A method for welding at least two parts including a thermoplastic material and having respective surfaces to be welded, including: inserting an insert between the surfaces to be welded of the two parts; generating heat via the insert; wherein the insert moves in relation to the parts to be welded in a welding direction. Also, an installation adapted for implementation of this method.

A ultrasonic welding method of joining dissimilar-material workpieces, such as sheet materials, and the joined components formed thereby. The method includes applying ultrasonic energy to a thermoplastic piece to fill a hole of a dissimilar piece to form a weld point that is made up with polymer from the thermoplastic piece. In general, the geometry of the thermoplastic piece is not altered during the process. The dissimilar piece generally has a higher melting temperate and can be metal, thermoset polymers, or other thermoplastic material. The welded pieces can be arranged in a lap, laminate, or double lap configuration. In some embodiments, the hole of the dissimilar sheet material includes undercut features that improve the mechanical interlock between the dissimilar pieces. In some embodiments, the weld point has a mushroom cap to improve mechanical interlock.

Provided are an article including a joint portion of a fluororesin having sufficient strength, and a method of producing the same. The article includes a joint portion including: a porous first layer of a first fluororesin; a second layer of a second fluororesin having a melting point lower than a melting point of the first fluororesin; and a non-porous third layer formed between the first layer and the second layer, the non-porous third layer including the first fluororesin.

A method of bonding a second object to a first object includes: providing the first object having a thermoplastic liquefiable material in a solid state; providing the second object having a surface portion that has a coupling structure with an undercut, so that the second object is capable of making a positive-fit connection with the first object; pressing the second object against the first object with a tool that is in physical contact with a coupling-in structure of the second object while mechanical vibrations are coupled into the tool; continuing to press and couple vibrations into the tool until a flow portion of the thermoplastic material of the first object is liquefied and flows into the coupling structures of the second object; and letting the thermoplastic material re-solidify to yield a positive-fit connection between the first and second objects by the re-solidified flow portion interpenetrating the coupling structures.

A method of welding a sleeve (10) to a tube (20) includes putting onto end portions (11) of the sleeve (10) respective protective elements (40), of a material that cannot be fused with the materials of the sleeve (10) and of the outer coating (24) of the tube (20); applying on each end portion (11) of the sleeve (10) covered by a protective element (40) a respective heat-shrink element (30); supplying each heat-shrink element (30) with a quantity of heat (Q) which by heating it causes it to shrink and compress the respective end portion (11) of the sleeve (10) against the tube (20), where this quantity of heat (Q) is transmitted to the end portion (11) of the sleeve (10) to obtain a welding of the sleeve (10) to the tube (20) and produce a device (1) comprising the tube (20) with the sleeve (10).

Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.

In a welded film laminate 1, a second protective layer 14 of a first film substrate 2 and a third protective layer 22 of a second film substrate 3 are welded and fixed to each other by an adhesive layer melted out from at least one of a first adhesive layer 11 to a fourth adhesive layer 27 via a first melted penetration portion 6a of the second protective layer 14 and/or a second melted penetration portion 6b of the third protective layer 22. A welding fixed portion 6c is surrounded in a plan view by a first welded portion 33 in which the first adhesive layer 11 and a second adhesive layer 15 of the first film substrate 2 are welded to each other and/or a second welded portion 35 in which a third adhesive layer 23 and the fourth adhesive layer 27 of the second film substrate 3 are welded to each other.

The invention first relates to a method for welding at least two parts comprising a thermoplastic material and having respective surfaces to be welded, comprising: inserting an insert between the surfaces to be welded of the two parts; generating heat via said insert; wherein the insert moves in relation to the parts to be welded in a welding direction. The invention also relates to an installation adapted for implementation of this method.

A method for joining a first thermoplastic substrate and a second thermoplastic substrate, each including a polyaryletherketone material having a first melting temperature. The method includes co-consolidating a first semicrystalline thermoplastic film with the first thermoplastic substrate to yield a first co-consolidated structure. The first semicrystalline thermoplastic film defines a first bonding surface of the first co-consolidated structure and includes a polyaryletherketone material having a second melting temperature that is less than the first melting temperature. The method further includes co-consolidating a second semicrystalline thermoplastic film with the second thermoplastic substrate to yield a second co-consolidated structure. The second semicrystalline thermoplastic film defines a second bonding surface of the second co-consolidated structure and includes a polyaryletherketone material having a third melting temperature that is less than the first melting temperature. The method further includes fusing the first bonding surface to the second bonding surface. The method yields a stacked structure.

A composite thermoplastic liner for use as a moisture barrier comprises a hollow tubular body made from a woven composite thermoplastic material configured to substantially block the ingress of moisture; and an opening at one end of the hollow tubular body for intake into the hollow of the hollow tubular body. In one aspect a welded closed opposite end forms a base configured to substantially block the ingress of moisture external to the hollow tubular body. In another aspect the woven composite thermoplastic material comprises an electrically conductive additive. In another aspect there is a gusset in at least one side of the hollow tubular body. The hollow tubular body is able to be flattened with the respective gussets formed from folds of the hollow tubular body, such that in the flattened state the tube is more readily stored in a narrow form, but is expandable when the gusset is unfolded.