in that order from a light emitting direction.

A stretch-blown plastic container, includes a container body which encloses a filling volume with a container bottom; a container neck which adjoins an opposite end of the container body, having a container opening and an integrated handle region, the handle region being hollow and joined to the filling volume which is enclosed by the container body; and between the handle region and the container body, a through opening recessed and bordered over its entire periphery by wall parts of the container body and of the handle region which have been welded to one another.

Transparent glass-to-glass hermetic seals are formed by providing a low melting temperature sealing glass along a sealing interface between two glass substrates and irradiating the interface with laser radiation. Absorption by the sealing glass and induced transient absorption by the glass substrates along the sealing interface causes localized heating and melting of both the sealing glass layer and the substrate materials, which results in the formation of a glass-to-glass weld. Due to the transient absorption by the substrate material, the sealed region is transparent upon cooling.

A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques.