The present disclosure relates more to processes for making a filter element that includes a filter membrane having a strip of thermoplastic polymer material laminated thereto, for example, as a strip along an edge of the filter membrane. For example, one such process includes providing a sheet of filter membrane having a first surface and an opposed second surface; providing a strip of thermoplastic polymer material having a first surface and an opposed second surface; contacting the first surface of the strip of thermoplastic polymer material with the first surface of the filter membrane; and softening the strip of thermoplastic polymer material at at least its first surface by irradiation with laser radiation; such that the softened polymer material of the first surface of the strip of thermoplastic polymer material bonds to the first surface of the filter membrane upon hardening.

A method of bonding a second object to a first object includes: providing the first object having a thermoplastic liquefiable material in a solid state; providing the second object having a surface portion that has a coupling structure with an undercut, so that the second object is capable of making a positive-fit connection with the first object; pressing the second object against the first object with a tool that is in physical contact with a coupling-in structure of the second object while mechanical vibrations are coupled into the tool; continuing to press and couple vibrations into the tool until a flow portion of the thermoplastic material of the first object is liquefied and flows into the coupling structures of the second object; and letting the thermoplastic material re-solidify to yield a positive-fit connection between the first and second objects by the re-solidified flow portion interpenetrating the coupling structures.

Methods of bonding a first object to a second object, including the steps of: providing the second object having a protrusion; providing the first object having a thermoplastic material; positioning the first object relative to the second object such that an assembly of the first and the second object is formed; applying a relative force between the second and first objects and applying mechanical vibration to the assembly of the first and the second object until at least a flow portion of the thermoplastic material becomes flowable and flows around the protrusion; and causing the thermoplastic material to re-solidify. The first object may be a connecting element including a feedthrough, wherein the second object has a corresponding opening. The protrusion may be deformed such that the protrusion has an undercut relative to an axis along which the first and second objects are pressed against each other.

A method of bonding a second object to a first object includes: providing the first object having a thermoplastic liquefiable material in a solid state; providing the second object having a surface portion that has a coupling structure with an undercut, so that the second object is capable of making a positive-fit connection with the first object; pressing the second object against the first object with a tool that is in physical contact with a coupling-in structure of the second object while mechanical vibrations are coupled into the tool; continuing to press and couple vibrations into the tool until a flow portion of the thermoplastic material of the first object is liquefied and flows into the coupling structures of the second object; and letting the thermoplastic material re-solidify to yield a positive-fit connection between the first and second objects by the re-solidified flow portion interpenetrating the coupling structures.

A method of bonding a second object to a first object includes: providing the first object having a thermoplastic liquefiable material in a solid state; providing the second object having a surface portion that has a coupling structure with an undercut, so that the second object is capable of making a positive-fit connection with the first object; pressing the second object against the first object with a tool that is in physical contact with a coupling-in structure of the second object while mechanical vibrations are coupled into the tool; continuing to press and couple vibrations into the tool until a flow portion of the thermoplastic material of the first object is liquefied and flows into the coupling structures of the second object; and letting the thermoplastic material re-solidify to yield a positive-fit connection between the first and second objects by the re-solidified flow portion interpenetrating the coupling structures.

A yarn or thread may include a plurality of substantially aligned filaments, with at least ninety-five percent of a material of the filaments being a thermoplastic polymer material. Various woven textiles and knitted textiles may be formed from the yarn or thread. The woven textiles or knitted textiles may be thermal bonded to other elements to form seams. A strand that is at least partially formed from a thermoplastic polymer material may extend through the seam, and the strand may be thermal bonded at the seam. The woven textiles or knitted textiles may be shaped or molded, incorporated into products, and recycled to form other products.

A yarn or thread may include a plurality of substantially aligned filaments, with at least ninety-five percent of a material of the filaments being a thermoplastic polymer material. Various woven textiles and knitted textiles may be formed from the yarn or thread. The woven textiles or knitted textiles may be thermal bonded to other elements to form seams. A strand that is at least partially formed from a thermoplastic polymer material may extend through the seam, and the strand may be thermal bonded at the seam. The woven textiles or knitted textiles may be shaped or molded, incorporated into products, and recycled to form other products.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip. In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.

In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

A process for welding a first molding to a second molding. The process uses an implement including first and second external surfaces. Each external surface further includes a duct. An end of the first molding is heated by a hot gas while the end is at a distance from the duct-entry plane in the range from 3 mm outside the duct to 10 mm inside the duct. A junction area of the second molding is heated by a hot gas while the junction area is at a distance from the duct-entry plane in a range from 3 mm outside the duct to 10 mm inside the duct. The heated end and the heated junction area are then brought into contact with one another and cooled, forming a weld between the first molding and the second molding. Also disclosed is a welded molding obtainable by the process of the invention.