A waterproof invisible barrier seam is formed between two fabric laminates, an outer shell fabric laminate and an inner lining fabric laminate. The seam includes an invisible seam tape that forms a hydrostatic barrier within the seam. The design of the seam allows the formation of an effective hydrostatic barrier along the seams of a soft shell garment, while retaining flexibility, stretch, aesthetic appearance, and reversibility.

A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object, and non-conductively heating the bond interface without directly heating the surface outside of the cure zone. Non-conductively heating the bond interface may involve applying microwave radiation to the bond interface.

A method and an apparatus for welding together a first object and a second object. The method comprises applying a layer of carbon nanotubes onto a surface of the first object and bringing the first object and the second object into contact, such that the layer of carbon nanotubes on the surface of the first object is in contact with a surface of the second object. The method further comprises applying a voltage to the layer of carbon nanotubes, such that an electrical current flows through the layer of carbon nanotubes, wherein material of the first object adjacent to the layer of carbon nanotubes and material of the second object adjacent to the layer of carbon nanotubes is heated and melted by the electrical current and thereby welded together. Further, an apparatus for welding together a first object and a second object is presented.

A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object, and non-conductively heating the bond interface without directly heating the surface outside of the cure zone. Non-conductively heating the bond interface may involve applying microwave radiation to the bond interface.

A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object, and non-conductively heating the bond interface without directly heating the surface outside of the cure zone. Non-conductively heating the bond interface may involve applying microwave radiation to the bond interface.